EP4CGX50CF23C6 - Cyclone IV GX FPGA, 49,888 LEs, 484-BGA | Altera
MPN: EP4CGX50CF23C6 ✓ فعالEP4CGX50CF23C6 نمای کلی
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs/LABs) connected by programmable routing, topped with I/O cells and hard IP such as transceivers, PLLs, and block RAM. FPGAs sit between general-purpose microcontrollers (fixed function, sequential) and ASICs (custom silicon, high NRE) - they deliver hardware parallelism and design-iterability without mask costs. Cyclone IV GX extends the family by adding 3.125 Gbps multi-gigabit transceivers, bridging the gap toward Stratix families.
Key features include 6-input LUT-based logic, 364 18x18 multipliers, 250 MHz maximum operating frequency for the logic fabric, and dedicated hardware for PCI Express Gen1 (x1/x2). The device also integrates a hard memory controller and supports external memory interfaces including DDR2, DDR3, LPDDR2, and QDRII+. Eight 3.125 Gbps transceivers provide high-speed serial connectivity for protocols like PCIe, GbE, CPRI, and Serial RapidIO.
Cyclone IV GX FPGAs are manufactured on a low-power 60 nm process, delivering the Cyclone IV family's hallmark low static and dynamic power. The C6 speed grade places the part in the commercial temperature range (0C to +85C) at a moderate performance tier, suitable for industrial, communications, and consumer equipment where transceivers and DSP throughput are required but not extreme performance.
Typical applications include industrial video and imaging processing, PCIe endpoint expansion cards, low-end wireless baseband signal processing, motor control with encoder interfaces, and broadcast equipment. The 484-BGA package provides ample I/O and signal integrity for high-speed serial designs while remaining manufacturable on standard PCB processes.
When designing with this device, allocate sufficient PCB layers for transceiver routing (typically 6+ layer stack-up), maintain 100-ohm differential impedance on transceiver pairs, and ensure decoupling is placed within the package BGA field. Configuration via JTAG or serial flash should be planned early, and the Quartus II toolchain is required for synthesis, place-and-route, and timing closure.
This page consolidates distributor pricing, drop-in pin-compatible Cyclone IV GX variants, and design considerations not found in the manufacturer datasheet, accelerating part selection for engineers targeting low-cost, transceiver-equipped FPGA designs.
جایگزین‌های drop-in برای EP4CGX50CF23C6 — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای EP4CGX50CF23C6 (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Transceivers, Speed Grade, Mounting Type, Process Technology.
EP4CGX50CF23C7
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP4CGX50CF23C8N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP4CGX50CF23I7N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP4CGX50CF23C6N
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP4CGX50CF23C8
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←EP4CGX50CF23C6 حداکثر مقادیر مجاز و مشخصات الکتریکی
| Series | Cyclone IV GX |
| Family | Cyclone IV GX |
| Logic Elements (LEs) | 49,888 |
| Logic Array Blocks (LABs) | 3,118 |
| Embedded Memory | 2,562,048 bits |
| Maximum User I/Os | 290 |
| Number of Transceivers | 8 (3.125 Gbps) |
| Multiplier Blocks (18x18) | 364 |
| PLLs | 8 |
| Supply Voltage (Core) | 1.2 V |
| دمای کاری | 0C to +85C (commercial) |
| Speed Grade | C6 |
| بسته‌بندی | 484-BGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch |
| نوع نصب | Surface Mount |
| وضعیت RoHS | Compliant |
| Configuration Method | JTAG / Serial / Passive / Fast passive |
پیکربندی پین EP4CGX50CF23C6
| پین A1 | I/O — User I/O bank 3 |
| پین A12 | I/O — User I/O bank 4 |
| پین AC1 | I/O — User I/O bank 5 |
| پین B12 | I/O — User I/O bank 8 |
| پین D5 | REFCLK_0 — Transceiver reference clock input |
| پین D8 | REFCLK_1 — Transceiver reference clock input |
| پین GND | GND — Ground (multiple balls across BGA field) |
| پین VCC | VCCINT — Core 1.2 V supply |
| پین VCCIO1 | VCCIO_1 — I/O bank 1 supply |
| پین VCCIO8 | VCCIO_8 — I/O bank 8 supply |
| پین VCCA | VCCA — PLL analog supply |
| پین VCCPD | VCCPD — Pre-driver supply |
| پین nCONFIG | nCONFIG — Configuration control |
| پین nSTATUS | nSTATUS — Configuration status |
| پین CONF_DONE | CONF_DONE — Configuration done |
| پین TCK | TCK — JTAG clock |
| پین TMS | TMS — JTAG mode select |
| پین TDI | TDI — JTAG data in |
| پین TDO | TDO — JTAG data out |
| پین GXB_TX | GXB_TX[7:0] — Transceiver transmit (8 channels) |
کاربردهای معمول
EP4CGX50CF23C6 مناسب است برای 6 کاربردs: PCIe Gen1 Endpoint Expansion, Industrial Video Processing, Wireless Baseband Signal Processing, Motor Control with Encoder Feedback, Broadcast and Audio Processing Equipment, Cost-Optimized Communications Backplane.
PCIe Gen1 Endpoint Expansion
The EP4CGX50CF23C6 is well-suited for PCIe Gen1 endpoint designs because it integrates a hard PCIe Gen1 controller plus 8 transceivers capable of 3.125 Gbps, eliminating the need for an external PHY. With 49,888 logic elements and 364 18x18 multipliers, the fabric provides ample room for protocol stack, DMA engines, and application logic. Engineers typically pair it with downstream companion chips (EEPROM for configuration, flash for data) on a standard 4-lane PCIe add-in card layout.
پیشنهادی
Industrial Video Processing
The EP4CGX50CF23C6 supports real-time video pipeline processing with its 364 18x18 hardware multipliers enabling DSP blocks for filtering, scaling, and color-space conversion at typical video rates (1080p60). The 2,562,048 bits of embedded block RAM buffers line buffers and frame statistics, while 290 user I/Os accommodate parallel video buses (BT.1120, RGB/YCbCr) plus camera interfaces. The commercial temperature range (0C to +85C) and low-power 60 nm process suit factory-floor and broadcast equipment environments.
پیشنهادی
Wireless Baseband Signal Processing
The EP4CGX50CF23C6 delivers moderate DSP throughput for low-end wireless baseband signal processing such as small-cell, femtocell, or CPRI front-haul aggregation. The 3.125 Gbps transceivers connect to RF front-ends or CPRI links, while the 49,888 logic elements plus 364 multipliers handle channelization, FFT/iFFT, and digital up/down conversion. The Cyclone IV GX low-power architecture suits thermally constrained outdoor radio units.
پیشنهادی
Motor Control with Encoder Feedback
The EP4CGX50CF23C6 provides deterministic hardware parallelism for multi-axis motor control loops, with its 364 hardware multipliers supporting field-oriented control (FOC) algorithms and SVPWM modulation. Eight PLLs generate independent timing domains for encoder sampling (QEI), PWM switching frequencies, and ADC synchronization. Industrial designers benefit from the 290 user I/Os to interface with multiple servo drives, encoder ports, and isolated gate-driver feedback on a single chip.
پیشنهادی
Broadcast and Audio Processing Equipment
The EP4CGX50CF23C6 fits broadcast routers, audio mixers, and digital signal processors with its combination of embedded memory (2.5 Mb) for FIFO buffering and 290 I/Os for multi-channel AES/EBU, MADI, or Dante audio interfaces. The integrated transceivers support MADI coaxial links at 3.125 Gbps, while the fabric implements custom audio routing, sample-rate conversion, and effects processing. Commercial temperature operation and reliable Altera Cyclone IV GX supply continuity suit pro-audio product lifecycles.
پیشنهادی
Cost-Optimized Communications Backplane
The EP4CGX50CF23C6 suits communications backplane line cards where 8 transceivers provide SERDES connectivity to switches or FPGAs on neighbouring cards, and 49,888 logic elements handle packet processing, queuing, and aggregation. The 484-BGA package is compatible with standard backplane PCB stack-ups, and the C6 speed grade balances throughput against power for line-card thermal budgets. Compared to the EP4CGX110CF23C7 (109K LEs), this part saves cost when the fabric requirement stays under ~50K LEs.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای EP4CGX50CF23C6 — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | EP4CGX50CF23C7 | EP4CGX50CF23C8N | EP4CGX50CF23I7N |
|---|---|---|---|---|
| Package | 484-BGA (FBGA-484, F23) | 484-BGA (FBGA-484, F23) - same | 484-BGA (FBGA-484, F23) - same | 484-BGA (FBGA-484, F23) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 |
| Speed Grade | C6 | C7 (faster) | C8 (fastest) | I7 (industrial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lead-Free (Pb-free) | No (non-N suffix) | No | Yes (N suffix) | Yes (N suffix) |
| Transceivers (3.125 Gbps) | 8 | 8 | 8 | 8 |
| User I/Os | 290 | 290 | 290 | 290 |
| Embedded Memory | 2,562,048 bits | 2,562,048 bits | 2,562,048 bits | 2,562,048 bits |
تفاوت‌های کلیدی
- Integrated 3.125 Gbps transceivers at low cost (در مقابلEP4CE40F23C8 (Cyclone IV E, no transceivers))
- Moderate speed grade C6 balances performance and cost (در مقابلEP4CGX50CF23C7 (C7 speed grade))
- Same F23 footprint across C6/C7/C8 speed grades (در مقابلEP4CGX50CF23I7N (industrial temperature))
یادداشت‌های طراحی
The 484-BGA package has a 1.0 mm ball pitch on a 23 x 23 mm body, which requires at least a 6-layer PCB stack-up with microvia-in-pad or standard via structures for reliable assembly. Use 100-ohm differential impedance for the 8 transceiver pairs (GXB_RX/GXB_TX) and 50-ohm single-ended for clock and GPIO. Place decoupling capacitors directly under the BGA field on the opposite side, and ensure continuous ground planes under the entire transceiver region to maintain signal integrity at 3.125 Gbps.
Estimated: at maximum logic utilization with all 8 transceivers active at 3.125 Gbps, the EP4CGX50CF23C6 dissipates approximately 3-4 W of dynamic power. With the FBGA-484 thermal resistance theta_JA of approximately 18-22 C/W on a JEDEC 4-layer test board, junction temperature rise above ambient is roughly 70-90 C. Adequate airflow or thermal vias beneath the package thermal pad (center balls) is required for designs without a heatsink.
Common pitfalls when designing with the EP4CGX50CF23C6: (1) forgetting that the C6 suffix indicates commercial temperature and a moderate speed grade - do not assume C6 timing in industrial-grade deployments; (2) confusing the F23 package (484-BGA) with the F27 package (672-BGA) - the F27 EP4CGX50DF27C7 is NOT a drop-in and requires PCB redesign; (3) omitting the MSL 3 moisture-sensitive-device bake-out before reflow assembly of the BGA; (4) leaving JTAG pins floating - TCK, TMS, TDI, TDO must be pulled per the configuration user guide to avoid in-system programming errors.
Route the 8 transceiver channels as length-matched differential pairs with continuous reference planes and minimal via transitions. Keep the REFCLK_0/REFCLK_1 reference clock traces short and isolated from switching signals. According to the Cyclone IV GX handbook, transceiver channels must be assigned to specific GXB banks - verify the channel-to-ball mapping in the F23 pin table before locking the schematic. Configuration pins (nCONFIG, nSTATUS, CONF_DONE) should be brought out to test points for factory programming and debug.
اطلاعات انطباق
RoHS and REACH compliant per Altera/Intel product page. AEC-Q100 not applicable - FPGAs are not automotive-grade qualified unless explicitly designated. Lead-free (Pb-free) variants require the N suffix (e.g. EP4CGX50CF23C6N, EP4CGX50CF23C8N); the base EP4CGX50CF23C6 is non-N. Halogen-free status unknown from the provided data.
