FDMF6704 - High-Frequency DrMOS Module | onsemi
MPN: FDMF6704 ✗ پایان تولیدFDMF6704 نمای کلی
A DrMOS module is a semiconductor power stage that integrates a high-side MOSFET, low-side MOSFET, and associated gate driver. It belongs to the power-management IC hierarchy and is used inside synchronous DC-DC converters. Compared with a discrete MOSFET layout, the integrated module can shorten gate-drive paths, reduce assembly count, and simplify high-frequency power-stage design. Its synchronous topology alternately uses the high-side and low-side MOSFETs to transfer energy during different switching phases.
The FDMF6704 is identified as the extra-small, high-performance, high-frequency member of the XS DrMOS family. Verified source material states that its 6 mm MLP format provides 44% space saving compared with a conventional 8 mm by 8 mm MLP DrMOS package. That dimensional reduction is especially useful where converter area, current density, or placement beside processors and memory is important. The integrated driver is controlled by a single PWM signal, reducing control-interface complexity.
The module is suited to compact synchronous buck solutions operating at elevated switching frequencies. Its integration can make high-frequency layouts more repeatable because the high-side driver, low-side driver, and power devices are packaged together. Nonetheless, PCB design remains critical: switching-node copper must be minimized, power and ground paths must be short, and the package requires adequate thermal spreading. Proximity to sensitive input, clock, or communication circuitry should be avoided to limit switching-node coupling.
Typical uses include computing power rails, notebook and mobile equipment, telecommunications supplies, networking systems, and other compact converters requiring substantial current from a small power stage. FDMF6704 is also useful when redesigning an existing discrete half-bridge around an integrated DrMOS footprint. Exact electrical ratings must be taken from the manufacturer datasheet and validated against the target converter’s voltage, current, switching frequency, thermal environment, and layout.
A principal design consideration is that integration does not eliminate thermal or layout constraints. The 6 mm by 6 mm MLP concentrates a complete switching stage into a compact area, making exposed-pad heat transfer, current-loop minimization, and controlled switching transients central to reliable operation. Designers should use the datasheet’s recommended land pattern, pin definitions, capacitance values, and layout guidance rather than treating the package like an unrelated generic power module.
This page consolidates the verified source information, identifies the FDMF6704’s DrMOS role and physical format, and separates documented facts from electrical parameters that still require manufacturer-data confirmation. It also records the absence of a verified drop-in substitute list, avoiding unsupported compatibility claims while providing practical procurement and design context.
جایگزین‌های drop-in برای FDMF6704 — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
هیچ جایگزین مستقیمی برای این محصول موجود نیست.
درخواست جایگزینFDMF6704 حداکثر مقادیر مجاز و مشخصات الکتریکی
| Product Type | Integrated high-side and low-side DrMOS power-stage module |
| توپولوژی | Half-bridge synchronous buck converter power stage |
| Control Input | 1 PWM input |
| Package Type | 40-pin MLP |
| Package Dimensions | 6 mm x 6 mm |
| Package Pin Count | 40 pins |
| نوع نصب | Surface mount |
| Space Saving | 44% versus an 8 mm x 8 mm conventional MLP DrMOS package |
| High-Side Device | Integrated MOSFET |
| Low-Side Device | Integrated MOSFET |
| Gate Driver | Integrated high-side and low-side driver |
راهنمای پیکربندی پین FDMF6704 40 pins
پیکربندی پین برای FDMF6704 (پکیج 40 pins). این قطعه قدرت دارای پایانه‌های گیت، درین و سورس است. برای پکیج‌های غیرقطبی، برای جهت دقیق پین ۱ و جزئیات فوت‌پرینت به دیتاشیت سازنده مراجعه کنید. کاربردهای رایج شامل طراحی منبع تغذیه، درایو موتور و سوئیچینگ بار است.
داده پین‌آوت تفصیلی موجود نیست برای FDMF6704.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
FDMF6704 مناسب است برای 6 کاربردs: Compact Computing Power Rails, Notebook and Portable Equipment, Networking and Telecommunications Supplies, High-Current DC-DC Power Conversion, Servers and Storage Systems, Industrial Embedded Systems.
Compact Computing Power Rails
The FDMF6704 suits compact synchronous buck stages placed near processors, memory, or other high-current digital loads. Its verified 6 mm by 6 mm DrMOS package saves 44% of the stated conventional 8 mm package footprint, allowing the power stage to be placed more closely to the load. The integrated high-side and low-side MOSFETs and one-PWM control simplify the stage, but voltage, current, switching-frequency, and thermal ratings must be confirmed from the manufacturer datasheet before use.
Notebook and Portable Equipment
FDMF6704 is relevant to space-constrained notebook and portable-equipment converters because its integrated DrMOS occupies a 6 mm by 6 mm MLP area. One PWM command drives the integrated high-side and low-side gate drivers, reducing discrete driver circuitry and helping shorten the power-stage implementation. Designers must maintain very tight input, phase, ground, and output connections while following the recommended capacitor and exposed-pad land pattern.
Networking and Telecommunications Supplies
The FDMF6704 can support compact high-frequency synchronous buck stages in networking and telecommunications equipment where board area and switching performance are important. Integrating the MOSFETs and drivers into one module reduces the number of separate power-stage components and makes placement beside a load rail more practical. The converter still requires careful high-current layout, controlled switching-node geometry, thermal spreading, and exact operating-limit checks.
High-Current DC-DC Power Conversion
The FDMF6704 is designed as the switching power stage of a synchronous buck converter, where the high-side and low-side MOSFETs alternately support energy transfer. Its single PWM interface simplifies controller integration, while the 40-pin MLP consolidates the driver and power devices in a compact footprint. Actual current capability must not be inferred from package size; it must be verified for the intended input voltage, duty cycle, switching rate, and cooling arrangement.
Servers and Storage Systems
A DrMOS module such as FDMF6704 can reduce the physical extent of a high-frequency buck stage in a dense server or storage power system. Its verified 44% space-saving claim makes placement close to high-current rails more practical, while integration reduces the number of discrete gate-drive and power-device assemblies. System designers must still verify converter stability, transient response, heat flow, remote sensing, and fault behavior against the complete application requirements.
Industrial Embedded Systems
FDMF6704 may be used in a compact embedded DC-DC stage when the controller can drive a single PWM input and the datasheet operating limits suit the industrial environment. Its integrated half-bridge reduces external component count, but the compact package demands careful ground partitioning and exposed-pad thermal design. Confirm electromagnetic-emissions margins, ambient-temperature limits, transient tolerance, and converter-loop stability before production release.
داده‌های مرجع مهندسی برای FDMF6704 — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول |
|---|---|
| Package | 40-pin MLP, 6 mm x 6 mm |
| Brand | onsemi |
| Product Type | Integrated DrMOS half-bridge module |
| High-Side Device | Integrated MOSFET |
| Low-Side Device | Integrated MOSFET |
| Control Interface | 1 PWM input |
| Converter Topology | Synchronous buck converter power stage |
| Verified Space Saving | 44% versus an 8 mm x 8 mm conventional MLP DrMOS package |
تفاوت‌های کلیدی
- Compact integrated switching stage (در مقابلDiscrete high-side and low-side MOSFET implementation)
- Documented footprint reduction (در مقابلConventional 8 mm x 8 mm MLP DrMOS package)
- Simplified controller connection (در مقابلExternally controlled discrete half-bridge)
یادداشت‌های طراحی
Treat the phase or switching node as a compact, high-dv/dt net. Follow the onsemi recommended land pattern and keep PH, PVCC, PGND, input, output, and exposed-pad connections short and wide where their current duties require it. Place required capacitors at their datasheet locations rather than at convenient but electrically distant positions; excessive loop inductance can distort switching edges, increase losses, and intensify EMI.
Use the package’s designated exposed thermal interface and manufacturer PCB recommendations to spread heat into both internal and bottom-side copper. Evaluate conduction and switching losses at the actual input voltage, output current, duty cycle, and switching frequency. Because those electrical limits and thermal resistance are absent from the supplied extracts, do not calculate an approved current rating without the complete onsemi datasheet.
A matching MLP package does not prove that another DrMOS is pin-to-pin compatible. Check pin numbering, exposed-pad connections, PWM polarity, bootstrap requirements, voltage limits, timing, current capability, thermal performance, and land-pattern tolerances. Many low-frequency module listings can be physically similar while remaining unsuitable for the intended high-frequency converter.
اطلاعات انطباق
The supplied verified results do not state FDMF6704 compliance status. No environmental or automotive qualification claim has been inferred.
