LFE2-6E-6FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice
MPN: LFE2-6E-6FN256I ✓ فعالLFE2-6E-6FN256I نمای کلی
An FPGA is a programmable semiconductor containing configurable logic blocks, programmable interconnect, and I/O resources. Within the product hierarchy, the LFE2-6E-6FN256I is an FPGA, a member of the Lattice ECP2 family, and an example of a programmable logic device used for parallel processing, control, interface bridging, and embedded signal-processing functions. Its 750 LABs organize the available logic into flexible blocks, while the 190 I/O provide connections between the programmable core and external circuitry.
Key features include 6,000 logic cells, 56,320 embedded RAM bits, 190 user I/O, and a 1.14 V to 1.26 V core-supply range. The package is a 17 mm by 17 mm, lead-free FPBGA-256. The “6” speed designation and the “-6” ordering code identify the performance grade, while the trailing “I” identifies the industrial temperature option. The 256-ball package supports dense routing for designs requiring numerous external connections.
The ECP2 architecture combines programmable logic with embedded block RAM for designs requiring both control logic and local data storage. A 357 MHz maximum frequency is reported in the supplied component listing, making timing closure an important consideration for clocked datapaths. Because this device belongs to a mature FPGA family, engineers can use its configuration ecosystem and established design flows rather than developing fixed application-specific logic.
Typical uses include industrial control and automation, communication interfaces, test and measurement equipment, embedded video or display control, and peripheral expansion for microcontrollers or processors. The 190 I/O are useful for parallel buses, status and control signals, and multi-bit data interfaces, while the embedded RAM can support buffers, packet processing, or state-holding functions.
PCB design requires careful BGA fanout, differential-pair routing, ground-plane continuity, and decoupling around the 1.2 V supply rails. Designers should obtain the manufacturer pinout and power-decoupling guidance before routing the 256-ball footprint. Configuration programming and signal-integrity verification should also be included in the design plan rather than treated as late board-layout steps.
This page consolidates the verified device specifications, current distributor information, package details, and same-family drop-in alternatives. It also adds application guidance and engineering checks that are not presented as a single manufacturer-datasheet conclusion, helping teams compare speed grades, temperature options, and package-compatible alternatives before committing to a PCB design.
جایگزین‌های drop-in برای LFE2-6E-6FN256I — همان پکیج، سازگار پین‌به‌پین. قطعات با پکیج متفاوت که نیاز به تغییر PCB دارند مستثنی هستند.
گونه‌ها در این سری
مدل‌های هم‌سری که جایگزین مستقیم هستند برای LFE2-6E-6FN256I (همان فرم‌فاکتور و فوت‌پرینت) — متفاوت در Package, Device Type, Package Type, Core Supply Voltage, Logic Cells.
LFE2-6SE-6FN256I
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
LFE2-6E-6F256C
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←LFE2-6E-5F256I
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←LFE2-6E-5FN256C
✅ جایگزین مستقیم📋 جایگزین مرجع (خارج از کاتالوگ)
LFE2-6E-7F256C
✅ جایگزین مستقیمبرای قیمت تماس بگیرید
مشاهده دیتاشیت ←LFE2-6E-6FN256I حداکثر مقادیر مجاز و مشخصات الکتریکی
| Device Type | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Cells | 6,000 cells |
| Logic Blocks | 750 LABs |
| Embedded RAM | 56,320 bits (67 KB) |
| User I/O | 190 I/O |
| Maximum Frequency | 357 MHz |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Nominal Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| دمای کاری | -40°C to +100°C |
| Temperature Grade | Industrial |
| بسته‌بندی | 256-ball FBGA, 17 mm × 17 mm |
| Package Code | FPBGA-256 |
| نوع نصب | Surface Mount |
| Terminal Type | Ball |
| Number of Terminals | 256 balls |
| Package Shape | Square |
| Lead-Free Status | Lead free |
| Standard Packaging | Tray |
| Standard Quantity | 90 units |
راهنمای پیکربندی پین LFE2-6E-6FN256I square
پیکربندی پین برای LFE2-6E-6FN256I (پکیج square). این IC دیجیتال شامل GPIO، رابط‌های ارتباطی (UART، SPI، I2C) و پین‌های تغذیه است. برای عملکردهای جایگزین پین و گزینه‌های پیکربندی به دیتاشیت سازنده مراجعه کنید. ضروری برای طراحی سیستم‌های نهفته و چیدمان PCB.
داده پین‌آوت تفصیلی موجود نیست برای LFE2-6E-6FN256I.
به دیتاشیت برای پیکربندی کامل پین‌ها.
کاربردهای معمول
LFE2-6E-6FN256I مناسب است برای 6 کاربردs: Industrial Control and Automation, Communication Interface Aggregation, Test and Measurement Instrumentation, Embedded Video and Display Control, Peripheral Expansion for Processors, USB, Network, and Storage Adapters.
Industrial Control and Automation
The LFE2-6E-6FN256I fits industrial controllers that combine parallel machine control with buffered local data handling. Its 6,000 logic cells and 750 LABs provide programmable capacity for sequencing, state machines, interlocks, and communications formatting, while 56,320 RAM bits can hold counters, traces, and packet data. The 190 I/O support sensors, actuators, encoders, and bus signals without relying on fixed logic. Operating across -40°C to +100°C suits industrial equipment, and the reported 357 MHz maximum frequency provides timing headroom for parallel control paths. The principal trade-off is BGA implementation complexity: engineers must maintain a continuous low-impedance 1.2 V supply, use manufacturer-recommended decoupling, and verify all timing with post-route analysis.
پیشنهادی
Communication Interface Aggregation
The LFE2-6E-6FN256I can act as a protocol aggregator, parallel-to-serial bridge, or test interface when several low-speed interfaces must be coordinated. The 190 I/O are valuable for parallel buses, chip selects, and control signals, while the embedded 56,320 RAM bits can implement FIFO behavior, packet buffering, or test-result storage. Its 357 MHz reported maximum frequency supports synchronous interface logic operating below that ceiling with design-specific margin. Because the ECP2 device uses a 1.14 V to 1.26 V core supply, the board must distribute that rail cleanly and account for configuration startup. Timing closure, signal integrity, and protocol-specific test vectors remain more important than the headline cell count when selecting this part for communications equipment.
پیشنهادی
Test and Measurement Instrumentation
The LFE2-6E-6FN256I is appropriate for programmable test systems that coordinate sequencing, pattern generation, result capture, and operator interfaces. Its 6,000 logic cells and 750 LABs can implement control state machines, while the 56,320 RAM bits provide local storage for patterns or captured samples. With 190 I/O, the FPGA can connect test channels, status lines, trigger signals, and front-panel controls. The -40°C to +100°C industrial range supports controlled laboratory and manufacturing environments, and the reported 357 MHz frequency can support pipelined acquisition logic. For high-speed analog or digital instrumentation, designers should separately verify transceiver performance, clock jitter, and channel timing because the supplied data does not establish those parameters for the FPGA itself.
پیشنهادی
Embedded Video and Display Control
The LFE2-6E-6FN256I can implement video timing, pixel formatting, overlay generation, and display-control logic in compact embedded systems. Its 190 I/O are useful for parallel pixel or control buses, and the 56,320 RAM bits can support line buffers, frame counters, and interface state. The programmable logic allows product-specific timing to be changed without replacing a fixed display controller. The -40°C to +100°C operating range supports industrial panels and vehicle-adjacent equipment where temperature variation is relevant. Designers must account for the limited on-chip memory, external memory interface requirements where applicable, and the complexity of routing a high-pin-count 256-ball FBGA. Video clocking and output timing should be validated with the actual source, connector, and panel rather than inferred from the FPGA’s maximum frequency.
پیشنهادی
Peripheral Expansion for Processors
The LFE2-6E-6FN256I is useful as a programmable peripheral beside a microcontroller or application processor, particularly where legacy parallel buses, custom protocols, or multiple timing domains must be supported. Its 6,000 logic cells can implement bus masters, arbiters, data movers, and protocol converters, while the 56,320 RAM bits provide double buffers and FIFO structures. The 190 I/O offer considerably more external connectivity than typical small microcontrollers. The reported 357 MHz maximum frequency supports demanding synchronous logic, but the -6 grade must still be checked against the actual timing budget. Integration also requires configuration storage, clocking, reset coordination, and a properly decoupled 1.2 V supply. This arrangement trades BOM complexity for adaptable hardware and rapid field updates.
پیشنهادی
USB, Network, and Storage Adapters
The LFE2-6E-6FN256I can implement protocol adapters, data routers, and storage or network interface controllers where flexible logic is more valuable than fixed silicon. Its 56,320 RAM bits can support packet buffering and control structures, while 190 I/O allow parallel buses to be consolidated into serial interfaces. The -6 speed grade and reported 357 MHz maximum frequency are useful for synchronous data movement, although sustained throughput depends on memory, I/O, and clocking. A production design should define configuration boot behavior, verify interface timing, and account for the ECP2 toolchain and third-party IP compatibility. Compared with a dedicated USB or network controller, the FPGA provides adaptability but increases firmware, verification, and board-level power-management effort.
پیشنهادی
خلاصه محصولات پیشنهادی
داده‌های مرجع مهندسی برای LFE2-6E-6FN256I — مقایسه، راهنمای طراحی و اطلاعات انطباق.
راهنمای انتخاب
مقایسه با جایگزین‌ها
| پارامتر | این محصول | LFE2-6SE-6FN256I | LFE2-6E-6F256C | LFE2-6E-5F256I | LFE2-6E-5FN256C | LFE2-6E-7F256C |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-ball FBGA, 17 mm × 17 mm | 256-ball FBGA | 256-ball FBGA | 256-ball FBGA | 256-ball FBGA | 256-ball FBGA |
| Logic Cells | 6,000 cells | 6,000 cells | 6,000 cells | 6,000 cells | 6,000 cells | 6,000 cells |
| Speed Grade | -6 | -6 | -6 | -5 | -5 | -7 |
| Temperature Grade | Industrial, -40°C to +100°C | Industrial | Commercial | Industrial | Commercial | Commercial |
تفاوت‌های کلیدی
- Verified industrial temperature coverage (در مقابلLFE2-6E-6F256C)
- Higher speed grade than the -5 alternatives (در مقابلLFE2-6E-5F256I and LFE2-6E-5FN256C)
- 190 I/O in a 256-ball FBGA (در مقابلLFE2-6E-7F256C)
یادداشت‌های طراحی
Treat the 1.2 V core as a high-speed digital rail. The verified operating range is 1.14 V to 1.26 V, but the permitted range does not establish usable ripple or transient tolerance. Follow the manufacturer’s recommended capacitor values and placement, provide a continuous ground reference beneath the device, and verify the supply at the power pins under maximum clock activity. Configuration, clock, and I/O power requirements are not present in the supplied excerpts and must be obtained from the ECP2 datasheet before schematic release.
A 256-ball FBGA requires controlled escape routing and careful via placement. Follow the manufacturer’s recommended footprint and layer-transition geometry exactly, maintain short connections from the BGA balls to bypass capacitors, and avoid placing test points or split planes beneath signal escape paths. The supplied data confirms the 17 mm × 17 mm package but does not provide the complete ball map or stack-up guidance, so the official package drawing and PCB-library dimensions are mandatory references.
Do not infer signal-integrity performance from the 357 MHz headline frequency. Route clocks as controlled-impedance nets, minimize stub branches, provide solid return paths, and budget external memory and transceiver timing in the same clock domain. The 190 I/O provide extensive routing flexibility but also increase simultaneous-switching-noise risk. Run post-route timing and signal-integrity simulations with actual trace lengths, layer stack-up, connectors, and loading before releasing the PCB.
Avoid selecting a lower-speed or commercial-temperature ECP2 solely because its package matches. The LFE2-6E-6FN256I combines the -6 speed grade with an industrial -40°C to +100°C range. Replacing it with -5 or -7 parts can alter timing margins, while changing the final suffix to C can reduce temperature coverage. Check the complete ordering code, verify the pinout and configuration pins, and rerun synthesis, placement, timing, and I/O tests for every substitution.
اطلاعات انطباق
The verified component listings identify the device as lead free. The supplied data does not explicitly verify RoHS, REACH, halogen-free, conflict-minerals, or automotive qualification status. AEC-Q100 is not applicable because the device is an FPGA rather than an automotive-qualified power semiconductor.
