FPGA & CPLD
Produits (6666)
EP2S30F672C5 - Stratix II FPGA, 33,880 LE, 672-FBGA | Intel
The Intel (formerly Altera) EP2S30F672C5 is a Stratix II family Field Programmable Gate Array (FPGA) delivering 33,880 logic elements, 1,369,728 RAM bits, and 500 user I/Os in a 672-pin flip-chip BGA (FC-FBGA) package. The device is built on a 90 nm CMOS process and targets mid-density, high-performance logic, DSP, and memory-intensive applications at clock rates up to 609.76 MHz with a 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (LABs), embedded memory blocks, DSP blocks, and programmable interconnect into a single silicon fabric. FPGAs sit in the broader hierarchy of programmable logic: CPLD (smaller, non-volatile, lower density) -> FPGA (large, volatile, high-density) -> SoC FPGA (FPGA fabric + hard CPU cores). They are widely used as hardware accelerators, glue logic, and prototyping platforms across wired communications, industrial, and test & measurement segments. Key features of the EP2S30F672C5 include 1,694 Logic Array Blocks (LABs), 12 embedded DSP blocks for high-speed multiply-accumulate operations, and Stratix II's signature adaptive logic modules (ALMs) that give finer-grained resource utilization than the older 4-input LUT architecture. The device supports external memory interfaces including DDR, DDR2, QDR, and RLDRAM via dedicated PHY circuits, and offers high-speed serial I/O blocks for 1 Gbps+ LVDS and SERDES connectivity. The architecture implements TriMatrix embedded memory totaling 1,369,728 RAM bits, distributed across three block sizes (M512, M4K, M-RAM) for flexible FIFO and lookup-table implementations. The 90 nm process and 1.2 V core keep dynamic power within FPGA norms for the era, while the speed grade 5 (-C5) indicates a moderate-speed bin suitable for commercial-grade designs operating at 0 to 85C junction temperature. Typical applications include high-speed digital signal processing, telecom line-card glue logic, video and image processing pipelines, network protocol bridging, ASIC prototyping, and high-throughput data acquisition. Designers use the EP2S30F672C5 when they need more logic density than a CPLD but do not require the higher cost of Stratix IV/V parts. When designing with this device, ensure proper power-plane decoupling (multiple bulk + ceramic caps near every VCC/VCCIO island), follow Altera's pinout guidelines for the 672-FBGA flip-chip package, and use Quartus II design software for synthesis, place-and-route, and timing closure. Plan board layout with controlled-impedance traces for high-speed serial links. This page synthesizes distributor pricing, drop-in package-compatible alternatives from the same Stratix II family, and practical design considerations not found in the manufacturer datasheet.
EP2S30F672C5N - Stratix II FPGA 30K LE FBGA-672 | Intel
The Intel (formerly Altera) EP2S30F672C5N is a member of the Stratix II family of high-performance FPGAs, featuring 33,880 logic elements (approximately 30K equivalent), 1,369,728 bits of embedded memory, and 1694 LABs (Logic Array Blocks) packaged in a 672-ball FineLine BGA with 500 user I/O pins. It is fabricated on a 90 nm process and targets high-density, high-performance applications such as DSP, communications, and ASIC prototyping. An FPGA (Field Programmable Gate Array) is a semiconductor device containing programmable logic blocks, configurable interconnect, and programmable I/O that allows engineers to implement custom digital circuits after manufacturing. Stratix II devices introduced the innovative Adaptive Logic Module (ALM) architecture, which provides finer-grained logic utilization than traditional 4-input LUT designs, achieving up to twice the logic density per area. This places Stratix II FPGAs in the broader hierarchy of programmable logic devices: PLD -> CPLD/FPGA -> high-performance FPGA with embedded transceivers and DSP blocks. Key features of the EP2S30F672C5N include up to 16 global clock networks, dedicated multiplier blocks for high-speed DSP, TriMatrix embedded memory (M512, M4K, M-RAM blocks), and support for external memory interfaces including DDR, DDR2, SDRAM, QDRII, and RLDRAM II. The device also includes 4 phase-locked loops (PLLs) for clock management and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The C5 speed grade designation indicates a specific timing closure for the -5 commercial speed grade, while the F672 package refers to a 672-ball FineLine BGA. The 'N' suffix indicates lead-free / RoHS-compliant lead finish. The Stratix II family provides a balanced combination of logic, memory, and DSP resources, making it suitable for high-throughput parallel processing tasks. Typical applications include high-end DSP and image processing, ASIC prototyping and emulation, high-speed serial protocol bridging, telecommunications infrastructure, and military/aerospace signal processing. The wide I/O count and high memory bandwidth also make it suitable for test and measurement equipment where parallel data acquisition and real-time processing are required. When designing with this device, pay close attention to power distribution and decoupling on the BGA package, as well as signal integrity for high-speed differential pairs. Designers should use the Quartus II development environment (legacy versions support Stratix II) for synthesis, place-and-route, and timing analysis. For new designs, consider newer Cyclone, Arria, or Stratix families as Stratix II is now a legacy device family.
EP2S30F672C5NGC - Stratix II 33,880 LC FPGA, 672-BGA | Intel
The Intel EP2S30F672C5NGC is a member of the Stratix II family of FPGAs, delivering 33,880 logic elements, 1,369,728 bits of embedded RAM, and 500 maximum user I/Os in a 672-ball FC-FBGA package. It is fabricated on a 90 nm process technology and operates from a 1.2 V core supply, with internal performance reaching up to 609.76 MHz. The 672-pin FC-FBGA package uses Intel's lead-free FC-FBGA construction suitable for high-density board layouts. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all interconnected by a hierarchical routing fabric. FPGAs sit within the broader taxonomy of programmable logic devices (PLD) -> programmable logic -> logic semiconductors -> integrated circuits. The Stratix II family is positioned in Intel's (formerly Altera's) high-performance, logic-rich FPGA tier, optimized for ASIC prototyping, telecom bridging, and high-speed digital signal processing. Key features of the EP2S30F672C5NGC include 64 dedicated 18x18 hardware multipliers for DSP workloads, 1,337.6 Kbits of distributed RAM, adaptive logic modules (ALMs) that are twice as dense as the prior Stratix ALM architecture, and support for external memory interfaces including DDR, DDR2, SDRAM, QDRII, and RLDRAM. The -C5 speed grade positions this device in the mid-speed bin of the family, balancing timing closure headroom against maximum Fmax. Typical applications include 32/64-bit PCI-X bus master/target interfaces running at 66/100/133 MHz, high-throughput DSP pipelines, ASIC prototyping, and high-speed serial protocol bridging. The 500 user I/O count and large on-chip memory make the EP2S30 well suited for data-path centric designs where both logic density and memory bandwidth matter. When integrating this part, plan the power sequencing for the 1.2 V core and auxiliary supplies, and review the FC-FBGA PCB layout guidelines for the 672-ball footprint to ensure signal-integrity on the DDR2 memory interface. Designers should also confirm Quartus II version support and the latest service pack before committing to a design. This page synthesizes distributor pricing, drop-in FPGA alternatives within the Stratix II family, and practical design guidance not found in the manufacturer datasheet alone.
EP2S30F672C5NRB - Stratix II FPGA 33.8K LE 500 I/O 672-FBGA | Intel
The Intel (formerly Altera) EP2S30F672C5NRB is a member of the Stratix II family of field-programmable gate arrays (FPGAs), featuring 33,880 logic elements in a 672-ball FineLine BGA (27 mm x 27 mm) package with 500 user I/O pins. It is built on a 1.2 V core, 90 nm process technology and is supplied in a commercial temperature grade of 0 C to 85 C. The suffix 'NRB' in the MPN denotes a RoHS-compliant tray packaging variant. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers that can be re-programmed by the customer after manufacture. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs) in the design flexibility vs. performance trade-off, making them ideal for prototyping, low-volume production, and designs requiring hardware-level parallelism. The Stratix II family was Intel/Altera's second-generation high-performance FPGA, succeeding the original Stratix and adding adaptive logic modules (ALMs). Key features of the EP2S30F672C5NRB include 1,694 LABs/CLBs, 33,880 total logic elements, embedded memory, DSP blocks for high-throughput arithmetic, and high-speed I/O support. The 672-FBGA package exposes up to 500 user I/O, allowing integration with DDR/DDR2 memory, LVDS links, and parallel high-speed buses. The device operates from a 1.15 V to 1.25 V core supply and supports configuration via passive serial, fast passive parallel, or JTAG. Architecturally, the Stratix II device family is built on a 90 nm SRAM process with embedded memory, TriMatrix memory blocks, and dedicated DSP blocks capable of 9-bit, 18-bit, and 36-bit arithmetic at hundreds of MHz. The ALM (Adaptive Logic Module) architecture combines features of LUT-based and product-term-based logic, giving 1.4x the typical logic capacity of competing architectures of the same size. High-speed I/O support includes LVDS, LVPECL, and DDR memory interfaces. Typical applications include high-speed digital signal processing (DSP), telecommunications line cards, video processing pipelines, military/aerospace secure communications, and ASIC prototyping. The 500 I/O count makes it especially suitable for memory-intensive and bus-intensive designs that require many concurrent external connections. When designing with this part, note that configuration data must be loaded from an external flash or download cable on every power-up, as the SRAM-based configuration is volatile. Use the Quartus II design software for synthesis, place-and-route, and timing closure. The 672-BGA package requires careful PCB layout with matched-length traces and proper thermal management. This page synthesizes distributor pricing, parametric alternatives, and engineering guidance for the EP2S30F672C5NRB not found in the manufacturer datasheet alone.
EP2S30F672I4 - Stratix II FPGA, 33.88K LE, 672-BGA | Intel / Altera
The Intel / Altera EP2S30F672I4 is a high-density Stratix II Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, offering 33,880 logic elements, 1,694 Logic Array Blocks (LABs), 500 user I/Os, and 1,369,728 bits of embedded memory in a 672-ball FineLine BGA (FBGA) package. Housed in a 35 x 35 mm PBGA672 with 1 mm pitch, the device operates across the industrial temperature range (-40C to +100C) and integrates up to 12 embedded DSP blocks along with 6 phase-locked loops, providing a flexible compute fabric for high-throughput signal processing and ASIC prototyping workloads. According to Altera's official Stratix II datasheet, the device supports multi-gigabit transceivers via external PHYs and offers ALM-based logic architecture for higher performance per logic element versus the prior Stratix generation. The EP2S30F672I4 is a member of the Stratix II family - a 90 nm, 1.2 V core FPGA line with on-chip RAM blocks, TriMatrix memory, and dedicated multiplier/DSP blocks for DSP-intensive designs. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that lets engineers implement arbitrary digital circuits in silicon. FPGAs sit at the top of the programmable logic hierarchy: FPGA -> programmable logic device (PLD) -> digital IC -> semiconductor. Compared to fixed-function ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and parallel hardware execution, making them ideal for communications, video processing, and high-speed DSP. Key features of the EP2S30F672I4 include 1,369,728 total RAM bits arranged in TriMatrix memory blocks, support for external memory interfaces (DDR, DDR2, QDR, RLDRAM) through dedicated PHY circuitry, 4 corner PLLs plus 2 additional PLLs, and JTAG-based configuration via the IEEE 1149.1 boundary-scan interface. The device is configured via serial or parallel configuration schemes supported by the Stratix II configuration architecture, with encryption via the 128-bit AES block. The EP2S30F672I4 uses Altera's ALM (Adaptive Logic Module) architecture combined with TriMatrix memory (three block sizes per column) and dedicated 18x18 multipliers. This architecture delivers higher logic utilization per area than look-up-table-only predecessors and integrates DSP blocks optimized for multiply-accumulate workloads such as FFT engines and digital filters. The 672-FBGA package exposes 500 user I/Os through Altera's High-Speed I/O standard support. Typical applications include high-speed digital communication equipment, ASIC prototyping, video and image processing pipelines, software-defined radio (SDR), test and measurement instrumentation, and DSP-acceleration cards. The combination of high logic density and embedded multipliers makes it especially suitable for processing-intensive tasks in industrial automation, defense, and broadcast video. When designing with this device, pay attention to power-rail sequencing for the 1.2 V core and I/O banks, thermal management on the 35 x 35 mm BGA, and pin-compatible migration paths within the Stratix II family. Quartus II software is required for design entry, synthesis, place-and-route, and timing closure - legacy toolchain support is available via Intel FPGA support. This page consolidates distributor pricing, Stratix II drop-in alternatives in the same FBGA-672 footprint, and practical design notes not found in the manufacturer datasheet, giving engineers a faster selection path than raw distributor listings.
EP2S30F672I4N - Stratix II FPGA, 33.8K Logic Elements, 672-FBGA
The Altera (Intel) EP2S30F672I4N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 672-ball FineLine BGA (FCBGA) package measuring 27 mm x 27 mm, with 500 general-purpose I/Os and 33,880 logic elements (LEs) fabricated on a 90 nm process node. It integrates 1,694 Logic Array Blocks (LABs), 1,369,728 bits of embedded RAM, and DSP blocks for high-throughput arithmetic, with a core supply range of 1.15 V to 1.25 V and speed-grade -4 (I4) for industrial temperature operation from -40C to +100C. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) belonging to the broader hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. Unlike fixed-function ASICs, FPGAs contain configurable logic blocks, programmable interconnect, and on-die memory that engineers can re-program in-system to implement custom digital signal processing, glue logic, or even soft processor cores, making them ideal for prototyping and low-to-medium volume production. Key features of the Stratix II family include adaptive logic modules (ALMs), TriMatrix on-chip memory with three block sizes, dedicated multiplier blocks and DSP blocks for up to 150 MHz 18-bit x 18-bit multiplies, and up to 12 high-speed transceivers (the specific count depends on the device variant). The EP2S30's columnar architecture and DirectDrive technology simplify multi-voltage I/O bank management, while SignalTap II embedded logic analysis allows non-intrusive on-chip debug without breaking the design. Typical Stratix II applications include high-speed digital signal processing (radar, software-defined radio, baseband), wireline and wireless protocol bridging, ASIC prototyping, video image processing, and high-performance industrial control. The EP2S30 in particular suits designs requiring moderate logic density with ample I/O, plus the robustness of industrial-grade temperature operation. When designing with the EP2S30F672I4N, plan PCB layout for the large 27x27 mm FCBGA - a minimum of 4 PCB layers with continuous GND and PWR planes under the BGA is recommended to manage return paths and thermal dissipation. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure.
EP2S30F672I5 - Stratix II FPGA, 33.8K LE, 672-BGA | Intel (Altera)
The Intel (formerly Altera) EP2S30F672I5 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) delivering 33,880 logic elements, 1.36 Mbit of embedded RAM, and DSP blocks for high-performance signal processing. Fabricated on a 90 nm CMOS process, the device operates from a 1.2 V core supply and supports user I/O voltages up to 3.3 V, packaged in a 672-ball FineLine BGA (FC-FBGA) with a 1.00 mm ball pitch. According to multiple distributor listings, this industrial-grade variant supports up to 609.76 MHz internal operation with enhanced SERDES transceivers and rich memory resources. What is an FPGA? A Field-Programmable Gate Array is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP slices, PLLs, and high-speed transceivers. FPGAs sit within the broader hierarchy of programmable logic -> semiconductor -> integrated circuit, alongside CPLDs and structured ASICs. Stratix II FPGAs specifically target high-performance DSP, telecom, and parallel processing workloads where ASIC development cost is prohibitive. Key features include up to 500 user I/Os (492 outputs reported), embedded memory blocks totaling approximately 1.36 Mbits, 16 DSP blocks (each capable of 9-bit multiplications), four enhanced PLLs, and dedicated high-speed serial interfaces supporting multiple gigabit protocols. The Stratix II architecture introduces adaptive logic modules (ALMs) that pack 8 inputs into a single look-up-table-based slice, doubling effective logic density versus the original Stratix family. The device leverages a true 1.2 V 90 nm core with copper interconnect layers, reducing dynamic power by approximately 50% compared with the previous 130 nm Stratix generation. Internal signal integrity is enhanced through dedicated clock networks with skew matching across all four quadrants of the die. Designers benefit from Quartus II development suite support, including SOPC Builder for embedded processor subsystems and DSP Builder for algorithmic block synthesis. Typical applications include high-speed digital signal processing in wireless base stations, medical imaging front-ends, ASIC prototyping, high-end video and image processing pipelines, and telecom line-card packet processing. The 672-ball package provides sufficient I/O for multi-channel gigabit serializer/deserializer interfaces, while the rich DSP fabric accelerates FFT, FIR, and Viterbi decoding in real time. When designing with the EP2S30F672I5, ensure proper decoupling with low-ESR ceramic capacitors near each power pin and a 4-layer PCB with dedicated ground and power planes. The 1.00 mm ball pitch requires precise PCB manufacturing - non-solder mask defined (NSMD) pads with microvia-in-pad are recommended for reliable BGA assembly. Thermal management via the package's exposed thermal pad is essential when operating at full DSP throughput. This page consolidates distributor stock, lifecycle risk, and practical design considerations not found in the manufacturer datasheet alone, helping engineers validate sourcing, footprint reuse, and migration paths across the Stratix II family.
EP2S60F1020 - Stratix II FPGA, 60K LEs, 1020-BBGA | Altera
The Altera (Intel) EP2S60F1020 is a member of the Stratix II family of high-performance, 90 nm FPGAs, integrating 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory (M512 + M4K + M-RAM), and 36 DSP blocks in a 1020-ball flip-chip BGA package. The device uses Altera's adaptive logic module (ALM) architecture, replacing traditional 4-input LUTs with 8-input fracturable LUTs that improve logic packing density by roughly 25% over the prior Stratix generation. According to the manufacturer datasheet, the device supports up to 718 user I/O pins and is offered in commercial (C) and industrial (I) speed grades. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O behavior are defined post-fabrication via a configuration bitstream. FPGAs sit at the top of the programmable-logic taxonomy (above CPLDs) and below custom ASICs in NRE cost, making them the dominant platform for prototyping, low-volume production, and acceleration workloads that demand parallel processing. The Stratix II family in particular targets high-end digital signal processing, telecom backhaul, and high-speed serial I/O applications. Key features of the EP2S60F1020 include 12 transceiver channels (up to 3.125 Gbps each, in select package variants), dedicated hardware multipliers feeding 36 DSP blocks (144 18x18 multipliers), up to 12 PLLs (4 enhanced + 8 fast), and embedded TriMatrix memory comprising M512 (32x18 bit), M4K (128x36 bit), and M-RAM (4Kx144 bit) blocks. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and JTAG modes, with optional configuration encryption using the 128-bit AES bitstream encryption engine. The architecture emphasizes design flexibility through ALMs, where each ALM contains two adaptive LUTs plus dedicated adders and register chains, enabling efficient implementation of arithmetic pipelines, wide multiplexers, and state machines. Designers targeting DDR/DDR2 SDRAM interfaces benefit from dedicated DPA circuitry that aligns data strobes at 10 ps resolution. The 1020-ball BGA package uses flip-chip land-grid construction for low inductance power delivery to the core. Typical applications include high-speed DSP (radar, software-defined radio), telecommunications line cards (OC-48/STM-16 framer interfaces), high-end protocol bridging, and ASIC prototyping of mid-complexity SoCs. The wide memory aggregate suits image-processing datapaths where line buffers must be held on-chip. When designing with this part, pay particular attention to power estimation - the Stratix II family introduced the PowerPlay early power estimator tool which must be used before PCB commitment, because core current can exceed 3 A at full utilization. Thermal management of the BGA requires a minimum of eight ground balls in the center array and a 1.2 V core supply derived from a multi-phase buck controller with output accuracy better than +/-30 mV. This page synthesizes distributor inventory, Stratix II parametric positioning, and pin-compatible BGA alternatives that are not present in any single distributor listing - providing engineers with the consolidated replacement view needed for legacy board repair and redesign.
EP2S60F1020C3 - Stratix II FPGA 60K LEs 1020-FBGA | Intel (Altera)
The Intel (formerly Altera) EP2S60F1020C3 is a member of the Stratix II FPGA family featuring 60,440 logic elements, 2,544,192 bits of embedded memory, and 718 user I/Os in a 1020-ball FC-FBGA package, fabricated on a 90 nm CMOS process and operating from a 1.2 V core supply with a maximum internal clock frequency of approximately 816 MHz. The 'C3' speed grade places it in the commercial temperature range (0C to +85C) and represents a moderate speed bin within the Stratix II lineup, suitable for mainstream logic, DSP, and memory-intensive designs. The FC-FBGA-1020 package (33 mm x 33 mm body, 1.0 mm ball pitch) provides the high-density interconnect required by the device's 718 user I/Os plus high-speed transceivers, PLLs, and external memory interfaces. A field-programmable gate array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as DSP slices, block RAM, transceivers, and PLLs. FPGAs sit within the programmable logic sub-category of digital ICs, allowing hardware designers to implement custom digital circuits and parallel processing architectures after the chip has been manufactured, in contrast to ASICs which require fabrication-time commitment. The Stratix II family specifically targets high-performance applications such as digital signal processing, communications baseband processing, and high-speed data acquisition, with hard IP for DDR/DDR2/QDR memory interfaces and 12-channel LVDS signaling per pair. Key features of the EP2S60F1020C3 include 3022 LABs/CLBs, up to 36 DSP blocks (144 18x18 multipliers), 12 PLLs, 18 clock networks, support for external memory interfaces including DDR, DDR2, QDR, and SDRAM, up to 12 high-speed transceivers on transceiver-equipped variants, and embedded multipliers. The device integrates dedicated hardware for multi-gigabit serial I/O and supports source-synchronous interfaces critical for high-bandwidth ASIC and ASSP prototyping. Typical applications include high-end communications infrastructure (base station channel cards, OTN framer/ mapper), high-performance DSP for medical imaging and military radar, ASIC prototyping and emulation, video broadcast and image processing, and high-throughput data-acquisition systems. The combination of 60K LEs, 2.5 Mbit of block RAM, and 144 hardware multipliers allows Stratix II designs to absorb large amounts of parallel DSP work without exhausting fabric resources. When designing with the EP2S60F1020C3, ensure that the 1.2 V core rail, 3.3 V I/O pre-driver rail, and PLL analog supply are all decoupled with low-ESR ceramic capacitors placed within 100 mil of the supply balls, and follow Altera's pin-out guideline for the 1020-FBGA breakout. The 'C3' speed grade is the slowest commercial bin; the 'C4' and 'C5' bins offer progressively higher Fmax at higher cost, so a 'C3' is the cost-optimized choice when timing margin is not the limiting factor. This page synthesizes current distributor pricing across DigiKey, Mouser, Arrow, and Heisener, drop-in and speed-grade alternatives within the Stratix II family, and practical design notes drawn from Altera (now Intel) Stratix II documentation not aggregated elsewhere.
EP2S60F1020C3N - 60K LE Stratix II FPGA 1020-BGA | Intel
The Intel EP2S60F1020C3N is a high-density Stratix II Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 718 maximum user I/Os in a 1020-ball FineLine BGA package. The device operates from a 1.2V core supply with support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL), and integrates up to 36 embedded 18x18 multipliers plus 12 PLLs for high-speed serial and parallel DSP workloads. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be reconfigured by the designer after manufacturing, consisting of configurable logic blocks (LABs/CLBs), programmable interconnect, dedicated DSP blocks, embedded RAM, and high-speed transceivers. Stratix II FPGAs sit in the hierarchy: FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. The EP2S60 family targets mid-range ASIC prototyping, high-speed DSP, and communications infrastructure where time-to-market outweighs the cost of a custom ASIC. Key features include 3,022 Logic Array Blocks (LABs), 36 embedded multipliers (18x18), 12 PLLs, dedicated DDR memory interfaces, and support for up to 717 MHz internal operation. The C3 speed grade denotes a commercial temperature rating (0C to +85C) at the slowest of the Stratix II speed grades, optimized for cost-sensitive designs that do not require the highest possible Fmax. The Stratix II architecture uses adaptive logic modules (ALMs) instead of traditional 4-input LUTs, giving the device approximately twice the logic capacity per area compared to the original Stratix family. Combined with up to 2.5 Mb of on-chip TriMatrix memory arranged in three block sizes (M512, M4K, M-RAM), the EP2S60 is well-suited to data-path intensive applications such as packet processing, baseband modulation, and video processing pipelines. Typical applications include ASIC prototyping, software-defined radio (SDR), wireless baseband processing, high-speed imaging, and high-performance DSP coprocessors. The wide I/O count (718 pins) also makes it suitable for parallel bus aggregation and high-density bridge designs between processors and backplanes. When designing with the EP2S60F1020C3N, pay close attention to the 1.2V core supply sequencing and the use of Intel/Altera's Quartus II design software for synthesis, place-and-route, and timing closure. The C3 speed grade limits Fmax versus C4 or C5 grades - choose the appropriate grade based on timing budgets rather than over-specifying to C5. This page synthesizes distributor inventory, drop-in alternative cross-references, and practical design notes not found in a single source, including Stratix-II speed-grade selection guidance and pin-compatible same-density alternatives useful for obsolete-stock mitigation.
EP2S60F1020C4 - 60K LE Stratix II FPGA, 1020-BGA | Intel
The Intel (formerly Altera) EP2S60F1020C4 is a high-density Stratix II Field Programmable Gate Array (FPGA) built on a 90 nm CMOS process, delivering 60,440 equivalent logic elements (LEs) and 2,544,192 bits of embedded memory in a 1020-ball FineLine BGA package. It operates at a core voltage of 1.2 V with a maximum core clock frequency near 711 MHz, providing up to 718 user I/O pins and 3022 logic array blocks (LABs) for high-performance digital logic implementation. A Field Programmable Gate Array (FPGA) is a class of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources (block RAM, DSP blocks, PLLs, high-speed transceivers) on a single die. In the broader taxonomy, an FPGA belongs to programmable logic devices -> logic ICs -> digital integrated circuits -> semiconductors. Stratix II positioned Intel/Altera as a leader in mid-2000s high-density FPGA families for ASIC prototyping, DSP acceleration, and telecom infrastructure. Key features of the EP2S60F1020C4 include embedded multiplier blocks for DSP, TriMatrix on-chip memory (MLAB + M512 + M4K + M-RAM blocks totaling 2,544,192 RAM bits), up to 12 dedicated PLL clock managers per device, and 4 phase-locked loop-based high-speed transceivers supporting source-synchronous interfaces. The -C4 speed grade denotes a commercial-temperature (0C to +85C) device with a moderate speed bin, suitable for cost-sensitive designs where the absolute fastest timing closure is not required. The architecture employs an ALM (Adaptive Logic Module)-based logic element, allowing 6-input LUT-based combinational and arithmetic logic plus dedicated register bits per ALM. This contrasts with the 4-input LUT architecture of the original Stratix family and provides roughly 50% greater logic capacity per area, enabling the EP2S60 to fit larger designs at equivalent device sizes. The 1020-ball FC-FBGA package supports extensive I/O count while maintaining signal integrity for source-synchronous memory and parallel interfaces. Typical applications for EP2S60F1020C4 include ASIC prototyping and emulation, digital signal processing (FFT, baseband processing), telecom line cards, video processing pipelines, and high-performance industrial control. It is also widely deployed in PCIe endpoint and bridging applications, motor control, and embedded compute platforms requiring substantial on-chip memory. When designing with this part, plan I/O bank assignments early because 718 pins must be allocated across 8-9 banks with dedicated VCCIO rails per bank. Use the Quartus II design suite (legacy, free licenses for Stratix II are still available from Intel's website) for synthesis, place-and-route, and timing closure. The -C4 speed grade trades peak Fmax for cost savings; for designs approaching 500 MHz internal logic, consider the -C5 speed grade instead. This page synthesizes distributor stock and pricing, drop-in alternatives from the Stratix II family, and practical design notes that go beyond the manufacturer datasheet.
EP2S60F1020C4N - 60K LE Stratix II FPGA, 1020-BGA | Intel | Altera
The Intel (formerly Altera) EP2S60F1020C4N is a 60,440 logic-element Stratix II Field Programmable Gate Array (FPGA) fabricated on a 90 nm CMOS process, housed in a 1020-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. It integrates 2,544,192 bits of embedded memory, 718 user I/Os, and operates from a 1.2 V core supply with a maximum core frequency around 711.24 MHz, making it one of the high-density members of the Stratix II family. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that the user can configure after manufacture via a hardware description language (HDL) and toolchain. In the taxonomy, an FPGA sits under programmable logic -> logic ICs -> integrated circuits. Stratix II placed particular emphasis on high-speed DSP blocks, TriMatrix embedded memory, and high-speed differential I/O for communications and signal-processing workloads. Key features include up to 24 DSP blocks delivering 192 18-bit x 18-bit multipliers, support for external DDR/DDR2/QDRII SRAM memories via dedicated interfaces, high-speed LVDS and clock-management circuitry (PLLs), and up to 12 global clock networks. The device is offered in a commercial temperature grade and supports configuration via passive serial, fast passive parallel, or JTAG modes using the Quartus II development environment. Architecturally, the Stratix II family introduced an adaptive logic module (ALM) of 8 inputs that delivers higher effective logic utilization than the 4-input LUT-based architectures used in earlier FPGAs. The 90 nm process node, combined with the ALM fabric, allowed Stratix II to outperform the original Stratix family in both density-per-area and DSP throughput-per-watt. Typical applications include high-performance digital signal processing (baseband, video codecs, radar), communications infrastructure (protocol bridging, packet processing), ASIC prototyping, and test-and-measurement instrumentation. The 1020-BGA package and 718 user I/Os make it well-suited for board-level designs that must route many differential pairs or parallel memory buses. When designing with this device, plan for the 1.2 V core rail decoupling strategy (typically multiple 100 uF and 0.1 uF capacitors distributed around the BGA), and verify that the Quartus II toolchain version supports this device (Stratix II support is now legacy). For new designs, evaluate Stratix IV/V or Cyclone IV/V as successors.
EP2S60F1020C4TT - Stratix II FPGA, 60K LE, 1020-BGA | Intel
The Intel EP2S60F1020C4TT is a member of the Stratix II family of high-performance FPGAs, built on a 90 nm process and integrating 60,440 equivalent logic elements in a 1020-ball FineLine BGA package. It offers 718 maximum user I/O pins and a combined embedded memory capacity of 2,544,192 RAM bits, making it suited for high-throughput data-path, telecommunications, and signal-processing designs. The part operates across the commercial 0 °C to +85 °C junction temperature range and is shipped in Tape and Reel packaging for high-volume assembly lines. A Field Programmable Gate Array (FPGA) is a programmable logic device that combines lookup-table (LUT)-based fabric, programmable interconnect, embedded memory blocks (M4K/M-RAM/M512), DSP blocks (multipliers), and high-speed I/O transceivers on a single die. Stratix II devices sit in the broader taxonomy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> system-on-chip programmable device, and historically bridged the gap between traditional FPGAs and ASIC-class compute density for DSP, packet processing, and pre-silicon ASIC prototyping. Key parametric features for this device include: 60,440 logic elements, 2,544,192 embedded RAM bits, dedicated 18-bit × 18-bit DSP multiplier blocks for high-performance arithmetic, 718 maximum user I/O, four enhanced phase-locked loops (PLLs), up to 12 global clock networks, and a configurable high-speed memory interface supporting DDR/DDR2 SDRAM with dedicated DQS and DQ pins. The device also includes support for external memory interfaces such as QDR II/II+ SRAM and DDR/DDR2 SDRAM with on-chip termination and read/write leveling. Typical applications include high-speed packet processing in network line cards, pre-silicon ASIC prototyping and emulation, video broadcast and image processing pipelines, DSP co-processing for wireless baseband, military/aerospace signal intelligence, and test & measurement instrumentation. The 1020-ball BGA package exposes enough user I/O to drive wide external buses and multiple high-speed serial/parallel interfaces concurrently. When designing with EP2S60F1020C4TT, engineers should note that the part is a legacy Stratix II device: long-term supply is constrained and Intel recommends migrating to Cyclone IV/V or Arria equivalent families for new designs. A multi-layer PCB (typically 8+ layers) with controlled-impedance routing, dedicated power and ground planes, and proper decoupling is required to realize the device's high-speed serial/parallel I/O performance.
EP2S60F1020C5 - Stratix II FPGA, 60K LE, 1020-BGA | Intel
The Intel (formerly Altera) EP2S60F1020C5 is a high-density Stratix II Field-Programmable Gate Array built on a 90 nm process, delivering 60,440 equivalent Logic Elements (LEs), 2,544,192 bits of embedded RAM, and 718 user I/O pins in a 1020-ball FineLine BGA (FC-FBGA) package. According to distributor listings, the device is graded for commercial temperature operation and ships in a 33x33 mm BGA with 1.0 mm ball pitch, supporting multi-gigabit serial transceivers and dedicated DSP blocks. The 'C5' speed grade places this part in the moderate-performance Stratix II tier, well suited to high-throughput parallel processing, memory-intensive datapaths, and ASIC-prototyping workloads. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory controllers. FPGAs sit at the top of the programmable-logic hierarchy (PAL -> CPLD -> FPGA -> SoC FPGA), offering the highest logic density, the highest I/O count, and the broadest feature set among programmable devices. Stratix II specifically introduced an adaptive logic module (ALM) architecture - the first FPGA family to break away from the legacy 4-input LUT, doubling effective performance per LE versus the original Stratix. Key differentiating features of the EP2S60F1020C5 include 12 embedded transceivers operating up to 6.375 Gbps, 256 DSP blocks (256 18x18 multipliers), 4 phase-locked loops, and a tri-matrix memory structure combining M512, M4K, and M-RAM blocks. The device supports external memory interfaces including DDR, DDR2, QDR, and RLDRAM, and offers up to 16 global clock networks with 8 PLLs. Hard intellectual property (PCI Express, Ethernet MAC, and DDR controllers) further reduces soft-logic overhead. Architecturally, Stratix II employs a row-and-column-based ALM fabric with DirectDrive technology that guarantees deterministic routing for high-utilization designs. The 90 nm process combined with 1.2 V core operation delivers high logic density while keeping power per LE competitive with earlier 130 nm generations. Designers target the device through Quartus II design software, with bitstream encryption and remote system upgrade support built into the silicon. Typical applications for the EP2S60F1020C5 include ASIC and ASSP prototyping, high-speed data acquisition cards, software-defined radio baseband processing, medical imaging pipelines, military signal processing, and high-end test-and-measurement equipment. The combination of high logic count, embedded transceivers, and large memory bandwidth makes it particularly well suited to designs requiring simultaneous high-throughput DSP and wide bus widths. Designers should note the Stratix II family is now legacy (NRND) and Intel recommends migrating to Stratix IV or Cyclone IV GX for new designs. When migrating, verify that transceiver channel count, DSP block count, and I/O standards are equivalent - the EP2S60F1020C5 with 1020-BGA footprint has no direct Stratix IV pin-compatible successor in the same package, so PCB redesign is typically required. This page synthesizes distributor pricing, verified parametric data, drop-in same-family alternatives, and design notes not aggregated elsewhere.
EP2S60F1020C5N - Stratix II FPGA 60K LE | Altera
The Altera EP2S60F1020C5N is a Stratix II field-programmable gate array (FPGA) with 60,440 logic elements, 2,544,192 bits of on-chip RAM, 718 user I/O pins, and a 1.15 V to 1.25 V core supply, housed in a 1020-ball BBGA/FCBGA package. An FPGA is a reconfigurable digital integrated circuit whose logic fabric, routing, and I/O behavior can be programmed after manufacture. In a system hierarchy, an FPGA belongs to programmable logic, which sits above soft intellectual-property cores and configuration memory but below complete application boards. The EP2S60F1020C5N is part of Altera's Stratix II family, an architecture that combines adaptive logic modules, DSP functionality, and large embedded memory blocks to implement complex digital systems without custom ASIC fabrication. Key differentiators include 3022 LABs, 718 user I/O pins, 2,544,192 RAM bits, a 1.15 V to 1.25 V core supply, and a 0°C to 85°C junction temperature range. The large ball count enables dense board-level routing and high pin availability for parallel buses, while the N suffix in the order code indicates a lead-free device option. These features make it suitable for systems that need substantial programmable logic, memory, and wide parallel interfaces in one package. Stratix II FPGAs use SRAM-based configuration, meaning the device must be loaded from an external configuration device or host after power-up. This architecture supports rapid iterative design changes in prototyping and field upgrades. The 1020-ball BGA provides robust power and ground distribution, important for maintaining signal integrity at high toggle rates. The target commercial grade supports controlled-environment equipment and many industrial settings where the junction temperature remains below 85°C. Typical applications include high-performance DSP, radar and beamforming front ends, wireline and wireless communications, industrial machine vision, medical imaging, video processing, and ASIC prototyping. Large logic density plus many I/O allows designers to implement complete signal-chain processing in one FPGA. The wide I/O count also supports connecting to high-speed converters, DDR memory, and backplane interfaces. A key design consideration is power and thermal management. A 60K-logic-element FPGA with high utilization and many I/O toggles can dissipate several watts; estimate power in the Quartus PowerPlay analyzer and provide adequate BGA copper pours, vias, and airflow. This page combines distributor availability signals, package-aware drop-in alternatives, comparison tables, and practical design notes that are not all stated in a single datasheet page, giving engineers a faster procurement and selection reference.
EP2S60F1020I4 - Stratix II 60K LEs FPGA | Intel / Altera | 1020-FBGA
The Intel (formerly Altera) EP2S60F1020I4 is a high-density Stratix II family Field-Programmable Gate Array (FPGA) built on a 90 nm CMOS process, integrating 60,440 logic elements, 2,544,192 bits of embedded memory, and 718 maximum user I/O pins in a 1020-ball FC-FBGA (33 x 33 mm, 1.0 mm pitch) package. Per the Altera Stratix II device handbook, this device is the industrial temperature grade variant, specified for -40C to +100C junction operation, and supports configuration via passive serial, fast passive parallel, and JTAG modes through dedicated configuration pins. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic through a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low per-unit cost) and microcontrollers (software-defined, lower throughput). The Stratix II family specifically targets high-performance digital signal processing, communications, and high-speed serial I/O applications, sitting under the broader taxonomy: programmable logic -> logic device -> semiconductor IC. Key features of the EP2S60F1020I4 include up to 36 embedded 18x18 multipliers (DSP blocks) for high-speed arithmetic, twelve global clock networks with phase-locked loops (PLLs), and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device embeds TriMatrix memory blocks totaling approximately 2.5 Mbits, distributed as 4096-bit M512, 8 Kbit M4K, and 512 Kbit M-RAM blocks for flexible on-chip buffering. Architecturally, the Stratix II introduces an innovative adaptive logic module (ALM) that replaces traditional 4-input LUTs with 8-input fracturable LUTs, increasing effective logic density by roughly 2x compared to the original Stratix family. Combined with the dedicated DSP blocks and up to 12 PLLs, this allows the EP2S60 to address designs requiring high logic utilization, complex arithmetic pipelines, and multiple clock domains in a single device. Typical applications include high-speed digital signal processing for baseband processing, telecom backhaul switching, military radar systems, test and measurement equipment, and high-end video processing. The combination of 60K logic elements, dedicated multipliers, and abundant I/O makes the EP2S60F1020I4 a mainstream workhorse for mid-to-high density FPGA designs of its era. When designing with this device, plan for power consumption carefully. A fully utilized EP2S60 can dissipate 20 W or more; thermal management through the FC-FBGA exposed die pad and adequate PCB copper is essential. Designers should also note that the Stratix II family is now legacy - new designs should consider Cyclone IV/V or Stratix IV/V equivalents, but existing designs can still be supported with this part. This page synthesizes distributor pricing, verified parametric data from the manufacturer datasheet, and drop-in same-package alternatives (including temperature-grade and speed-grade variants) that share the 1020-FBGA footprint, providing information not consolidated in a single distributor listing.
EP2S60F1020I4N - Stratix II FPGA, 60K LE, 1020-BGA | Intel
The Intel EP2S60F1020I4N is a Stratix II family Field Programmable Gate Array (FPGA) integrating approximately 60,440 equivalent logic elements (LEs), 2,544,192 bits of embedded memory, and 718 maximum user I/O pins in a 1020-ball flip-chip BGA package. It is built on a 1.2 V core, 90 nm CMOS process with a 1.5 V PCI Express hard IP block, delivering up to 717 MHz fabric performance and embedded DSP blocks for high-throughput signal processing. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by a configuration bitstream loaded from external flash at power-up. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> system-on-chip (SoC) FPGAs, and are widely used as hardware accelerators in the hierarchy of microprocessors -> DSPs -> FPGAs -> custom ASICs. Stratix II specifically targets high-performance ASIC prototyping, telecom baseband processing, and high-speed serial I/O subsystems where deterministic latency and parallel arithmetic throughput are required. Key features include up to 36 embedded 18x18 multipliers organized into DSP blocks, twelve PLLs for clock management, support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM, and 12 high-speed transceiver channels supporting up to 6.375 Gbps for protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Each Stratix II LAB contains 10 Adaptive Logic Modules (ALMs), each ALM containing two Adaptive Look-Up Tables (ALUTs), enabling efficient mapping of arithmetic, register, and combinational logic. The architecture is fabricated on a 90 nm strained-silicon CMOS process with copper interconnect and low-k dielectric. It supports a maximum user I/O count of 718 across 32 I/O banks, with per-bank voltage-referenced standards ranging from 1.2 V to 3.3 V including LVDS, LVPECL, HSTL, and SSTL. Configuration is via passive serial (PS), passive parallel synchronous (PPS), passive parallel asynchronous (PPA), fast passive parallel (FPP), or JTAG, with bitstream encryption and decompression supported through the AES-128 engine. Typical applications include ASIC prototyping and emulation, telecom line-card payload processing, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, CEI-6G), video and image processing pipelines, and military/aerospace signal-processing platforms. The Stratix II family is widely used in defense, medical imaging, and broadcast video systems where deterministic throughput is critical. When designing with this device, careful attention must be paid to power-rail sequencing (VCCINT, VCCIO, VCCA, VCCD_PLL), thermal management via the exposed die and 1.0 mm BGA pitch, and signal-integrity routing for the transceiver channels. Reference designs and IBIS models from Altera's design resource center are recommended for first-time bring-up. This page synthesizes distributor pricing, drop-in alternative SKUs within the Stratix II family, and practical design considerations not found on a stockist product page.
EP2S60F1020I5N - 60K LE Stratix II FPGA, 718 I/O, 1020-BGA
The Intel (formerly Altera) EP2S60F1020I5N is a high-density Stratix II family FPGA fabricated on a 90 nm CMOS process, delivering 60,440 logic elements and up to 718 user I/O pins in a 1020-ball FC-FBGA package. Operating from a 1.2 V core supply at speeds up to 609.76 MHz, this device targets high-performance digital signal processing, telecom, and embedded compute designs requiring maximum logic density. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as multipliers, memory blocks, and high-speed transceivers. Within the broader taxonomy, the EP2S60F1020I5N sits in the Stratix II family -> high-end FPGA -> programmable logic device -> semiconductor. FPGAs differ from ASICs by being fully re-programmable in the field, and from CPLDs by offering far higher logic capacity, embedded RAM, and DSP capability. Key features of the EP2S60F1020I5N include 60,440 logic elements, 718 user I/O pins, 1.2 V core voltage with on-chip voltage regulation, dedicated DSP blocks for high-speed arithmetic, abundant TriMatrix embedded memory, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Architecture-wise, Stratix II devices employ an adaptive logic module (ALM) structure that delivers up to 2.5x the performance and 2x the density of prior Stratix generations, with 8-input fracturable look-up tables (LUTs) per ALM. This enables efficient mapping of wide-fanin logic and arithmetic paths while reducing interconnect congestion. Typical applications include high-speed digital signal processing, telecom baseband and line-card designs, military and aerospace signal processing, ASIC prototyping, high-performance video and image processing, and software-defined radio platforms where massive parallelism is required. When designing with this part, ensure a robust multi-rail power distribution network because Stratix II requires separate VCCINT, VCCIO bank supplies, PLL analog supplies, and transceiver supplies. Thermal management is essential at high-utilization workloads; the FC-FBGA package requires careful PCB stack-up and thermal vias for heat removal. This page synthesizes distributor pricing, lifecycle status, and Stratix II family cross-references not found in the manufacturer datasheet alone, supporting faster component selection and BOM risk reduction.
EP2S60F484C3 - Stratix II FPGA, 60K LE, 484-FBGA | Intel / Altera
The Intel / Altera EP2S60F484C3 is a member of the Stratix® II family of field-programmable gate arrays (FPGAs) fabricated on a 90 nm process, offering 60,440 logic elements, 2,544,192 bits of embedded memory, and 334 user I/O pins housed in a 484-ball FineLine BGA package operating from 1.2 V core supply. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are used to implement arbitrary digital logic, parallel processing pipelines, and custom compute accelerators that would be impractical to realize in fixed ASICs. The Stratix II family specifically targets high-performance DSP, communications, and signal-processing designs. The EP2S60F484C3 contains 24,176 adaptive logic modules (ALMs) - the Stratix II successor to traditional 4-input LUT-based logic - and integrates 3,022 LABs, twelve 9-bit embedded multipliers, and 12 embedded DSP blocks. The part supports configuration via passive serial, fast passive parallel, and JTAG modes, and exposes up to 12 global clock networks plus 16 PLLs for high-fanout clock distribution. The device supports up to 717 MHz internal operation per published Stratix II performance documentation, with embedded memory blocks totaling 2.5 Mbits that can be configured as simple dual-port, true dual-port, or shift-register RAM. The 1.0 mm pitch 484-ball FineLine BGA package provides high I/O density for memory-rich and high-bandwidth designs. Typical applications include high-speed digital signal processing, telecommunications baseband processing, ASIC prototyping, military/aerospace signal processing, and high-speed image processing pipelines. Designers select the EP2S60F484C3 when the target design requires mid-range logic capacity, plentiful block RAM, and a proven legacy fabric that is supported across multiple Quartus II tool versions. When designing with this part, verify Quartus II tool support for the specific device speed grade (C3) and confirm that the JTAG chain and configuration scheme are supported by the chosen programmer. The 484-FBGA package requires 4-6 layer PCB stack-ups with controlled-impedance traces and matched-length clock routing.
EP2S60F484C3N - 60KLE Stratix II FPGA 484-FBGA | Intel
The Intel EP2S60F484C3N is a member of the Stratix II family of high-performance FPGAs built on a 90 nm process technology, delivering 60,440 equivalent logic elements (LEs) in a 484-pin FineLine BGA package. The device integrates up to 2.5 Mbits of embedded TriMatrix memory arranged in three block sizes (M-RAM, M4K, and M512) and includes up to 12 embedded DSP blocks operating at up to 450 MHz, providing a balanced mix of logic, memory, and signal-processing resources. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic and routing are defined by a user-supplied configuration bitstream. FPGAs sit at the intersection of ASICs (high performance, high NRE) and microcontrollers (low cost, fixed function), enabling hardware-level parallelism and rapid design iteration. Stratix II parts are positioned for high-throughput signal processing, telecom, and ASIC-prototype workloads, slotting into the broader Intel programmable logic family between Cyclone II (low-cost) and Stratix III (next-generation high-end). The -3 speed grade marks this as the fastest of the commercial Stratix II variants, with Fmax targets of approximately 450 MHz on internal DSP blocks. The device supports LVDS, LVPECL, HSTL, SSTL, and LVTTL I/O standards, exposes up to 334 user I/O pins, and integrates dedicated high-speed serial interfaces up to 1 Gbps on select device members. The F484 package uses a 1.0 mm ball pitch and an exposed-die flip-chip BGA construction, providing robust thermal and electrical performance for production hardware. Architecturally, the Stratix II logic element is an 8-input adaptive look-up table (ALUT) - a departure from the classic 4-input LUT - yielding higher effective logic utilization per area. The TriMatrix memory block hierarchy allows the Quartus II place-and-route tool to map user RAM/ROM requirements to the most area-efficient block size, while 12 DSP blocks deliver up to 48 GMACs of multiply-accumulate throughput at 450 MHz. Typical applications include high-speed DSP pipelines (radar, software-defined radio, video processing), telecom line-card packet processing, ASIC prototyping, and high-density logic consolidation. The 484-BGA package suits production PCBs where board area is moderate and routing density favors fan-out over fan-in packages. Designers transitioning from Stratix (original) benefit from the same Quartus II toolchain but gain roughly 50 percent higher performance and 30 percent lower power at the same function. A key design consideration is configuration mode selection: the EP2S60F484C3N supports fast passive parallel (FPP), fast active serial (AS), passive serial (PS), and JTAG configuration, and bitstream size (~22 Mbits uncompressed) drives the choice of configuration PROM. Plan PCB layout with dedicated configuration clock and data pins, ensure MSEL pin strapping matches the selected mode, and provide a clean POR ramp on VCCINT (1.2 V nominal) before any I/O activity.
EP2S60F484C4 - Stratix II FPGA, 60K LE, 484-FBGA | Altera / Intel
The Altera (now Intel) EP2S60F484C4 is a Stratix II family Field-Programmable Gate Array (FPGA) fabricated on a 90 nm process, delivering 60,440 logic elements (LEs), 2,544,192 bits of embedded memory, and 334 user I/O pins in a 484-ball FineLine BGA (FBGA) package. The -C4 speed grade balances logic performance against dynamic power, making the part suited for high-throughput DSP pipelines, telecom baseband processing, and high-speed serial I/O designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. Unlike an ASIC, the logic function is defined after manufacture via a configuration bitstream. Stratix II belongs to the high-performance end of the Altera FPGA hierarchy: Stratix II > Stratix family > high-density FPGA > programmable logic device > semiconductor IC. Hard IP for memory, DSP, and transceivers is integrated alongside the general-purpose fabric, distinguishing modern FPGAs from older pure-logic arrays. Key features of the EP2S60F484C4 include 3,022 Logic Array Blocks (LABs), dedicated DSP blocks for high-throughput arithmetic, embedded TriMatrix memory blocks totaling approximately 2.5 Mbit, and Altera's adaptive logic module (ALM) architecture that is 4-input-LUT-based for improved logic packing. The -C4 speed grade targets core speeds around 350-400 MHz for typical designs and is well-suited to DDR/DDR2 memory interfaces and LVDS signaling. Typical applications include high-performance digital signal processing, telecom line cards, video broadcasting infrastructure, military/aerospace signal processing, and ASIC prototyping. Designers choose this device when high logic density and generous on-chip memory are required but the premium -C5 speed grade or industrial -I temperature range is unnecessary. A practical design consideration is power and thermal management at high toggle rates: Stratix II FPGAs benefit from intelligent power-aware compilation and proper thermal relief on the FBGA land pattern. Verify that your PCB footprint matches Altera's 484-pin FBGA land pattern exactly, as FBGA packages offer no mechanical compliance margin. This page synthesizes current distributor pricing, drop-in alternatives, and design notes that complement the official datasheet.
EP2S60F484C4N - Stratix II FPGA 60K LE 484-FBGA | Intel (Altera)
The Intel (Altera) EP2S60F484C4N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package, fabricated on a 90 nm CMOS process and operating from a 1.2 V core supply. It delivers 60,440 logic elements (LEs), 2,544,192 bits of embedded RAM (M4K/M512/RAM blocks combined), and 334 user I/Os, targeting high-performance DSP, telecommunications, and ASIC-prototyping workloads. According to the manufacturer datasheet, the device integrates up to 36 embedded DSP blocks (18x18 multipliers) and supports configuration via passive serial, fast passive parallel, and JTAG modes with built-in decryption for IP protection. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Within the broader hierarchy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. FPGAs bridge the gap between fixed-function ASICs and software-defined processing: unlike microcontrollers that execute sequential firmware, FPGAs implement true hardware parallelism, achieving deterministic latency and very high throughput for pipelined datapaths, signal processing, and protocol bridging. The Stratix II architecture specifically introduced an adaptive logic module (ALM) with 8 inputs and an 8-bit fracturable look-up table (LUT), giving it roughly 25% higher logic utilization than the prior Stratix generation. Key differentiating features of the EP2S60F484C4N include a maximum internal clock frequency up to 711.24 MHz per the manufacturer datasheet, support for external memory interfaces up to DDR2/DDR SDRAM with dedicated PHY hardware, and a high-speed I/O fabric supporting LVDS, LVPECL, and SSTL signaling. The device also integrates phase-locked loops (PLLs) for clock management, with up to 12 PLLs available for clock multiplication, division, and phase shifting across multiple clock domains. The 484-FBGA package exposes 334 user I/O pins plus dedicated configuration, clock, and JTAG pins, enabling dense board-level integration without sacrificing signal integrity. Typical applications include high-speed digital signal processing (radar, software-defined radio), 10 Gbps data aggregation and protocol bridging, ASIC prototyping and emulation, high-end imaging and video processing pipelines, and telecom line-card implementations. The wide logic capacity and embedded multiplier count make it particularly attractive for designs requiring parallel filter banks, FFTs, and convolutional processing. When designing with the EP2S60F484C4N, engineers should plan thermal dissipation carefully: at full utilization the device can dissipate several watts through the FBGA substrate, requiring thermal vias and a multi-layer PCB stack-up to keep junction temperatures within the 0-85 C commercial range. Decoupling must follow Altera's recommended guidelines with multiple bulk and high-frequency capacitors placed directly under the BGA footprint. This page synthesizes distributor pricing snapshots, pin-compatible Stratix II family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single-source decision view as of 2026-09-09.
EP2S60F484C5 - Stratix II FPGA 60K LE 484-FBGA | Altera / Intel
The Altera (now Intel) EP2S60F484C5 is a member of the Stratix II family of high-performance FPGAs built on a 90 nm CMOS process, offering 60,440 logic elements (LEs), 2,544,192 bits of embedded memory, and 334 user I/Os in a 484-ball FineLine BGA (FC-FBGA) package. The device integrates 24176 configurable logic blocks (CLBs) across 3022 logic array blocks (LABs) and is supplied from a 1.2 V core rail with a maximum internal operating frequency around 609 MHz according to manufacturer datasheet summaries. The C5 speed grade places this part in the commercial temperature range with a balance of performance and cost for non-extreme-speed designs. Stratix II devices feature adaptive logic modules (ALMs), TriMatrix embedded memory blocks, DSP blocks, and dedicated high-speed I/O support including LVDS, making them suitable for high-throughput data-path and signal-processing applications. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, embedded memory, DSP slices, and programmable interconnect that can be reconfigured by the customer after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices), and they are widely used for ASIC prototyping, DSP acceleration, high-speed serial interfaces, and glue logic where time-to-market or post-production flexibility justifies their higher unit cost versus fixed-function ASSPs. The Stratix II family specifically targets high-density, performance-driven applications and is architecturally positioned between older Stratix and later Stratix III/IV families within Altera's high-end product tree. Key features of the EP2S60F484C5 include 60,440 LEs, 2,544,192 RAM bits organized into TriMatrix memory blocks, dedicated 18x18 multipliers and DSP blocks, 12 PLLs for clock management, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, PCI, PCI-X), and JTAG-based IEEE 1149.1 boundary-scan testing. The 484-pin FC-FBGA package measures 23 x 23 mm with a 1.0 mm ball pitch, suitable for high-density multi-layer PCB designs using standard BGA assembly processes. The Stratix II architecture uses an 8-input adaptive logic module (ALM) rather than the 4-input LUT found in earlier families, allowing more logic to be packed into each block and improving effective utilization. Combined with the 90 nm process, the architecture delivers high performance per watt while supporting up to 1 Gbps I/O on certain pins and embedded transceivers on selected package options. Designers typically use Quartus II development software to compile, synthesize, place, and route designs targeting this device. Typical applications for EP2S60F484C5 include high-speed digital signal processing (radar, software-defined radio, baseband), telecom line-card packet processing, ASIC prototyping for ASICs in the 100K-300K gate range, high-speed data-acquisition front-ends, video and imaging pipelines, and industrial control systems requiring parallel arithmetic. Designers migrating from earlier Stratix devices benefit from the larger LE count and richer DSP/memory ratio for signal-processing-centric designs. When designing with EP2S60F484C5, pay close attention to the FPGA's power-up sequencing requirements - VCCINT, VCCPD, and VCCA must rise monotonically within specific timing windows defined by Altera AN-351. Decoupling capacitors (typically 0.1 uF and 10 uF per rail) should be placed adjacent to each power pin, and the JTAG chain must be accessible for in-system programming. The C5 speed grade is appropriate when the design's critical path is below ~250 MHz; for higher speeds choose C6 or migrate to Stratix III/IV families. This page synthesizes distributor pricing, drop-in alternatives, application notes, and practical design notes not typically aggregated on a single manufacturer page - complementing the official Altera Stratix II Device Handbook.
EP2S60F484C5N - 60K LE Stratix II FPGA, 484-FBGA | Intel
The Intel (Altera) EP2S60F484C5N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package. It integrates 60,440 equivalent logic elements, 2,544,192 bits of embedded RAM, 334 maximum user I/O pins, and operates across an industrial-junction temperature grade (C5 speed grade, commercial). A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable I/O, all interconnected by a routed fabric. Stratix II sits in the FPGA taxonomy as: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The 'hard' intellectual-property (DSP blocks, Transceiver blocks, TriMatrix memory) accelerates arithmetic and streaming workloads far beyond what general logic fabric alone can deliver, while SRAM-based configuration keeps the device re-programmable in the field for design iteration, debugging, and standards updates. Key features include 12 dedicated Transceiver blocks (up to 6.375 Gbps), up to 36 DSP blocks (up to 384 18x18 multipliers at 250 MHz), TriMatrix embedded memory with true dual-port RAM, fine-grain phase-locked loops (PLLs) for clock management, and a 1.2V core supply with multi-voltage I/O support (1.5V/1.8V/2.5V/3.3V LVTTL/LVCMOS). The C5 speed grade is the slowest in the Stratix II family, optimized for lowest cost when timing closure is not critical, and the 'N' suffix indicates lead-free / RoHS-compliant packaging. Stratix II devices use a 90 nm CMOS process with 1.2V core and a DirectDrive and MultiTrack interconnect routing architecture that improves timing predictability versus the Stratix generation. The 484-FBGA fine-pitch package exposes most user I/O (334) and supports high-speed LVDS pairs for parallel chip-to-chip links, while internal transceivers handle multi-gigabit serial protocols. Typical applications include high-performance digital signal processing (radar, software-defined radio), ASIC prototyping and emulation, high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet), industrial imaging and video processing, and communications infrastructure baseband units. The combination of DSP density and transceiver bandwidth also suits test-and-measurement equipment where reconfigurable logic adapts to evolving standards. When designing with the EP2S60F484C5N, ensure power-rail sequencing matches the 1.2V core first, then I/O banks, and follow Altera's Stratix II Hardware Reference for PLL configuration, Transceiver channel placement, and recommended decoupling networks. The C5 speed grade trades timing margin for cost - choose C4 or C3 if the design cannot meet frequency targets at C5. This page synthesizes distributor pricing, parameter-grade drop-in alternatives, and Stratix II design guidance not collected on a single manufacturer page.