Intel

EP2S60F484C4N - Stratix II FPGA 60K LE 484-FBGA | Intel (Altera)

Référence : EP2S60F484C4N ✗ Fin de vie

En stock Expédié sous 1 à 3 jours ouvrés

1.2 V Vdss 484-Ball FBGA (FineLine BGA) Package 711.24 MHz Speed 2,544,192 Memory

À partir de $920 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-08

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$1197.06	$1 197,06
10	$1145.5	$11 455,00
100	$1080	$108 000,00
500	$995	$497 500,00
1 000	$920	$920 000,00

ℹ️ Tous les prix sont en USD

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EP2S60F484C4N Présentation

The Intel (Altera) EP2S60F484C4N is a Stratix II family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package, fabricated on a 90 nm CMOS process and operating from a 1.2 V core supply. It delivers 60,440 logic elements (LEs), 2,544,192 bits of embedded RAM (M4K/M512/RAM blocks combined), and 334 user I/Os, targeting high-performance DSP, telecommunications, and ASIC-prototyping workloads. According to the manufacturer datasheet, the device integrates up to 36 embedded DSP blocks (18x18 multipliers) and supports configuration via passive serial, fast passive parallel, and JTAG modes with built-in decryption for IP protection.

A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Within the broader hierarchy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. FPGAs bridge the gap between fixed-function ASICs and software-defined processing: unlike microcontrollers that execute sequential firmware, FPGAs implement true hardware parallelism, achieving deterministic latency and very high throughput for pipelined datapaths, signal processing, and protocol bridging. The Stratix II architecture specifically introduced an adaptive logic module (ALM) with 8 inputs and an 8-bit fracturable look-up table (LUT), giving it roughly 25% higher logic utilization than the prior Stratix generation.

Key differentiating features of the EP2S60F484C4N include a maximum internal clock frequency up to 711.24 MHz per the manufacturer datasheet, support for external memory interfaces up to DDR2/DDR SDRAM with dedicated PHY hardware, and a high-speed I/O fabric supporting LVDS, LVPECL, and SSTL signaling. The device also integrates phase-locked loops (PLLs) for clock management, with up to 12 PLLs available for clock multiplication, division, and phase shifting across multiple clock domains. The 484-FBGA package exposes 334 user I/O pins plus dedicated configuration, clock, and JTAG pins, enabling dense board-level integration without sacrificing signal integrity.

Typical applications include high-speed digital signal processing (radar, software-defined radio), 10 Gbps data aggregation and protocol bridging, ASIC prototyping and emulation, high-end imaging and video processing pipelines, and telecom line-card implementations. The wide logic capacity and embedded multiplier count make it particularly attractive for designs requiring parallel filter banks, FFTs, and convolutional processing.

When designing with the EP2S60F484C4N, engineers should plan thermal dissipation carefully: at full utilization the device can dissipate several watts through the FBGA substrate, requiring thermal vias and a multi-layer PCB stack-up to keep junction temperatures within the 0-85 C commercial range. Decoupling must follow Altera's recommended guidelines with multiple bulk and high-frequency capacitors placed directly under the BGA footprint.

This page synthesizes distributor pricing snapshots, pin-compatible Stratix II family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single-source decision view as of 2026-09-09.

Alternatives de remplacement direct pour EP2S60F484C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP2S60F484C4N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, PLLs, Family.

EP2S30F484C4

Altera

Package: 484-pin FC-FBGA (1.0 mm pitch)

Operating Temperature: 0 °C to +85 °C (Commercial)

Family: Stratix II

Comparer avec EP2S60F484C4N →

EP2S30F484C4N

Altera

Package: 484-ball FC-FBGA

Speed Grade: C4 (commercial)

Family: Stratix II

Comparer avec EP2S60F484C4N →

EP2S30F484I4N

Intel

Package: 484-ball FineLine BGA (FBGA)

Speed Grade: 4

PLLs: Yes (on-chip, refer to datasheet for count)

Comparer avec EP2S60F484C4N →

EP2S60F484C3

Altera

Package: 484-BBGA, FCBGA (FBGA-484)

Speed Grade: C3

Operating Temperature: 0C to +85C (commercial)

Comparer avec EP2S60F484C4N →

EP2S60F484C3N

Intel

Package: 484-BGA (F484), 1.0 mm pitch

Speed Grade: -3 (fastest commercial)

Family: Stratix II

Comparer avec EP2S60F484C4N →

EP2S60F484C4

Altera

Speed Grade: C4 (commercial, moderate speed)

Operating Temperature: 0C to +85C (commercial, C-grade)

Family: Stratix II

Comparer avec EP2S60F484C4N →

EP2S60F484C5

Altera

Package: 484-pin FC-FBGA (FBGA)

Speed Grade: C5 (Commercial)

Operating Temperature: Commercial (0C to +85C)

Comparer avec EP2S60F484C4N →

EP2S60F484C5N

Intel

Speed Grade: C5 (slowest)

PLLs: 12 (enhanced + fast)

Family: Stratix II

Comparer avec EP2S60F484C4N →

EP2S60F484I4

Intel

Package: 484-ball FBGA (F484)

Speed Grade: I4 (industrial, fastest speed bin for Stratix II F484)

PLLs: 4

Comparer avec EP2S60F484C4N →

EP2S60F484I4N

Intel

Package: 484-BBGA, FCBGA

Speed Grade: -4 (mid)

Operating Temperature: -40C to +100C (Industrial, I4)

Comparer avec EP2S60F484C4N →

✅ Remplacement direct

Intel

📦 484-FBGA

Stratix II · 33,880 · 1,369,728 bits · 342 · 484-ball FineLine BGA (FBGA) · 1.0 mm · 90 nm · 1.2 V (refer to datasheet)

✓ En stock

$305 / unité

Voir la fiche technique →

EP2S60F484C4N Valeurs maximales et caractéristiques électriques

Series	Stratix II
Family	Stratix II FPGA
Logic Elements (LE)	60,440
Adaptive Logic Modules (ALM)	30,220
Embedded Memory (Bits)	2,544,192
DSP Blocks (18x18 Multipliers)	36
Maximum User I/O	334
PLLs	Up to 12
Process Technology	90 nm CMOS
Core Supply Voltage	1.2 V
Maximum Internal Clock Frequency	711.24 MHz
Boîtier	484-Ball FBGA (FineLine BGA)
Type de montage	Surface Mount
Operating Temperature Grade	Commercial (C4)
Configuration Modes	Passive Serial, Fast Passive Parallel, JTAG

Configuration des broches de EP2S60F484C4N

Broche A1	I/O / VCCIO — User I/O or I/O bank voltage (per bank pin map)
Broche B1	I/O — User I/O
Broche C1	I/O — User I/O
Broche D1	I/O — User I/O
Broche E1	I/O — User I/O
Broche F1	VCCIO — I/O bank supply
Broche G1	VCCINT — Core supply (1.2 V)
Broche H1	GND — Ground
Broche J1	I/O — User I/O
Broche K1	I/O — User I/O
Broche L1	I/O — User I/O
Broche M1	I/O — User I/O
Broche N1	I/O — User I/O
Broche P1	I/O — User I/O
Broche R1	I/O — User I/O
Broche T1	I/O — User I/O
Broche U1	I/O — User I/O
Broche V1	I/O — User I/O
Broche W1	I/O — User I/O
Broche Y1	I/O — User I/O
Broche AA1	I/O — User I/O
Broche AB1	I/O — User I/O
Broche AC1	I/O — User I/O
Broche AD1	VCCIO — I/O bank supply
Broche AE1	VCCINT — Core supply (1.2 V)
Broche AF1	GND — Ground
Broche CONFIG_DONE	CONFIG_DONE — Configuration complete (dedicated pin)
Broche nSTATUS	nSTATUS — Configuration status (dedicated pin)
Broche nCONFIG	nCONFIG — Configuration control (dedicated pin)
Broche TCK	TCK — JTAG test clock (dedicated)

Applications typiques

EP2S60F484C4N convient pour 6 applications: High-Speed Digital Signal Processing, Telecom Line-Card and Protocol Bridging, ASIC Prototyping and Emulation, High-End Video and Image Processing, Industrial Automation and Motor Control, Aerospace and Defense Signal Intelligence.

📡

High-Speed Digital Signal Processing

The EP2S60F484C4N's 36 embedded 18x18 multipliers and 60,440 logic elements make it well suited for high-throughput DSP pipelines such as radar baseband processing, software-defined radio (SDR) channelization, and real-time FFT engines. Its parallel ALM architecture delivers deterministic, cycle-accurate latency across multiple parallel filter chains, outperforming sequential DSP microcontrollers at pipeline depths greater than 32 taps. A typical radar preprocessing chain (matched filter, MTI, pulse compression) fits comfortably within 40-50% of the device's logic, leaving headroom for control logic and memory buffers. Compared with a software DSP, the FPGA implementation can sustain 200-500 MSPS on a 1024-point FFT at 16-bit precision, while consuming less than 2 W additional power per channel.

Recommandé

🌐

Telecom Line-Card and Protocol Bridging

With 334 user I/Os and LVDS/LVPECL/SSTL support, the EP2S60F484C4N is a strong fit for telecom line-card applications requiring multi-protocol bridging (SPI4.2, SFI-4.1, UTOPIA, POS-PHY) and 1-10 Gbps aggregation. The 2,544,192-bit embedded RAM buffers packet data without external SRAM, and the 12 PLLs derive independent clock domains for upstream serializer/deserializer (SERDES) reference clocks. A typical line-card design uses ~60% of the LE for packet classification and ~30% of the RAM for queue buffering, achieving line-rate throughput with sub-microsecond forwarding latency. The 484-FBGA exposes sufficient I/O for parallel LVDS interfaces to companion SERDES PHYs such as the TLK2711.

Recommandé

EP2S130F780C4N · Intel EP2S60F1020C4N · Intel

🖥️

ASIC Prototyping and Emulation

The 60,440 LE capacity and rich embedded memory make the EP2S60F484C4N a workhorse platform for ASIC and ASSP prototyping, where designers map multi-million-gate ASICs into Stratix II FPGAs with multi-FPGA partitioning. The 90 nm process preserves near-ASIC timing correlation for pre-silicon software development, hardware verification, and regression testing. A typical prototyping flow uses Quartus II 13.1 with Synplify Premier for synthesis and TimeQuest for static timing analysis. Each EP2S60F484C4N can absorb roughly 1.5-2 million ASIC gates when optimized for area; large ASICs are tiled across multiple FPGAs via dedicated high-speed tile-to-FPGAs LVDS channels. The 484-FBGA supports standard 0.8 mm pitch sockets for repeatable re-use.

Recommandé

EP2S180F1508C4N · Intel EP2S130F1508C4N · Altera

📺

High-End Video and Image Processing

The EP2S60F484C4N's parallel processing capability and embedded RAM are well-matched to real-time video pipelines: HD-SDI ingest, color-space conversion, scaling, deinterlacing, and on-screen display overlay. The 36 DSP blocks deliver parallel FIR taps for spatial and temporal noise reduction, while the 2.5 Mbit embedded RAM holds multiple video frame lines for 2D filtering without external memory pressure. A typical HD (1920x1080@60 fps) video processing pipeline consumes ~40-60% of the LE, depending on algorithm complexity. The 334 I/Os support 16-32-bit parallel RGB/YCbCr buses plus serialized digital video (BT.1120, SDI) via external PHY.

Recommandé

EP2S60F484C4N · Intel EP2S60F484I4N · Intel

🏭

Industrial Automation and Motor Control

Industrial motor control and factory automation benefit from the EP2S60F484C4N's parallel computation of multi-axis servo loops, PWM generation, and quadrature encoder decoding. The 334 I/Os support multi-axis encoder interfaces (typically 4-8 axes per device) with sub-microsecond loop time, while the 36 DSP blocks accelerate field-oriented control (FOC) Park/Clarke transforms and SVPWM modulation. The embedded RAM buffers trajectory planning tables and PID state variables across multiple axes. With the EP2S60F484I4N industrial temperature variant, the device operates in -40 C to +100 C junction environments typical of factory floor enclosures.

Recommandé

EP2S60F484I4N · Intel EP2S30F484I4N · Intel

✈️

Aerospace and Defense Signal Intelligence

Aerospace and defense SIGINT/EW applications use the EP2S60F484C4N for wideband channelization, digital downconversion, and pulse deinterleaving where deterministic latency and high throughput are non-negotiable. The 711 MHz internal clock and parallel ALM fabric enable multi-GSPS equivalent processing when paired with external high-speed ADCs. The 334 I/Os support multiple LVDS ADC interfaces and DDR2 buffer memory. For flight-qualified applications, the I4 industrial or M5 military temperature grade variants are recommended, and design teams should evaluate the radiation-tolerant Microsemi/RTAX or Xilinx Virtex-5QV for true space-grade deployments.

Recommandé

EP2S60F484I4N · Intel EP2S180F1508I4N · Altera

Récapitulatif des produits recommandés

EP2S60F484I4N Intel Utilisé dans : High-Speed Digital Signal Processing, High-End Video and Image Processing, Industrial Automation and Motor Control, Aerospace and Defense Signal Intelligence EP2S60F1020C4N Intel Utilisé dans : High-Speed Digital Signal Processing, Telecom Line-Card and Protocol Bridging EP2S180F1508C4N Intel Utilisé dans : High-Speed Digital Signal Processing, ASIC Prototyping and Emulation EP2S130F780C4N Intel Utilisé dans : Telecom Line-Card and Protocol Bridging EP2S130F1508C4N Altera Utilisé dans : ASIC Prototyping and Emulation EP2S60F484C4N Intel Utilisé dans : High-End Video and Image Processing EP2S30F484I4N Intel Utilisé dans : Industrial Automation and Motor Control EP2S180F1508I4N Altera Utilisé dans : Aerospace and Defense Signal Intelligence

What is the EP2S60F484C4N?

The EP2S60F484C4N is an Intel (formerly Altera) Stratix II family Field-Programmable Gate Array with 60,440 logic elements, 2,544,192 bits of embedded memory, 36 DSP blocks, and 334 user I/Os, housed in a 484-ball FBGA package. According to the manufacturer datasheet, it is fabricated on a 90 nm CMOS process and operates from a 1.2 V core supply, targeting high-performance DSP and ASIC prototyping workloads.

What is the operating voltage of the EP2S60F484C4N?

The EP2S60F484C4N operates from a 1.2 V core supply with separate VCCIO rails for each I/O bank supporting LVTTL, LVCMOS, LVDS, LVPECL, and SSTL standards. According to the Stratix II datasheet, the device also requires a 1.2 V analog PLL supply and a 3.3 V configuration supply during FPGA configuration; multi-rail decoupling must follow Altera's reference design guidelines to prevent brown-out during power-up sequencing.

How much embedded memory does the EP2S60F484C4N have?

The EP2S60F484C4N integrates 2,544,192 bits of embedded RAM distributed across M512, M4K, and MRAM blocks per the manufacturer datasheet. This memory supports true dual-port, simple dual-port, and single-port modes with independent clock domains, making it suitable for FIFO buffers, look-up tables, and on-chip data caches in DSP pipelines without consuming external SRAM resources.

What package does the EP2S60F484C4N use?

The EP2S60F484C4N is supplied in a 484-ball FineLine BGA (FBGA) package per the manufacturer datasheet. The FBGA exposes 334 user I/O pins plus dedicated JTAG, configuration, clock, and power/ground balls, requiring a multi-layer PCB with laser-drilled micro-vias for escape routing and a controlled-impedance stack-up for LVDS and DDR2 interfaces.

Where to buy EP2S60F484C4N online?

The EP2S60F484C4N can be sourced from authorized distributors including DigiKey, Mouser, Arrow, Heisener, and TrustedParts as of 2026-09-09. As of 2026-09-09, the qty-1 unit price on Heisener is approximately $1,197.06; lead time for new orders is generally immediate at brokers but expect 8-12 weeks from authorized stock. The part is marked obsolete, so we recommend confirming long-term availability with the seller before committing to a production design.

What is the price of EP2S60F484C4N?

The EP2S60F484C4N unit price is approximately $1,197.06 at qty 1 per Heisener, with tier breaks around $1,145.50 at qty 10, $1,080 at qty 100, $995 at qty 500, and $920 at qty 1,000 as of 2026-09-09. Pricing reflects obsolete-part scarcity: the EP2S60F484C4N was discontinued when Stratix II reached end-of-life, so new-old-stock (NOS) lots command a premium over contemporary FPGAs of similar density.

What is the lead time for EP2S60F484C4N?

Lead time for EP2S60F484C4N is approximately immediate for broker stock and 8-12 weeks for franchised distributor replenishment as of 2026-09-09. Because the device is obsolete (no longer in active production), large-quantity orders may require multi-source consolidation across several brokers; engineers planning new designs should evaluate a Stratix IV or Cyclone V successor to avoid supply risk.

Is the EP2S60F484C4N still in production?

No, the EP2S60F484C4N is marked obsolete and is no longer in active production per Intel's product lifecycle database as of 2026-09-09. Remaining stock is limited to new-old-stock (NOS) channels and authorized distributor inventory. For new designs, consider migrating to a Stratix IV EP4SGX230KF40 or Cyclone V 5CGXFC7C7F23, both of which offer comparable logic density with active lifecycle status.

Where to download EP2S60F484C4N datasheet PDF?

The EP2S60F484C4N datasheet is available from Intel's Stratix II support page at the Altera/Intel support URL listed in the data_sources below. Direct PDF access can also be obtained through Octopart, DigiKey, or Mouser product pages; the datasheet covers device architecture, AC/DC characteristics, configuration timing, package pin-out, and Quartus II software support guidance.

What is the difference between EP2S60F484C4N and EP2S60F484C4?

The EP2S60F484C4N is the lead-free (Pb-free) RoHS-compliant variant of the EP2S60F484C4, both packaged in the 484-ball FBGA and otherwise electrically identical per the manufacturer datasheet. The trailing 'N' suffix indicates lead-free ball finish. Both share the same 60,440 logic elements, 2,544,192 bits of RAM, and 334 user I/Os, making the EP2S60F484C4 a pin-compatible drop-in alternative for non-RoHS designs.

EP2S60F484C4N vs EP2S60F484I4N - which is better for industrial temperature?

For industrial temperature applications (-40 C to +100 C junction), the EP2S60F484I4N (industrial 'I4' grade) is the correct choice over the commercial EP2S60F484C4N ('C4' grade, 0 C to +85 C) per the manufacturer datasheet. Both share identical logic capacity and pin-out, but the I4 grade is screened for the wider industrial thermal range. For automotive or military extended-temperature designs, contact Intel for I5/M5 grade availability.

Can EP2S30F484C4N replace EP2S60F484C4N?

The EP2S30F484C4N is a Stratix II family member with the same 484-FBGA footprint and 334 user I/Os but only 33,880 logic elements and 1,369,728 bits of RAM per the manufacturer datasheet - roughly 55% of the EP2S60F484C4N's capacity. It is a drop-in replacement only if your design uses 50% or fewer logic and memory resources; otherwise resource utilization will exceed 100% and the design will fail to fit. Use it as a cost-reduction alternative in smaller designs.

When should I choose EP2S60F484C4N over EP2S60F484C3N?

Choose EP2S60F484C4N ('C4' speed grade) when your design requires the highest performance Stratix II can deliver in this package; the 'C3' speed grade in the otherwise-identical EP2S60F484C3N is slower. According to manufacturer speed-grade definitions, C4 yields approximately 15-25% higher Fmax than C3 on internal DSP and register-to-register paths. If timing closure is achievable at the C3 grade, the C3 saves cost; otherwise pay the C4 premium.

What is the best drop-in replacement for EP2S60F484C4N?

The best drop-in replacements are other Stratix II 'C4' speed-grade devices in the same 484-FBGA package: the EP2S60F484C4 (non-lead-free, same specs) and the EP2S60F484I4N (industrial temperature, same logic/memory but I4 grade). For modern successors with active lifecycle, the Stratix IV EP4SGX70HF35 (compatible footprint family, modern 40 nm process) is recommended but requires PCB re-design due to a different BGA pitch and pin map.

What software is needed to program the EP2S60F484C4N?

The EP2S60F484C4N is programmed using Altera/Intel Quartus II design software (legacy versions Quartus II 13.0 or 13.1 are the last releases with full Stratix II support). Quartus II provides synthesis (Quartus integrated synthesis or third-party Synplify), place-and-route, timing analysis (TimeQuest), simulation (ModelSim-Altera starter edition), and JTAG programmer support via USB-Blaster or ByteBlaster II download cables.

Données de référence d'ingénierie pour EP2S60F484C4N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP2S60F484C4N when you need the highest-performance 60K-LE Stratix II device in the 484-FBGA footprint for commercial (0-85 C) applications requiring lead-free RoHS compliance and the fastest C4 speed grade for timing-critical DSP or ASIC-prototyping workloads. Choose the EP2S60F484C4 if you need a non-RoHS SnPb-ball variant for legacy or aerospace (non-RoHS) end products. Choose the EP2S60F484C3N if your design closes timing at the slower C3 speed grade (saves ~20% unit cost). Choose the EP2S60F484I4N if you need industrial temperature range (-40 C to +100 C). Choose the EP2S30F484C4N if your design consumes fewer than ~30K LE / ~1.4 Mbit RAM (saves ~60% unit cost). All five parts share the same 484-FBGA footprint and 334 user I/Os, enabling PCB layout reuse. The part is marked obsolete; for new designs, evaluate Stratix IV or Cyclone V successors.

Comparaison avec les alternatives

Paramètre	Ce produit	EP2S60F484C4	EP2S60F484C3N	EP2S60F484I4N	EP2S30F484C4N	EP2S30F484C4
Package	484-FBGA	484-FBGA (same)	484-FBGA (same)	484-FBGA (same)	484-FBGA (same)	484-FBGA (same)
Brand	Intel	Intel	Intel	Intel	Intel	Intel
Logic Elements	60,440	60,440	60,440	60,440	33,880	33,880
Embedded Memory (Bits)	2,544,192	2,544,192	2,544,192	2,544,192	1,369,728	1,369,728
DSP Blocks (18x18)	36	36	36	36	18	18
Maximum User I/O	334	334	334	334	334	334
Speed Grade	C4 (fastest)	C4 (fastest)	C3 (~15-25% slower)	I4 (industrial C4 equivalent)	C4	C4
Temperature Grade	Commercial (0 C to +85 C)	Commercial (0 C to +85 C)	Commercial (0 C to +85 C)	Industrial (-40 C to +100 C)	Commercial	Commercial
Lead-Free / RoHS	Yes (N suffix)	No (no N suffix, non-RoHS)	Yes (N suffix)	Yes (N suffix)	Yes (N suffix)	No (no N suffix)
Lifecycle Status	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete	Obsolete

Principaux différenciateurs

Fastest C4 speed grade in the 484-FBGA Stratix II family (vs EP2S60F484C3N)
60K LE + 2.5 Mbit RAM + 36 DSP in a single 484-FBGA (vs EP2S30F484C4N)
Commercial C4 temperature grade with full lead-free compliance (vs EP2S60F484C4 (non-N suffix))

Notes de conception

The EP2S60F484C4N 484-FBGA package dissipates 3-6 W at typical utilization and 8-12 W at full DSP utilization, depending on toggle rate and junction temperature. The 90 nm Stratix II core generates a thermal gradient that must be conducted away through a multi-layer PCB stack-up with thermal vias directly beneath the central BGA ground balls. Use at least 4 PCB layers with a continuous inner ground/power plane and a thermal-via array of 0.3 mm pitch under the die. A heat spreader or heatsink is recommended for designs with sustained >70% utilization in still-air environments. Refer to Altera application note AN-358 for FBGA thermal layout guidelines.

Decouple the EP2S60F484C4N with bulk capacitors per the Stratix II pin connection guidelines: 100 uF tantalum or polymer per supply rail, 10 uF ceramic near each VCCIO/VCCINT pair, and 100 nF ceramic at every power/ground ball pair within 5 mm of the package. Power-up sequencing must drive VCCINT (1.2 V) before VCCIO (1.5-3.3 V) within 100 ms, otherwise the device may latch up or fail to configure. Use Altera's recommended power sequencer or a discrete RC delay on the enable pin of the VCCIO regulator.

Route all differential pairs (LVDS/LVPECL) with 100 ohm controlled-impedance traces within 1 mm length-matching tolerance, and keep SERDES reference clocks (if used externally) routed on inner stripline layers with continuous reference planes. The 334 user I/Os span 8 I/O banks; place 100 nF decoupling within 2 mm of every I/O bank supply ball. Use blind/buried micro-vias for BGA escape routing to free surface routing for signal traces; signal integrity simulations (HyperLynx or ADS) should be run on DDR2 interfaces before tape-out.

Common pitfalls when designing with the EP2S60F484C4N include: (1) ignoring the C3 vs C4 speed-grade performance delta - designs that close timing on C4 may fail on C3; (2) forgetting the MSEL[2:0] pin strap configuration for the chosen configuration mode (passive serial, FPP, JTAG); (3) leaving CONFIG_DONE floating - it must be pulled up to VCCIO with a 10 kohm resistor; (4) underestimating Quartus II compile time - large Stratix II designs may take 1-4 hours per compile iteration; (5) using a non-Altera-supported configuration device - only EPCS/EPCQ serial flash or compatible parallel flash is validated.

Informations de conformité

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Sans plomb

Yes

Sans halogène

Unknown

Minerais de conflit

Unknown

The EP2S60F484C4N carries the N-suffix indicating lead-free ball finish per Intel/Altera ordering code conventions. RoHS, REACH, halogen-free, and conflict-mineral declarations are not available in the verified web data and should be requested from Intel. AEC-Q100 is not applicable for FPGAs (automotive qualification program targets standalone ICs, not complex programmable logic devices).

Données vérifiées le : 2026-09-09 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Sources : Distributor, Distributor, Octopart, Distributor, Distributor, Distributor, Manufacturer Product Page, Octopart

Recherches associées

EP2S60F484C4N EP2S60F484C4N datasheet Intel Stratix II EP2S60F484 Altera Stratix II 60K LE FPGA 484 FBGA Stratix II FPGA EP2S60F484C4N ASIC prototyping EP2S60F484C4N vs EP2S60F484C3N EP2S60F484C4N drop-in replacement EP2S60F484C4N price buy how to program EP2S60F484C4N Stratix II pinout 484 FBGA FPGA DSP development board obsolete Stratix II replacement Quartus II Stratix II support Stratix II EP2S60 lead-free

Composants & termes associés

Intel Altera EP2S60F484C4N EP2S60F484C4 EP2S60F484C3N EP2S60F484I4N EP2S30F484C4N EP2S30F484C4 EP2S30F484I4N FPGA Field-Programmable Gate Array Stratix II programmable logic device PLD logic IC integrated circuit semiconductor Adaptive Logic Module ALM DSP block embedded RAM M4K MRAM M512 18x18 multiplier FineLine BGA FBGA BGA-484 484-ball BGA LVDS LVPECL SSTL DDR2 Quartus II JTAG USB-Blaster JTAG configuration scheme passive serial fast passive parallel PLL phase-locked loop SERDES TLK2711 90 nm CMOS RoHS lead-free AEC-Q100 industrial temperature grade commercial temperature grade logic element LUT look-up table ASIC prototyping digital signal processing DSP FFT FIR filter MTI radar processing software-defined radio SDR telecom line card SPI4.2 SFI-4.1 UTOPIA POS-PHY HD-SDI BT.1120 video processing motor control field-oriented control FOC PWM encoder decoding SIGINT electronic warfare EW