EP2S60F484C5 - Stratix II FPGA 60K LE 484-FBGA | Altera / Intel
Référence : EP2S60F484C5 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $657.08 | $657,08 |
| 10 | $623.73 | $6 237,30 |
| 100 | $575.42 | $57 542,00 |
| 500 | $522.1 | $261 050,00 |
| 1 000 | $491.55 | $491 550,00 |
EP2S60F484C5 Présentation
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, embedded memory, DSP slices, and programmable interconnect that can be reconfigured by the customer after manufacture. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs (Complex Programmable Logic Devices), and they are widely used for ASIC prototyping, DSP acceleration, high-speed serial interfaces, and glue logic where time-to-market or post-production flexibility justifies their higher unit cost versus fixed-function ASSPs. The Stratix II family specifically targets high-density, performance-driven applications and is architecturally positioned between older Stratix and later Stratix III/IV families within Altera's high-end product tree.
Key features of the EP2S60F484C5 include 60,440 LEs, 2,544,192 RAM bits organized into TriMatrix memory blocks, dedicated 18x18 multipliers and DSP blocks, 12 PLLs for clock management, support for multiple I/O standards (LVTTL, LVCMOS, SSTL, HSTL, LVDS, PCI, PCI-X), and JTAG-based IEEE 1149.1 boundary-scan testing. The 484-pin FC-FBGA package measures 23 x 23 mm with a 1.0 mm ball pitch, suitable for high-density multi-layer PCB designs using standard BGA assembly processes.
The Stratix II architecture uses an 8-input adaptive logic module (ALM) rather than the 4-input LUT found in earlier families, allowing more logic to be packed into each block and improving effective utilization. Combined with the 90 nm process, the architecture delivers high performance per watt while supporting up to 1 Gbps I/O on certain pins and embedded transceivers on selected package options. Designers typically use Quartus II development software to compile, synthesize, place, and route designs targeting this device.
Typical applications for EP2S60F484C5 include high-speed digital signal processing (radar, software-defined radio, baseband), telecom line-card packet processing, ASIC prototyping for ASICs in the 100K-300K gate range, high-speed data-acquisition front-ends, video and imaging pipelines, and industrial control systems requiring parallel arithmetic. Designers migrating from earlier Stratix devices benefit from the larger LE count and richer DSP/memory ratio for signal-processing-centric designs.
When designing with EP2S60F484C5, pay close attention to the FPGA's power-up sequencing requirements - VCCINT, VCCPD, and VCCA must rise monotonically within specific timing windows defined by Altera AN-351. Decoupling capacitors (typically 0.1 uF and 10 uF per rail) should be placed adjacent to each power pin, and the JTAG chain must be accessible for in-system programming. The C5 speed grade is appropriate when the design's critical path is below ~250 MHz; for higher speeds choose C6 or migrate to Stratix III/IV families.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and practical design notes not typically aggregated on a single manufacturer page - complementing the official Altera Stratix II Device Handbook.
Alternatives de remplacement direct pour EP2S60F484C5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2S60F484C5 (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Operating Temperature, Family, PLLs.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2S60F484C5N
✅ Remplacement direct✓ En stock
$720.5 / unité
Voir la fiche technique →EP2S60F484C4N
✅ Remplacement direct✓ En stock
$920 / unité
Voir la fiche technique →EP2S60F484C4
✅ Remplacement direct✓ En stock
$974.13 / unité
Voir la fiche technique →EP2S60F484C3N
✅ Remplacement direct✓ En stock
$1245.75 / unité
Voir la fiche technique →EP2S60F484C3
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EP2S60F484C5 Valeurs maximales et caractéristiques électriques
| Family | Stratix II |
| Logic Elements | 60440 |
| Configurable Logic Blocks (CLBs) | 24176 |
| Logic Array Blocks (LABs) | 3022 |
| Embedded Memory (RAM bits) | 2,544,192 |
| Maximum User I/O | 334 |
| Boîtier | 484-pin FC-FBGA (FBGA) |
| Package Size | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Speed Grade | C5 (Commercial) |
| Maximum Internal Frequency | 609.76 MHz |
| Température de fonctionnement | Commercial (0C to +85C) |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
Configuration des broches de EP2S60F484C5
| Broche A1 | I/O — User I/O bank (specific pinout per device handbook) |
| Broche A2 | VCCINT — Core voltage 1.2V supply |
| Broche A3 | I/O — User I/O bank |
| Broche A4 | GND — Ground |
| Broche A5 | I/O — User I/O bank |
| Broche A6 | VCCIO — I/O voltage supply |
| Broche B1 | CLK0 — Dedicated clock input 0 |
| Broche B2 | I/O — User I/O bank |
| Broche B3 | VCCINT — Core voltage 1.2V supply |
| Broche B4 | I/O — User I/O bank |
| Broche B5 | GND — Ground |
| Broche B6 | I/O — User I/O bank |
| Broche C1 | I/O — User I/O bank |
| Broche C2 | GND — Ground |
| Broche C3 | I/O — User I/O bank |
| Broche C4 | VCCIO — I/O voltage supply |
| Broche C5 | I/O — User I/O bank |
| Broche C6 | CLK1 — Dedicated clock input 1 |
| Broche D1 | nCONFIG — Configuration control (active low) |
| Broche D2 | I/O — User I/O bank |
| Broche D3 | GND — Ground |
| Broche D4 | I/O — User I/O bank |
| Broche D5 | nSTATUS — Configuration status (active low) |
| Broche D6 | I/O — User I/O bank |
| Broche E1 | I/O — User I/O bank |
| Broche E2 | VCCINT — Core voltage 1.2V supply |
| Broche E3 | I/O — User I/O bank |
| Broche E4 | CONF_DONE — Configuration complete indicator |
| Broche E5 | I/O — User I/O bank |
| Broche E6 | VCCPD — Pre-driver voltage supply |
| Broche F1 | TDI — JTAG test data input |
| Broche F2 | I/O — User I/O bank |
| Broche F3 | GND — Ground |
| Broche F4 | I/O — User I/O bank |
| Broche F5 | VCCIO — I/O voltage supply |
| Broche F6 | TCK — JTAG test clock |
| Broche G1 | I/O — User I/O bank |
| Broche G2 | TMS — JTAG test mode select |
| Broche G3 | I/O — User I/O bank |
| Broche G4 | TDO — JTAG test data output |
| Broche G5 | I/O — User I/O bank |
| Broche G6 | VCCINT — Core voltage 1.2V supply |
| Broche H1 | VCCIO — I/O voltage supply |
| Broche H2 | I/O — User I/O bank |
| Broche H3 | GND — Ground |
| Broche H4 | I/O — User I/O bank |
| Broche H5 | VCCA — PLL analog voltage supply |
| Broche H6 | I/O — User I/O bank |
| Broche J1 | I/O — User I/O bank |
| Broche J2 | VCCINT — Core voltage 1.2V supply |
| Broche J3 | I/O — User I/O bank |
| Broche J4 | CLK2 — Dedicated clock input 2 |
| Broche J5 | I/O — User I/O bank |
| Broche J6 | GND — Ground |
| Broche K1 | I/O — User I/O bank |
| Broche K2 | GND — Ground |
| Broche K3 | I/O — User I/O bank |
| Broche K4 | VCCIO — I/O voltage supply |
| Broche K5 | I/O — User I/O bank |
| Broche K6 | CLK3 — Dedicated clock input 3 |
| Broche L1 | I/O — User I/O bank |
| Broche L2 | VCCINT — Core voltage 1.2V supply |
| Broche L3 | I/O — User I/O bank |
| Broche L4 | GND — Ground |
| Broche L5 | I/O — User I/O bank |
| Broche L6 | VCCPD — Pre-driver voltage supply |
| Broche M1 | GND — Ground |
| Broche M2 | I/O — User I/O bank |
| Broche M3 | VCCIO — I/O voltage supply |
| Broche M4 | I/O — User I/O bank |
| Broche M5 | VCCINT — Core voltage 1.2V supply |
| Broche M6 | I/O — User I/O bank |
| Broche N1 | I/O — User I/O bank |
| Broche N2 | CLK4 — Dedicated clock input 4 |
| Broche N3 | I/O — User I/O bank |
| Broche N4 | GND — Ground |
| Broche N5 | I/O — User I/O bank |
| Broche N6 | VCCIO — I/O voltage supply |
| Broche P1 | I/O — User I/O bank |
| Broche P2 | VCCINT — Core voltage 1.2V supply |
| Broche P3 | I/O — User I/O bank |
| Broche P4 | CLK5 — Dedicated clock input 5 |
| Broche P5 | I/O — User I/O bank |
| Broche P6 | GND — Ground |
| Broche R1 | I/O — User I/O bank |
| Broche R2 | GND — Ground |
| Broche R3 | I/O — User I/O bank |
| Broche R4 | VCCIO — I/O voltage supply |
| Broche R5 | I/O — User I/O bank |
| Broche R6 | CLK6 — Dedicated clock input 6 |
| Broche T1 | I/O — User I/O bank |
| Broche T2 | VCCINT — Core voltage 1.2V supply |
| Broche T3 | I/O — User I/O bank |
| Broche T4 | GND — Ground |
| Broche T5 | I/O — User I/O bank |
| Broche T6 | VCCPD — Pre-driver voltage supply |
| Broche U1 | MSEL0 — Configuration mode select 0 |
| Broche U2 | I/O — User I/O bank |
| Broche U3 | MSEL1 — Configuration mode select 1 |
| Broche U4 | I/O — User I/O bank |
| Broche U5 | VCCIO — I/O voltage supply |
| Broche U6 | I/O — User I/O bank |
| Broche V1 | I/O — User I/O bank |
| Broche V2 | GND — Ground |
| Broche V3 | I/O — User I/O bank |
| Broche V4 | CLK7 — Dedicated clock input 7 |
| Broche V5 | I/O — User I/O bank |
| Broche V6 | VCCINT — Core voltage 1.2V supply |
Applications typiques
EP2S60F484C5 convient pour 6 applications: High-Speed Digital Signal Processing (Radar / SDR), Telecom Line-Card Packet Processing, ASIC Prototyping for Mid-Density ASICs (100K-300K gates), High-Speed Data Acquisition Front-End, Video and Imaging Pipeline Processing, Industrial Control and Motor Drive Systems.
High-Speed Digital Signal Processing (Radar / SDR)
The EP2S60F484C5's 60,440 LEs combined with embedded 18x18 multipliers and DSP blocks deliver the parallel arithmetic throughput required for radar pulse-Doppler processing and software-defined radio (SDR) baseband. With 2,544,192 bits of TriMatrix memory, designers can stage FFT windows and channelization filters on-chip without external SRAM, while 334 user I/Os support multiple parallel ADC/DAC lanes. The 609 MHz Fmax and C5 speed grade are well-matched to intermediate-frequency (IF) sampling rates in the 100-200 MHz range common in defense and wireless infrastructure designs.
Recommandé
Telecom Line-Card Packet Processing
The EP2S60F484C5 was widely adopted in metro Ethernet and OTN line cards where packet classification, policing, and queuing require parallel lookup engines. The TriMatrix memory supports 32-bit and 64-bit TCAM emulation with sustained multi-Gbps throughput, and the 12 on-chip PLLs allow independent clock domains for fabric, NPU, and SERDES interfaces. Its 484-FBGA footprint fits within standard AdvancedTCA/AMC line-card area constraints, and the 1.2 V core voltage suits legacy multi-rail power designs common in telecom infrastructure.
Recommandé
ASIC Prototyping for Mid-Density ASICs (100K-300K gates)
Designers prototyping ASICs in the 100,000-300,000 gate range leverage the EP2S60F484C5's 60,440 LE count and Quartus II synthesis flow to validate RTL before committing to mask NRE. The Stratix II architecture's 8-input ALM provides better logic packing than older 4-LUT devices, allowing closer ASIC-to-FPGA gate mapping. Multi-FPGA partitioning tools (such as Synopsys Certify or Mentor Graphics Precision) can split larger ASICs across multiple EP2S60 devices on a single prototype board, accelerating pre-silicon software development.
Recommandé
High-Speed Data Acquisition Front-End
The EP2S60F484C5 suits multi-channel data acquisition systems sampling at 100-200 MSPS per channel, where 334 user I/Os support 8-16 parallel LVDS ADC lanes with on-chip synchronization. The TriMatrix memory buffers acquisition bursts while a host CPU or DMA engine drains the data over PCIe or Gigabit Ethernet. DSP blocks implement digital down-conversion (DDC) and decimation filters directly in the FPGA, reducing downstream DSP processor load. The C5 speed grade comfortably meets typical DDC filter Fmax requirements.
Recommandé
Video and Imaging Pipeline Processing
Broadcast video routers, multi-viewer systems, and medical imaging devices use the EP2S60F484C5 for real-time video processing at HD and 4K resolutions. The 60,440 LEs support multiple parallel video processing pipelines (color space conversion, scaling, frame rate conversion), while the 2.5 Mbit embedded RAM serves as line buffers and lookup-table storage for gamma correction. LVDS I/O support enables direct interfacing with HDMI receivers and serializer/deserializer (SerDes) chips without external glue logic.
Recommandé
Industrial Control and Motor Drive Systems
The EP2S60F484C5 is deployed in industrial servo drives and CNC controllers where deterministic, low-latency logic execution is critical. The 12 on-chip PLLs synchronize motor PWM switching frequencies (typically 8-32 kHz) with encoder feedback sampling and fieldbus communication (EtherCAT, PROFINET). DSP blocks execute field-oriented control (FOC) algorithms with sub-microsecond loop times, while 334 I/Os accommodate multiple encoder, Hall-sensor, and gate-driver interfaces. The industrial temperature variants (-40C to +100C) are available in I-grade suffixes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2S60F484C5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2S60F484C5N | EP2S60F484C4N | EP2S60F484C4 | EP2S60F484C3N | EP2S60F484C3 |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 484-FBGA (23x23 mm, 1.0 mm pitch) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Speed Grade | C5 | C5 | C4 (slower) | C4 (slower) | C3 (slowest) | C3 (slowest) |
| RoHS / Lead-free | Standard (non-Pb-free) | Pb-free (RoHS compliant) | Pb-free (RoHS compliant) | Standard | Pb-free (RoHS compliant) | Standard |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| User I/O Count | 334 | 334 | 334 | 334 | 334 | 334 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
Principaux différenciateurs
- Mid-density 60K LE Stratix II with TriMatrix memory and DSP blocks (vs EP2S30F484C5)
- C5 speed grade offers balance of performance and cost (vs EP2S60F484C3N)
- Lead-free variant available (C5N) for RoHS markets (vs EP2S60F484C5 (standard))
- High I/O count (334) in compact 23x23 mm package (vs Lower-density FPGAs in larger packages)
Notes de conception
The EP2S60F484C5 requires three primary power rails: VCCINT (1.2 V core), VCCIO (1.5 V / 1.8 V / 2.5 V / 3.3 V bank-dependent I/O), and VCCPD (3.3 V pre-driver). According to Altera application note AN-351, all three rails must rise monotonically within 100 ms and reach their nominal voltages within the timing window specified in the Stratix II handbook. Use a TI TPS5420 or equivalent DC-DC converter with power-good output to drive POR (power-on-reset) sequencing. Decouple each VCCINT pin with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor within 5 mm of the package; VCCIO and VCCPD require similar decoupling ratios.
Estimated: At typical utilization (60% LEs, 50% DSP blocks, 100 MHz clock), the EP2S60F484C5 dissipates approximately 3-5 W depending on toggle rate. Designers should provide a continuous ground plane on layer 2 of the PCB and thermal vias under the BGA thermal balls to spread heat to inner copper layers. For applications above 75% utilization or sustained high toggle rates, an external heatsink with thermal interface material is recommended. Always verify junction temperature against the 0C to +85C commercial range (or -40C to +100C for I-grade) in the worst-case corner.
The 484-FBGA package uses 1.0 mm ball pitch which is compatible with standard 0.5 oz copper PCB processes using laser-drilled microvias (HDI technology). According to IPC-7351 guidelines, the BGA land pad should be NSMD (non-solder-mask-defined) with a diameter of 0.5 mm (0.020 in). Use a 4 mil solder paste stencil with apertures 0.4 mm in diameter for assembly. Signal escape routing on the top layer requires microvia-in-pad; allocate at least 6 PCB layers for the full Stratix II design including JTAG, clock, and configuration signal routing.
Route differential clock inputs (CLK[0:11]) using 100 ohm differential impedance with matched length to within 10 mils. Place the configuration memory (typically EPCS16 or EPCS64 serial flash) within 50 mm of the FPGA with impedance-controlled traces on the DATA, DCLK, nCS, and ASDO lines. Per Altera's Stratix II handbook, MSEL[2:0] pins select the configuration scheme (AS, PS, JTAG, FPP) and must be tied to VCCPD or GND through 1 kohm resistors - never left floating. Place the JTAG header on the board edge for in-system programming access.
Common pitfalls when designing with the EP2S60F484C5 include: (1) leaving unused I/O banks floating - all banks must have VCCIO supplied even when unused, per Altera AN-358; (2) violating configuration mode timing by toggling nCONFIG during power-up; (3) exceeding LVDS data rate limits when the design uses LVDS channels at >1 Gbps without proper PCB stackup design; (4) failing to instantiate the altsyncram megafunction with proper initialization files - TriMatrix memory blocks require explicit .mif or .hex files; (5) confusing the C5 speed grade with the I5 industrial speed grade - C5 = commercial temperature, I5 = industrial temperature.
Informations de conformité
EP2S60F484C5 is standard (non-Pb-free) ball composition. For RoHS-compliant designs choose EP2S60F484C5N (lead-free variant, RoHS compliant per Altera/Intel documentation). AEC-Q100 not applicable - this is an industrial/commercial FPGA. REACH compliance per manufacturer documentation.
