FPGA & CPLD
Produits (6666)
10M50SCE144A7G - MAX 10 FPGA 50KLE 144-LQFP | Intel
The Intel 10M50SCE144A7G is a MAX 10 family field-programmable gate array (FPGA) featuring 50,000 logic elements, 1,677,312 bits of embedded user flash memory, and 101 user I/O pins in a 144-pin LQFP Exposed Pad (EQFP) package with industrial-grade temperature rating. Built on TSMC's 55nm NOR-flash + SRAM process, the device integrates a non-volatile configuration flash, 2x PLLs, 1x 12-bit ADC block, and 2x I/O banks, providing true single-chip programmability without an external boot ROM. The 144-LQFP-EP package supports hand-solderable prototyping and is the largest density offered in the MAX 10 E144 footprint family. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that belongs to the broader hierarchy of digital semiconductors: FPGA -> programmable logic -> logic IC -> integrated circuit. Unlike ASICs (Application Specific Integrated Circuits) which are factory-fixed, FPGAs use configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the engineer programs via HDL (Hardware Description Language) to implement custom digital functions, glue logic, state machines, and parallel processing pipelines. The MAX 10 line specifically targets low-cost, non-volatile, instant-on applications where microcontrollers alone lack the I/O count or parallel throughput but full Cyclone/Stratix FPGAs are oversized. Key differentiating features of the 10M50SCE144A7G include its 50KLE logic density (the maximum available in the MAX 10 family), 16 KBytes of user flash inside the die, 2.5 Mb embedded SRAM, 1.6 Mb of flash for configuration plus 64 Kb user-accessible flash, 12-bit 1-MSPS ADC with 16 analog inputs on select variants, and dual supply options for analog and digital rails. The device supports LPDDR2, DDR3, and LPDDR3 external memory interfaces via soft IP, making it well suited to video bridging and industrial HMI. The EQFP-144 exposed pad provides a thermal resistance of approximately 12-15 C/W with a properly soldered thermal pad, enabling reliable operation up to 100 C junction temperature in the industrial -40C to +100C ambient range. Architecturally, the 10M50SCE144A7G uses a Look-Up Table (LUT)-based fabric of 3,125 LABs (Logic Array Blocks), each containing 16 logic elements, fed by a global and regional routing network. Configuration is stored in on-chip flash that loads at power-up in less than 5 ms, eliminating external boot PROM requirements that earlier CPLD/FPGA families needed. This instant-on capability, combined with the dual-configuration flash region, supports fail-safe field updates - critical for industrial control and automotive aftermarket designs. Typical applications include industrial motor control and PLC I/O expansion, video processing and image aggregation for surveillance systems, factory automation bridges between legacy parallel buses and modern Ethernet/USB, automotive infotainment rear-seat displays, and consumer IoT gateway hubs. The integrated 12-bit ADC also suits battery management and analog sensor aggregation in motor-drive designs. Designers should pay particular attention to the LQFP-144 exposed-pad soldering requirements: a 4x4 thermal via array beneath the exposed pad is mandatory to meet the package's thermal specifications. Quartus Prime Lite or Standard software is required for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in alternatives across the MAX 10 E144 family, and practical design notes not consolidated in any single manufacturer datasheet or distributor listing.
1SG280HH2F55E2VG - Stratix 10 GX FPGA 2.8M Logic 1160 I/O | Altera
The Altera (Intel) 1SG280HH2F55E2VG is a Stratix 10 GX field-programmable gate array (FPGA) with 2,800,000 logic elements (2.8M cells), 1160 user I/O, and Intel 14nm Tri-Gate FinFET technology, housed in a 2912-ball FCBGA (2912-BBGA) package with 1 mm ball pitch operating from a 1.8V auxiliary supply. An FPGA is a reprogrammable semiconductor device that implements digital logic through configurable lookup tables, registers, embedded memory blocks, and hard IP blocks such as transceivers and processor subsystems. Within the programmable logic hierarchy, the Stratix 10 GX sits at the high end: FPGA -> programmable logic device -> programmable SoC/system semiconductor, positioned above mid-range families like the Intel Agilex entry tiers and Cyclone families for bandwidth-intensive designs. Key features include the 14nm process node delivering roughly 2x core performance over previous-generation 20nm FPGAs, embedded 28.3 Gbps (GX family) transceivers for high-speed serial links, and a rich fabric of adaptive logic modules, M20K memory blocks, and hardened DSP blocks for multiply-accumulate intensive processing. The E2 speed grade balances performance and static power, and the extended temperature option indicated by the OPN suffix targets demanding industrial and communications environments. Architecturally, Stratix 10 uses the second-generation HyperFlex architecture with flip-flops distributed throughout the routing fabric, enabling core clock frequencies well beyond earlier high-end FPGAs and shortening critical paths for data-flow pipelines. The 1SG280 die density places it mid-range within the Stratix 10 GX lineup, offering a strong logic-to-transceiver ratio for protocol bridging, co-processing, and board-level integration. Typical applications include 5G and wireless baseband, data center acceleration cards, broadcast video infrastructure, high-performance test and measurement instruments, and radar/signal-processing platforms where 1160 I/O and multi-hundred-Gbps serial bandwidth are required. A key design consideration is power delivery and thermal management: a 2.8M-logic 14nm FPGA in a 2912-ball BGA typically requires multi-rail power sequencing, core-voltage regulators rated for tens of amps, and a thermal solution validated with Intel's power estimation tools before layout sign-off. This page synthesizes distributor availability, same-family drop-in ordering-part-number alternatives, and practical design notes not consolidated in the manufacturer datasheet.
1SG280HN2F55E2VG - Stratix 10 GX FPGA 2.8M LC 2912-BGA | Intel
The Intel (Altera) 1SG280HN2F55E2VG is a Stratix 10 GX field-programmable gate array (FPGA) with approximately 2,800,000 logic elements, 1160 user I/Os, and a 14 nm Tri-Gate FinFET process, housed in a 2912-ball FCBGA (2912-BBGA, F55 speed grade) package. An FPGA (field-programmable gate array) is a semiconductor device containing a matrix of configurable logic blocks (CLBs) connected by programmable interconnects, allowing designers to implement custom digital hardware after manufacturing. FPGAs sit above fixed-function ASICs and below general-purpose processors in the programmable-logic hierarchy, occupying the power management and system-on-chip ecosystem as reconfigurable computing fabrics. The Stratix 10 GX family integrates high-performance 28.3 Gbps transceivers, hardened DSP blocks with floating-point support, and a second-generation hyperegister architecture delivering roughly 2x core performance over previous-generation high-end FPGAs. The E2VG marking denotes a extended standard commercial temperature range (0C to 100C junction), while the F55 speed grade balances performance with power efficiency. The HN2 suffix identifies the supply-voltage and transceiver variant of the 1SG280 die in the 2912-ball package with 1.0 mm ball pitch. Typical applications include 5G wireless baseband and fronthaul, data center acceleration and compute offload, high-bandwidth test and measurement instruments, broadcast video processing, and radar/signal-processing chains requiring massive parallel DSP throughput. The 1160 I/O bank architecture supports a wide range of memory and interface standards. Design considerations: the 2912-ball FCBGA requires careful PCB stackup planning with controlled-impedance layers, robust power distribution network (PDN) design, and Intel-recommended decoupling; power estimation with the Intel Early Power Estimator is essential before layout freeze. This page synthesizes distributor listings, family-variant drop-in options, and practical design guidance not consolidated in the manufacturer datasheet.
2VM3104 - Versal Prime Gen 2 Adaptive SoC | AMD | 23x23mm
The AMD 2VM3104 is a Versal Prime Series Gen 2 adaptive SoC designed for space-constrained embedded applications such as Pro AV, broadcast, and industrial IoT. It integrates a quad-core Arm Cortex-A78AE application processing unit (APU) with programmable logic, delivering up to 100K DMIPS of scalar compute in a compact 23 x 23 mm package. This device is part of AMD's second-generation Versal Prime family, which offers up to 10x scalar compute performance compared to previous adaptive SoCs. An adaptive SoC (System-on-Chip) combines a processor subsystem (PS) with programmable logic (PL) on a single device, enabling hardware acceleration and flexible I/O. The Versal Prime Series Gen 2 targets embedded systems requiring high compute density and low latency, bridging the gap between traditional FPGAs and application-specific standard products (ASSPs). The 2VM3104 is positioned as an entry point for customers evaluating the Versal Prime Gen 2 family, with availability expected in 2027. Key features of the 2VM3104 include a quad-core Arm Cortex-A78AE APU with 64 KB L1 cache, a 23 x 23 mm package that is 27% smaller than previous second-generation Versal Prime devices, and higher programmable logic density per square millimeter compared to similarly sized 8-core devices. The device supports up to 100K DMIPS of scalar compute, making it suitable for real-time control and signal processing. Technically, the 2VM3104 leverages AMD's advanced process technology to achieve a balance of power efficiency and performance. The programmable logic fabric allows custom accelerators, while the APU handles general-purpose computing. The compact package enables designs with reduced board area, critical for space-constrained systems. Typical applications include Pro AV equipment (video processing, audio mixing), broadcast infrastructure (encoding, transcoding), and industrial IoT gateways (edge computing, machine vision). The device's small footprint and high compute density make it ideal for these markets. When designing with the 2VM3104, consider thermal management due to the high compute density in a small package. Adequate cooling and power delivery are essential to maintain performance and reliability.
2VM3254 - Versal Prime Gen 2 Adaptive SoC | AMD
The AMD 2VM3254 is a Versal Prime Series Gen 2 adaptive SoC designed for space-constrained embedded applications. It integrates a 4-core Arm Cortex-A78AE application processor with programmable logic, delivering up to 100K DMIPS of scalar compute in a compact 23x23mm package. This device is part of AMD's Versal Prime Gen 2 family, which offers up to 10X scalar compute performance compared to previous generations. An adaptive SoC (System-on-Chip) combines a hardened application processor (like Arm Cortex-A78AE) with programmable logic (FPGA fabric) and customizable engines on a single device. This architecture allows designers to implement both software-defined and hardware-accelerated functions, bridging the gap between traditional microprocessors and FPGAs. The Versal Prime Series Gen 2 targets embedded systems requiring high compute density, low latency, and flexible I/O. Key features of the 2VM3254 include a 23x23mm package (27% smaller than the previous minimum), 4-core Cortex-A78AE processor, and support for Pro AV, broadcast, and industrial IoT applications. The device provides high programmable logic density per square millimeter, enabling complex designs in compact form factors. It also supports the Versal Prime Gen 2 ecosystem, including design tools and early access programs. Technically, the 2VM3254 leverages AMD's adaptive compute acceleration platform (ACAP) architecture, combining scalar engines (Arm cores), adaptable engines (programmable logic), and intelligent engines (AI cores) with a network-on-chip (NoC) interconnect. This heterogeneous architecture allows concurrent execution of software and hardware tasks, optimizing performance per watt for edge applications. Typical applications include Pro AV video processing, broadcast infrastructure, industrial IoT gateways, and edge AI systems. The compact package makes it ideal for space-constrained designs where board area is critical. The device also serves as an entry point for customers evaluating Versal Prime Gen 2 before migrating to larger devices like the 2VM3654. When designing with the 2VM3254, consider the power delivery network (PDN) requirements for the multi-rail SoC, including core, I/O, and memory voltages. Use AMD's power estimation tools and reference designs to optimize decoupling and thermal management in the 23x23mm package.
2VM3358 - Versal Prime Gen 2 Adaptive SoC | AMD
The AMD 2VM3358 is a Versal Prime Series Gen 2 adaptive SoC, featuring 8 Arm Cortex-A78AE application cores and 10 Cortex-R52 real-time cores. This device delivers up to 10x scalar compute compared to previous AMD Versal or Zynq UltraScale+ adaptive SoCs, making it a high-performance heterogeneous computing platform for demanding embedded applications. The 2VM3358 is part of the earliest Versal Prime Gen 2 devices, alongside the 2VM3858 and 2VM3558, and is available in the SFVA1089 package. An adaptive SoC (System-on-Chip) is a heterogeneous computing device that combines programmable logic (FPGA fabric) with hardened processing subsystems, including application processors, real-time processors, and various I/O interfaces. In the Versal architecture, the scalar engines (Cortex-A78AE and Cortex-R52) handle general-purpose and real-time processing, while the programmable logic provides custom hardware acceleration. This hierarchy enables a single device to replace multiple discrete components, reducing system complexity and power consumption. Key features of the 2VM3358 include 8 Arm Cortex-A78AE application cores for high-performance Linux or RTOS applications, 10 Cortex-R52 real-time cores for deterministic, low-latency control tasks, and the Versal adaptive architecture that allows hardware acceleration to be tailored to specific workloads. The device supports up to 10x scalar compute performance versus prior generations, enabling advanced AI, signal processing, and control applications in a single chip. Technically, the 2VM3358 leverages AMD's advanced process technology and the Versal platform's integrated design tools, including Vitis and Vivado. The device's heterogeneous architecture allows developers to partition workloads between scalar processing, programmable logic, and dedicated AI engines (if present in the specific variant). The SFVA1089 package provides a high-density interconnect, supporting high-speed transceivers and memory interfaces for system-level integration. Typical applications for the 2VM3358 include avionics, factory automation, building automation, grid infrastructure, and other industrial or aerospace systems requiring high compute density and real-time responsiveness. The device's combination of scalar performance and programmable logic makes it suitable for edge computing, machine vision, and motor control applications. When designing with the 2VM3358, consider the power consumption of the smallest system configuration, as documented in AMD's support forums. Proper thermal management and power supply design are critical due to the device's high performance and integration level. The SFVA1089 package requires careful PCB layout to manage signal integrity and power distribution.
2VM3454 - Versal Prime Gen 2 Adaptive SoC | AMD
The AMD 2VM3454 is a Versal Prime Series Gen 2 adaptive SoC designed for space-constrained embedded applications such as Pro AV, broadcast, and industrial IoT. It integrates a quad-core Arm Cortex-A78AE application processor, six real-time Arm Cortex-R52 cores, and a Mali-G78AE GPU, delivering up to 100K DMIPS of scalar compute in a compact 23 x 23 mm package. This device is part of AMD's second-generation Versal Prime family, which offers up to 10x scalar compute performance compared to existing adaptive SoCs. An adaptive SoC (System-on-Chip) combines programmable logic (FPGA fabric) with a hardened processor subsystem (PS) and other dedicated engines on a single device. This architecture allows designers to implement custom hardware accelerators in the programmable logic while running complex software on the application cores, bridging the gap between traditional FPGAs and application processors. The Versal Prime Series Gen 2 targets embedded systems requiring high compute density, low latency, and flexible I/O. Key features of the 2VM3454 include the quad-core Cortex-A78AE with 64 KB L1 cache, six Cortex-R52 real-time cores, and a Mali-G78AE GPU. The device is available in a 23 x 23 mm package, enabling compact PCB designs. It supports up to 100K DMIPS of scalar compute, making it suitable for real-time processing and AI inference at the edge. The Versal architecture provides a unified design environment with AMD Vivado and Vitis tools. Technically, the 2VM3454 leverages AMD's advanced 7nm-class process technology, offering a balance of performance and power efficiency. The programmable logic fabric supports high-speed transceivers and flexible I/O standards, while the processor subsystem handles complex control and data processing tasks. The device includes integrated security features and supports functional safety for industrial and automotive applications. Typical applications include Pro AV video processing, broadcast infrastructure, industrial IoT gateways, and edge AI systems. The compact package and high compute density make it ideal for space-constrained designs where performance and power efficiency are critical. When designing with the 2VM3454, consider the power delivery network and thermal management. The device requires multiple voltage rails and adequate decoupling. Use the AMD power estimator tool to calculate power consumption and design the thermal solution accordingly.
2VM3558 - Versal Prime Gen2 Adaptive SoC | AMD
The AMD 2VM3558 is a Versal Prime Series Gen 2 Adaptive SoC, part of the second-generation Versal family that integrates Arm Cortex-A78AE application processors, Cortex-R52 real-time processors, and programmable logic in a single device. It is designed for high-performance embedded applications requiring up to 10x scalar compute compared to previous Versal or Zynq UltraScale+ devices. The 2VM3558 is available in the SSVA1440 package, offering a balance of logic density, I/O, and transceiver capabilities for mid-range designs. An Adaptive SoC is a heterogeneous computing platform that combines scalar processing (Arm cores), adaptable hardware (FPGA fabric), and intelligent engines (DSP, AI) on a single chip. This architecture allows hardware acceleration to be customized post-manufacturing, enabling performance and efficiency gains over fixed-function SoCs. The Versal Prime Gen2 series targets embedded systems where flexibility, performance, and long-term adaptability are critical. Key features of the 2VM3558 include 8 Arm Cortex-A78AE application cores and 10 Cortex-R52 real-time cores, delivering up to 10x scalar compute versus prior generations. It supports PCIe Gen5, 4GB LPDDR5x memory, and GTYP transceivers up to 32Gbps, making it suitable for high-bandwidth data movement. The device also includes a Video Codec Unit and Image Signal Processor, enabling advanced media processing. With up to 1188K logic cells and 543K LUTs, it provides substantial programmable logic resources. Technically, the 2VM3558 leverages AMD's 7nm process technology and advanced packaging to integrate multiple dies, including the programmable logic, processing system, and transceivers. The SSVA1440 package offers a high pin count for extensive I/O and memory interfaces. The device supports industrial temperature ranges (-40°C to +85°C) and is designed for reliability in harsh environments. Typical applications include avionics, defense, industrial automation, and edge computing, where the combination of high-performance scalar processing and adaptable hardware is essential. The 2VM3558 is also used in system-on-modules (SoMs) for rapid prototyping and deployment. When designing with the 2VM3558, consider power delivery complexity: the device requires multiple voltage rails (e.g., 0.85V core, 1.8V I/O) and careful sequencing. Use AMD's power management reference designs and ensure adequate decoupling for high-speed transceivers.
5962-9851001NTB - Military FPGA, 22K Gates | AMD Xilinx
The 5962-9851001NTB is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx, designed for demanding aerospace and defense applications. It features 1296 Configurable Logic Blocks (CLBs) and an equivalent gate count of 22,000, with a maximum usable gate count of 65,000. The device is packaged in a 240-pin FQFP (Fine-pitch Quad Flat Package) with gull-wing terminals, and operates over the full military temperature range of -55°C to +125°C. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and general-purpose processors in the digital logic hierarchy. They offer reconfigurability, parallel processing, and rapid prototyping capabilities, making them essential in applications where flexibility and time-to-market are critical. Key features of the 5962-9851001NTB include its military temperature grade, high-reliability qualification to MIL-PRF-38535 QML, and a maximum clock frequency of 166 MHz. The device provides 3078 logic cells and supports a wide range of I/O standards, enabling integration with various system interfaces. The FQFP package offers a compact footprint with 0.5 mm pitch, suitable for space-constrained military electronics. Technically, the 5962-9851001NTB is based on Xilinx's mature FPGA architecture, featuring a sea-of-gates structure with configurable logic blocks interconnected by programmable routing. This architecture allows designers to implement complex digital systems, including state machines, DSP functions, and communication protocols. The device is supported by Xilinx's ISE design suite, which provides synthesis, place-and-route, and bitstream generation tools. Typical applications include military avionics, satellite communication systems, radar signal processing, and secure communication equipment. Its high reliability and extended temperature range make it suitable for harsh environments where commercial-grade components would fail. When designing with this FPGA, careful attention must be paid to power supply decoupling and signal integrity, as the high-speed I/O and internal logic can generate significant switching noise. Proper PCB layout with multiple ground planes and bypass capacitors is essential for reliable operation.
5AGXMA3D4F27I5G - Arria V GX FPGA, 156K LE, 672-FCBGA | Intel
The Intel (formerly Altera) 5AGXMA3D4F27I5G is a member of the Arria V GX field-programmable gate array (FPGA) family, integrating approximately 156,000 logic elements, 11,746,304 bits of embedded memory, and 336 general-purpose I/Os in a 672-ball flip-chip BGA (FCBGA) package built on TSMC's 28 nm low-power process. Per the manufacturer part description, this industrial-temperature-grade device operates from a 1.1 V core supply and is offered in a 27 x 27 mm body with a 2.7 mm seated height, making it appropriate for space-constrained embedded systems. An FPGA (field-programmable gate array) is a semiconductor device whose digital logic fabric, interconnect, and I/O behavior are defined by user-supplied configuration data after manufacturing, allowing engineers to implement custom hardware pipelines, parallel processing engines, and interface bridges without an ASIC NRE. FPGAs sit at the top of the programmable-logic taxonomy (programmable logic device -> FPGA -> SRAM-based FPGA -> Arria V family) and compete against microcontrollers, DSPs, and GPUs in latency-sensitive and high-throughput workloads. Key feature highlights of 5AGXMA3D4F27I5G include 156,000 logic elements organized in adaptive logic modules (ALMs), 8 integrated transceivers suitable for multi-gigabit serial links, hard memory controllers, and PCIe Gen2 hard IP blocks. The integrated transceivers support protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, CPRI, and Serial RapidIO, reducing external PHY cost. The flip-chip BGA package provides low-inductance power delivery and superior thermal performance for industrial-temperature operation from -40C to +100C. Architecturally, the Arria V GX uses a logic-economy fabric with 8-input fracturable look-up tables, embedded DSP blocks (each capable of 18x18 or 27x27 multiply-accumulate), and 10.6 Mbit of embedded memory per tile. Configuration is loaded through JTAG, serial flash, or passive parallel interfaces, with bitstream encryption and design-security features available. Typical applications include industrial machine vision and video processing cards, telecom baseband pre-processing, military/aerospace signal processing, and PCIe-based coprocessor cards. The Arria V GX balances transceiver count, logic density, and power for mid-range embedded designs. When designing with this part, plan power-sequencing for the 1.1 V core, 2.5 V/3.3 V auxiliary, and transceiver supplies, and follow Intel's pin-out guidelines for the F27 672-ball package to avoid signal-integrity issues on high-speed serial links. This page synthesizes distributor pricing, the most current 5AGXMA3D4F27I5G inventory data, same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
5AGXMA3D4F31I5G - Arria V GX FPGA, 156K LE, 11.7Mbit, 896-FCBGA | Altera
The Altera 5AGXMA3D4F31I5G is a 156,000-logic-element Arria V GX Field-Programmable Gate Array (FPGA) from the 5AGXA3 F31 device family, built on a 28 nm process and packaged in a 896-ball FineLine Ball-Grid Array (FC-FBGA). It integrates 11,746,304 bits of embedded memory, 416 maximum user I/O, and 24 transceiver channels compliant with the Arria V GX transceiver architecture, operating from a 1.1 V core supply across the industrial temperature range. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, I/O cells, and - in modern families - dedicated hard IP such as transceivers, DSP blocks, and embedded memory. FPGAs sit above fixed-function ASICs and microcontrollers in flexibility and below them in per-unit cost for high volumes, and they occupy a critical tier of the broader programmable logic / semiconductor hierarchy alongside CPLDs and SoC FPGAs. The Arria V GX family specifically targets mid-range applications where transceivers, DSP throughput, and modest power are required. The 5AGXMA3D4F31I5G features 156,000 logic elements, 11,746,304 embedded memory bits, integrated PCI Express Gen2 hard IP, and 24 high-speed transceiver channels supporting protocols such as CPRI, OBSAI, Serial RapidIO, and 10 Gbps backplane. The 28 nm low-power process delivers an attractive performance-per-watt profile for transceiver-rich designs, while the 896-ball FCBGA package exposes 416 user I/O pins. Architecturally, the device combines a hardened transceiver PHY, embedded PCIe Gen2 endpoint blocks, variable-precision DSP blocks, and 8-input adaptive logic modules (ALMs) feeding into a multi-tier routing fabric. The I suffix indicates an industrial temperature grade (-40C to +100C), and the 5 in the speed grade position places it in the speed-grade-5 device bin. Quartus II / Quartus Prime is the design entry and timing-analysis toolchain. Typical applications include wireless baseband processing, software-defined radio, broadcast video infrastructure, industrial machine vision, radar preprocessing, and high-speed serial protocol bridging. The combination of integrated transceivers, PCIe Gen2, and substantial DSP makes it well-suited to telecom infrastructure and high-performance test equipment. When designing, allocate adequate PCB layers for the 896-ball FCBGA break-out, follow Altera's transceiver reference design guidelines for channel reach, and validate thermal solutions against the industrial-grade junction envelope. Designers should also verify Quartus Prime version support for the specific speed grade. This page synthesizes distributor pricing, Arria V GX family variants, drop-in same-package options, and practical design notes not found in the manufacturer datasheet alone.
5AGXMA3D4F31I5N - Arria V GX FPGA, 156K LE, 896-FCBGA | Intel
The Intel (formerly Altera) 5AGXMA3D4F31I5N is a member of the Arria V GX family of mid-range FPGAs, integrating 156000 logic elements, 11746304 bits of embedded memory, and 416 user I/Os in a 896-ball FCBGA package. The device is built on TSMC's 28nm process technology and operates at a core voltage of 1.1V, with the industrial temperature grade (-40C to +100C) encoded in the part suffix. A field-programmable gate array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that the engineer can customize after manufacturing. FPGAs sit between fixed-function ASICs (high NRE, high volume) and software-defined processors (fixed hardware, sequential) in the silicon hierarchy: FPGA -> programmable logic -> reconfigurable computing -> semiconductor. The Arria V GX specifically targets applications requiring high-speed serial transceivers, embedded hard IP blocks, and balanced logic/memory/DSP resources. Key features of the 5AGXMA3D4F31I5N include 5890 logic array blocks (LABs) per the Mouser product summary, integrated PCIe hard IP, up to 9.225 Gbps transceivers, and dedicated DSP blocks for high-throughput signal processing. The 896-ball FCBGA package supports 416 user I/Os with high-speed serial lanes grouped along dedicated banks, allowing simultaneous DDR3 memory interfacing and multi-gigabit serial links. Architecturally, the Arria V GX combines a hard PCIe Gen2 endpoint, hard memory controllers, and up to 36 transceiver channels at data rates suitable for 10G Ethernet, CPRI, and 3G-SDI backhaul. The 28nm process balances static and dynamic power versus cost-per-logic, and the I5 speed grade indicates the slowest commercially available timing closure window, chosen for power-sensitive industrial designs. Typical applications include 10G Ethernet aggregation switches, wireless baseband processing (CPRI/OBSAI fronthaul), military and industrial video processing pipelines, and PCI Express endpoint cards in test/measurement. The part is frequently designed into long-life-cycle embedded systems where an ASIC redesign is economically infeasible. When laying out the 896-FCBGA, allocate a 31mm x 31mm BGA land pattern with microvia stacking for breakout; signal integrity demands reference planes for every transceiver lane. The device requires multiple decoupling rails (0.9V, 1.1V, 1.8V, 2.5V, 3.3V) and a programmable clock tree managed by the Intel Quartus Prime toolchain. This page synthesizes 16-distributor price comparison, parametric side-by-side with same-family Arria V GX alternatives, and PCB design guidance beyond what is found in the manufacturer datasheet.
5CEBA2F17C8N - Cyclone V E FPGA, 25K LE, 256-BGA | Altera
The Altera (Intel) 5CEBA2F17C8N is a Cyclone® V E family field-programmable gate array (FPGA) featuring 25,000 logic elements, 128 user I/O pins, and 2,002,944 bits of embedded memory in a 256-ball FineLine BGA (FBGA-256) package. Operating from a 1.1 V core supply, the device targets low-power, cost-sensitive applications across industrial, automotive, video processing, and communications segments. The Cyclone V E family is built on TSMC's 28 nm low-power process, delivering an optimal balance of logic density, DSP capability, and transceivers for mid-range programmable logic designs. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM, DSP slices, and PLLs. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and digital ICs, enabling hardware-level parallelism that microcontrollers and DSPs cannot match. Unlike fixed-function ASICs, FPGAs are reprogrammable in-system, which makes them ideal for prototyping, low-volume production, and designs requiring late-stage hardware changes. Cyclone V E devices specifically address the cost- and power-optimized tier of the Altera/Intel FPGA portfolio. Key features of the 5CEBA2F17C8N include approximately 66 embedded 18×18 multipliers for DSP workloads, dedicated on-chip memory blocks totaling ~270 Kbits of M10K plus 1,536 Kbits of MLAB RAM, four general-purpose PLLs, and hard memory controller blocks for DDR2/DDR3/LPDDR2 interfaces. The device supports up to 128 general-purpose I/O pins arranged in banks that support multiple single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with hot-socketing capability. The FBGA-256 package provides a compact footprint suitable for space-constrained designs while maintaining signal integrity for high-speed interfaces. Architecturally, the Cyclone V E integrates hardened PCIe Gen2 controllers (in some package variants), embedded transceivers in selected speed grades, and an efficient routing fabric that connects logic, memory, and I/O elements. The 28 nm LP process enables static power consumption below typical 40-45 nm Cyclone IV designs, while the 1.1 V core voltage (VCCINT) keeps dynamic power in check. Configuration is supported via JTAG, serial (AS) flash, or parallel (PS) interfaces, with built-in decompression and encryption options. Typical applications for the 5CEBA2F17C8N include industrial motor control, factory automation I/O expansion, video surveillance image processing, LED video wall driving, software-defined radio baseband, and automotive driver-assistance subsystems. The combination of logic density, memory bandwidth, and DSP blocks makes it well-suited for parallel sensor fusion, image pipeline stages, and protocol bridging. The device is also widely used as a cost-optimized ASIC/ASSP replacement in low-volume production runs where NRE costs are prohibitive. When designing with this Cyclone V E variant, designers must respect the bank-based I/O supply grouping (VCCIO), provide proper decoupling across VCCINT/VCCA/VCCPD rails, and validate timing closure in Quartus Prime at the target speed grade. The -8 speed grade suffix (C8) indicates the slowest commercial speed bin, which simplifies timing closure at the cost of Fmax — pick a -6 or -7 variant if higher performance is required. Configuration scheme selection (EPCS or EPCQ flash) must also be decided early, since the chosen scheme affects board-level pin usage and BOM. This page synthesizes distributor pricing across DigiKey, Mouser, Arrow, LCSC, and Octopart, plus drop-in same-package and family alternatives, comparison parameters, and practical design notes not found in the standalone manufacturer datasheet.
5CEBA2F17I7N - Cyclone V E FPGA, 25K LE, 256-FBGA | Intel
The Intel (formerly Altera) 5CEBA2F17I7N is a low-power, low-cost Cyclone V E Field-Programmable Gate Array (FPGA) housed in a 256-ball FineLine Ball-Grid Array (FBGA) package. Built on TSMC's 28 nm low-power process, the device integrates 25,000 logic elements, 2,002,944 bits of embedded memory, and 156 (18x18) hardware multipliers, delivering an optimal balance of logic capacity, DSP throughput, and power efficiency for cost-sensitive applications. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure digital logic blocks, interconnect, and I/O behavior after manufacture using an HDL-defined bitstream. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs in the digital IC hierarchy, but uniquely offer hardware-level parallelism with re-programmability, making them ideal for interface bridging, custom acceleration, and rapid prototyping before ASIC tape-out. The 5CEBA2F17I7N delivers key features including up to 364 user I/O pins, 66 (18x18) multipliers per device variant (2 per logic array block column), a memory controller with DDR3/LPDDR2 support, and integrated transceiver-free I/O with LVDS, LVCMOS, and SSTL support. The 256-FBGA package offers 1.0 mm ball pitch, making it suitable for space-constrained industrial designs. Architecturally, the Cyclone V E family uses an Adaptive Logic Module (ALM) of 8-input fracturable look-up tables, providing better logic packing than 4-input LUT predecessors. The fabric includes variable-precision DSP blocks, embedded M10K memory blocks, and a hard PCIe Gen2 IP core option. Typical applications include industrial motor control, video processing and image sensor bridging, low-cost software-defined radio front-ends, factory automation I/O expansion, and portable test equipment. The wide temperature range and small package make it well-suited to embedded vision and human-machine interface (HMI) designs. When designing with the 5CEBA2F17I7N, ensure the 256-FBGA PCB land pattern uses 1.0 mm pitch BGA escape routing with microvia stacks. Power sequencing for the core, I/O, and auxiliary rails must follow the Cyclone V PowerPlay guidelines, and decoupling must include 100 nF and 10 uF ceramic capacitors adjacent to every supply pin. This page synthesizes distributor pricing, drop-in Cyclone V E family alternatives, and practical design notes not aggregated in a single manufacturer document.
5CEBA2U15I7 - Cyclone V E FPGA, 25K LE, 324-BGA | Intel
The Intel (formerly Altera) 5CEBA2U15I7 is a Cyclone V E family Field-Programmable Gate Array (FPGA) built on TSMC's 28 nm low-power process, integrating 25,000 logic elements, 2002 Kbits of embedded memory, and 176 user I/O pins in a 324-ball UFBGA (also documented as 324-LFBGA) package. The device operates from a 1.1 V core supply with dedicated phase-locked loops for clock management, embedded multipliers, and a hard memory controller block for DDR2/DDR3/LPDDR2 external memory interfaces. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that combines configurable logic blocks (LCLBs), programmable interconnect, and dedicated hard IP such as transceivers, PLLs, and memory controllers. FPGAs sit at the top of the digital logic hierarchy: ASIC -> CPLD -> FPGA -> programmable SoC, and are widely used for parallel processing, hardware acceleration, and glue logic in applications where time-to-market, reprogrammability, and high I/O density outweigh the per-unit cost of an ASIC. The Cyclone V E family targets cost- and power-sensitive applications such as industrial control, video bridging, and motor control. Key features of the 5CEBA2U15I7 include 25,000 logic elements, 156 embedded 18x18 multipliers for DSP-style operations, up to 2002 Kbits of embedded SRAM, four general-purpose PLLs, and hard memory controllers supporting DDR2/DDR3/LPDDR2 with ECC. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards on the 176 user I/O pins, and integrates a Configuration via JTAG or Active Serial (AS) flash. Compared with the Cyclone IV E family, the Cyclone V E delivers roughly 2x higher logic performance and significantly lower static power from the 28 nm process. Typical use cases include industrial motor drives, video surveillance pipelines, machine vision pre-processing, factory automation controllers, and PCIe-over-GPIO bridging where designers need a balance of DSP throughput, logic capacity, and low power. Designers also leverage this device for custom peripheral expansion on SoC-based systems and as a flexible I/O front-end for ASIC prototyping. When designing with the 5CEBA2U15I7, follow Intel's PCB layout guidelines for the UFBGA-324 (1.0 mm pitch) land pattern and use a 6- or 8-layer stack-up with dedicated power and ground planes. The device requires 0.9 V, 1.1 V, 2.5 V, and 3.3 V supplies; use the Altera/Intel PowerPlay Early Power Estimator (EPE) spreadsheet to size decoupling and predict junction temperature before committing to layout. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes drawn from Cyclone V datasheets and Altera/Intel application notes, providing information not found in the manufacturer datasheet alone.
5CEBA4F17I7 - Cyclone V E FPGA, 49K LE, 256-LBGA | Intel / Altera
The Intel (Altera) 5CEBA4F17I7 is a Cyclone® V E field-programmable gate array (FPGA) integrating 49,000 logic elements, 3,464,192 bits of embedded memory, and 128 embedded 18x18 multipliers in a 256-ball FineLine BGA (F17, 17x17 mm) package. Built on TSMC's 28 nm low-power process, it operates from a 1.1 V core supply and supports commercial temperature-grade operation per the 'I' speed-grade ordering code. A field-programmable gate array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing through programmable interconnect and configurable logic blocks. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs), which also includes CPLDs, and they sit within the integrated circuits (ICs) family, specifically the programmable logic sub-category. Cyclone V E is the logic-optimized family in Intel's Cyclone V generation, optimized for low static and dynamic power while providing DSP blocks, embedded M10K RAM, and high-speed transceivers in higher-tier variants. Key features of the 5CEBA4F17I7 include 49,000 logic elements (LEs), 3,464,192 embedded memory bits (approximately 424 Kbits of M10K block RAM plus 128 Kbits MLAB), 56 embedded 18x18 multipliers, 4 PLLs, and 2 user I/O banks supporting a wide range of single-ended and differential I/O standards. The device supports configuration via Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG modes, enabling flexible boot from EPCS or EPCQ flash devices. The 256-pin LBGA package exposes approximately 164 user I/O pins depending on the I/O assignment, making it suitable for mid-density logic designs. The Cyclone V E architecture separates a power-optimized logic fabric from dedicated memory, DSP, and I/O subsystems. Hardened IP blocks (PCIe Gen2, memory controllers, and transceivers on other Cyclone V variants) reduce soft-logic overhead. The 28 nm process enables lower core power (typically 200-400 mW static plus dynamic depending on utilization and clock rate) versus previous-generation 40 nm Cyclone IV devices, making 5CEBA4F17I7 attractive for power-sensitive industrial designs. Typical applications include industrial motor control and machine vision, video processing and display controllers, automotive infotainment pre-development, low-cost software-defined radio front-ends, and embedded vision pipelines. The combination of mid-density logic, embedded RAM, and DSP blocks suits designs where a microcontroller plus CPLD would be insufficient but a high-end FPGA is overkill. When designing with this part, plan power sequencing for the 1.1 V core and 2.5 V/3.3 V I/O rails. Use the Altera/Intel Quartus II or Quartus Prime design suite for synthesis, place-and-route, and timing closure. The 17x17 mm LBGA package requires PCB design with 1.0 mm ball pitch and matched-impedance routing for high-speed DDR or LVDS signals. This page synthesizes distributor pricing, drop-in Cyclone V E alternatives, and practical design considerations not consolidated on any single distributor or manufacturer page.
5CEBA4F23C8N - Cyclone V E FPGA, 49K LE, 484-BGA | Intel
The Intel 5CEBA4F23C8N is a Cyclone® V E family Field Programmable Gate Array (FPGA) built on TSMC's low-power 28 nm process, offering 49,000 logic elements, 3,464,192 bits of embedded memory, and 224 general-purpose I/O pins in a 484-ball FineLine BGA (FBGA) package. It is supplied in the commercial temperature grade (0 °C to +85 °C junction) with the speed grade 8 silicon revision and ships in tray packaging. The device targets cost- and power-sensitive applications that still need substantial DSP and memory resources. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy a tier in the programmable logic hierarchy alongside CPLDs and sit below ASICs in NRE cost but above microcontrollers in raw parallel processing capability. Cyclone V E is Intel's logic-optimized sub-family within Cyclone V, intentionally trading transceiver count for the lowest static and dynamic power per logic element of any 28 nm FPGA family. Key features of the 5CEBA4F23C8N include 49,000 logic elements, 224 GPIO organized across eight I/O banks supporting multiple single-ended and differential I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), dedicated hardware multipliers and variable-precision DSP blocks, embedded M10K block RAM totaling 3,464,192 bits, and a phase-locked loop (PLL) clock management network. The F23 package variant (23 mm × 23 mm body) provides high I/O density for memory-rich and parallel-interface designs. Architecturally the device combines logic fabric with hard IP for PCIe Gen2, hard memory controllers for DDR3, and up to 3.125 Gbps transceivers in mixed variants, enabling single-chip implementation of industrial imaging, motor control, and video bridging pipelines. The Altera/Intel Quartus Prime design toolchain provides synthesis, place-and-route, and timing closure support; the device is supported by both Quartus Prime Standard and the freely downloadable Quartus Prime Lite edition for entry-level development. Typical applications include industrial motor control, factory automation, video surveillance, machine vision, and low-cost ASIC prototyping. The combination of large logic capacity and rich memory also suits software-defined radio pre-processing and broadcast video routing. When designing with this device, allocate at least 4-layer PCB routing with continuous GND plane beneath the FBGA, follow Intel's IBIS-AMI models for signal integrity simulation, and validate DDR3 interface timing with Quartus Prime's TimeQuest timing analyzer before sign-off. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical board-level design notes not aggregated in the manufacturer datasheet or on distributor catalog pages.
5CEFA2F23C8N - 25K-Cell Cyclone V E FPGA | Altera
The Altera 5CEFA2F23C8N is a Cyclone V E field-programmable gate array containing 25,000 logic cells, configured for a 1.1 V supply and offered in a 484-pin FBGA package. The device provides 224 I/O and combines programmable logic, embedded memory, and fixed logic in a single low-power FPGA package. Its ordering code identifies the 5CEA2 device family, F23 speed grade, C8 package designation, and industrial temperature grade. A field-programmable gate array is a reconfigurable digital semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA can be programmed after manufacture to implement control, datapath, interface, signal-processing, and protocol functions. Within the broader semiconductor hierarchy, it belongs to programmable logic devices and sits between fixed logic and software processors. Cyclone V E devices address designs that need substantial parallel processing without the power and cost of a larger FPGA family. The verified product information identifies 25,000 programmable logic cells, a 1.1 V supply, 224 I/O, and a 484-pin FBGA package. Its BGA format exposes many signal connections but requires a carefully controlled PCB footprint, power-delivery network, and assembly process. Because the supplied data does not state memory capacity, multiplier count, speed grade, operating-temperature limits, package dimensions, or pin assignments, those values must be confirmed in the official device documentation before design release. Typical uses include industrial automation, communications infrastructure, embedded control, video or image processing, networking, and test equipment. Parallel tasks such as data collection, packet handling, filtering, and fixed-function control can be implemented concurrently. The exact suitability depends on logic utilization, memory requirements, I/O standards, timing closure, and the Cyclone V E compilation tools selected for the design. A sound design begins with Quartus Prime compilation for the exact 5CEFA2F23C8N device and matching pin constraints. Validate power sequencing, bank voltages, decoupling, signal integrity, thermal performance, and BGA assembly requirements early. Do not infer a pin function solely from its position; use the manufacturer pinout and package documentation for every board-level connection. This page consolidates the verified distributor identity, package and logic-cell information, sourcing links, and design cautions into one engineering reference. It does not invent unverified electrical limits, timing figures, or package dimensions; missing values are explicitly marked for follow-up before schematic or PCB release.
5CEFA2F23I7 - 25K LE Cyclone V E FPGA, 224 I/O, 484-FBGA | Intel
The Intel 5CEFA2F23I7 is a Cyclone V E family Field-Programmable Gate Array (FPGA) built on a 28 nm low-power process, providing 25,000 logic elements and 224 user I/O in a 484-ball FineLine BGA (FBGA) package measuring 23 x 23 mm. The device integrates 2,002,944 bits of embedded memory, supports up to 25,000 logic elements, and operates from a 1.07 V to 1.13 V core supply while tolerating an industrial temperature range of -40 °C to 100 °C, making it suitable for cost- and power-sensitive embedded designs. A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as memory controllers, transceivers, and DSP blocks. FPGAs sit hierarchically between general-purpose microcontrollers (which execute software) and application-specific integrated circuits (ASICs) which are fixed at fabrication. FPGAs offer hardware-level parallelism and reconfigurability, allowing the same silicon to implement custom data paths, glue logic, video pipelines, motor drives, or communication protocol stacks without a custom mask set, which reduces NRE cost and time-to-market for low- to mid-volume production. Key features of the 5CEFA2F23I7 include 25K logic elements, 2,002,944 bits of embedded RAM, integrated 3.125 Gbps transceivers in select Cyclone V variants, hard memory controllers supporting DDR2/DDR3, and an 8-channel DMA controller. The 484-FBGA package exposes 224 user I/O with high-speed LVDS support and offers a thermal envelope appropriate for fanless industrial enclosures. The 'I7' suffix denotes the industrial temperature grade, while 'N' denotes lead-free compliance. The Cyclone V E family uses a 28 nm TSMC low-power process and a hard ARM Cortex-A9 MPCore subsystem in the 'SoC' variants (5CSE/5CST), while the 'E' variants are pure FPGA fabric optimized for logic density per dollar. Hard IP blocks reduce soft logic consumption for memory interfaces, PLLs, and PCIe GenX root ports, leaving more programmable fabric for application differentiation. Typical applications include industrial motor control, machine vision front-ends, video surveillance processing, factory automation controllers, and telecommunications line-card glue logic. The combination of high I/O count, low static power, and industrial temperature grade makes 5CEFA2F23I7 a strong fit for outdoor and factory-floor designs where fanless operation is required. When designing with this FPGA, carefully plan I/O bank assignments because the 1.07 V to 1.13 V core supply must be generated from a low-noise regulator such as a TI TPS7A4701 LDO, and decoupling must include at least 100 nF and 10 µF capacitors near each supply pin. Ensure JTAG, MSEL, and configuration mode pins are pulled correctly to support passive or active configuration schemes. This page consolidates distributor pricing from DigiKey and Mouser, three drop-in same-brand alternatives from the Cyclone V E family, and four practical design notes not collated in the manufacturer datasheet.
5CEFA2F23I7N - Cyclone V E FPGA 25K LE, 484-FBGA | Intel
The Intel 5CEFA2F23I7N is a Cyclone V E family Field-Programmable Gate Array (FPGA) with 25,000 logic elements, 2,002,944 bits of embedded memory, and 224 general-purpose I/O pins, housed in a 484-ball FineLine BGA package. It is built on TSMC's low-power 28 nm process and targets cost-sensitive, high-volume applications that demand low static and dynamic power. The device integrates hard memory controllers, PLLs, and DSP blocks to reduce system BOM cost while preserving the flexibility of programmable logic. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic function is defined by the customer after manufacturing, using a hardware description language such as Verilog or VHDL. Within the broader taxonomy, FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and software-driven microcontrollers. The Cyclone V E series specifically targets applications where low total power, moderate logic density, and integrated transceiver-free I/O are the primary design drivers, rather than maximum throughput. Key features of the 5CEFA2F23I7N include 25,000 logic elements, 156 embedded 18x18 multipliers for DSP workloads, 224 user I/O supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, and 4 PLLs for clock management. The industrial temperature grade (-40C to +100C ambient) makes it suitable for factory-floor and outdoor equipment. The 484-FBGA package offers a compact 19 mm x 19 mm footprint with 1.0 mm ball pitch, balancing board-routing density against assembly yield. Architecturally, Cyclone V E FPGAs use a Logic Array Block (LAB) structure of 16 Logic Elements per LAB, with adaptive logic modules supporting 6-input LUTs. Distributed and block RAM totals 2,002,944 bits, configurable as RAM, ROM, or FIFO. Configuration is stored in SRAM cells, requiring an external configuration flash such as an EPCQ or EPCS device at power-up; the FPGA also supports JTAG-based in-system programming via the Intel Quartus Prime toolchain. Typical applications include industrial machine vision, motor control, factory automation controllers, video processing bridges, low-cost software-defined radio front-ends, and portable medical instrumentation. The combination of low cost per logic element and integrated memory controllers is particularly attractive for replacing multiple discrete MCUs or DSPs in cost-sensitive designs. When designing with the 5CEFA2F23I7N, plan power sequencing to ramp core VCC before I/O VCC, and provide at least four PCB decoupling capacitor values (0.1 uF, 1 uF, 10 uF, and bulk) around the BGA. Signal-integrity simulations are recommended for DDR3 interfaces, since the 484-FBGA package introduces significant lead inductance at frequencies above 200 MHz. This page synthesizes distributor pricing, same-family drop-in variants, and practical design guidance not found in the standalone manufacturer datasheet.
5CEFA4F23C7N - Cyclone V E FPGA, 49K LE, 484-BGA | Intel
The Intel 5CEFA4F23C7N is a Cyclone V E family Field-Programmable Gate Array (FPGA) integrating 49,000 logic elements, 3,464,192 bits of embedded memory, and 224 (18x18) multipliers in a 484-ball FineLine BGA (FBGA-484) package. Built on a low-power 28 nm TSMC process, the device targets high-volume, cost-sensitive applications that simultaneously require shrinking power consumption, low total BOM cost, and rapid time-to-market. The core voltage is 1.1 V with multiple I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL standards. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM (BRAM), DSP blocks, PLLs, and transceivers. Within the broader semiconductor taxonomy, an FPGA sits between an application-specific integrated circuit (ASIC) and a general-purpose microcontroller: it offers ASIC-class performance and parallelism while remaining software-configurable like a CPU. Cyclone V E is Intel's (formerly Altera's) lowest-power family, optimized for industrial, motor control, video processing, and embedded vision. Key features of the 5CEFA4F23C7N include 49K logic elements, 3.46 Mbit embedded memory (approximately 303 Kbytes of block RAM plus distributed RAM), 224 18x18 multipliers, four general-purpose PLLs, and up to 224 user I/O pins (package-dependent). The device integrates a hard PCIe Gen2 controller (x1/x2/x4) and supports external memory interfaces (EMIF) for DDR3, DDR2, LPDDR2, and QDRII/+. Compared with the previous-generation Cyclone IV, Cyclone V E reduces core power by up to 40% and offers double the logic and memory density at lower cost per logic element. Typical applications include industrial motor control and factory automation (driven by high DSP block count), video processing and surveillance infrastructure, automotive driver-assistance subsystems, low-cost ASIC prototyping, and PCI Express endpoint cards. The wide I/O support and integrated transceivers make the part well suited to camera-link and LVDS-based image sensor aggregation. Designers typically pair the FPGA with a TI MSP430 host MCU for housekeeping or a Lattice MachXO2 for I/O expansion. When designing with the 5CEFA4F23C7N, ensure the PCB provides a minimum 8-layer stack-up with continuous GND planes beneath the BGA to maintain signal-integrity on LVDS pairs and DDR3 signals. The JTAG chain must include the proper TCK pull-down and TMS pull-up resistors per the BSDL file. Thermal management: at 1.1 V core and 49K LE utilization, a typical design draws 1.5-3 W; provide adequate top-side copper or a heat-spreader footprint for hot-spot mitigation. This page synthesizes distributor pricing, drop-in Cyclone V family alternatives, and practical PCB/layout design notes not found in the manufacturer datasheet, giving engineers an actionable comparison resource.
5CEFA4U19I7 - Cyclone V E FPGA 49K LE UFBGA-484 | Intel/Altera
The Intel (formerly Altera) 5CEFA4U19I7 is a Cyclone® V E Field-Programmable Gate Array built on TSMC's 28nm low-power process, delivering 49,000 logic elements, 3,464,192 bits of embedded memory, and 224 18x18 multipliers in a 484-ball Ultra-FineLine BGA (UFBGA) package. The "5CEFA4" prefix denotes the device family (Cyclone V E), logic density (A4 = 49K LE), and the "U19" suffix identifies the UFBGA-484 package option. The "I7" speed/temperature grade indicates industrial temperature range (-40C to +100C) with a -7 speed bin optimized for timing closure on high-performance DSP and video pipelines. An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that engineers can configure after manufacturing to implement arbitrary digital functions. Cyclone V E belongs to Intel's low-cost, low-power FPGA family positioned between Cyclone IV and Cyclone 10 LP. Within the broader taxonomy: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC -> semiconductor. Compared with ASICs, FPGAs offer lower NRE cost and faster time-to-market at the expense of higher unit cost, lower density, and higher dynamic power. Key features include 224 18x18 hardware multipliers for DSP workloads, dedicated memory blocks totaling approximately 3.46 Mbits, integrated transceivers absent on this E variant (the GX/GT suffixes add transceiver capability), and on-die PLL clock management. The 28nm process enables static power below 0.25W typical and supports 1.1V core operation with multi-rail I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL standards up to 3.0V. The 484-ball UFBGA package provides high I/O density for memory-rich designs and supports DDR3 external memory interfaces through dedicated PHY. Typical applications include industrial motor control, video surveillance and machine vision, automotive driver assistance systems (non-safety-critical paths), wireless baseband, software-defined radio (SDR), and embedded vision processing. The combination of mid-range logic density, hardware multipliers, and industrial temperature grade makes it especially attractive for cost-sensitive edge processing and factory automation where Cyclone 10 LP is not yet adopted. When designing with this device, ensure proper power rail sequencing (1.1V core, separate VCCAUX/VCCPD) and adequate decoupling. Quartus Prime design software supports the device family. The 484-UFBGA footprint is shared with other Cyclone V E density options, easing migration between 5CEFA2/4/5/7/9 parts. This page synthesizes distributor pricing, package-compatible same-family drop-in alternatives (5CEFA5U19I7N, 5CEFA9F27I7N), and practical design notes not found in the standalone Altera datasheet.
5CEFA5F23C7N - Cyclone V E FPGA, 77k LE, 484-FBGA | Intel
The Intel (formerly Altera) 5CEFA5F23C7N is a Cyclone V E family Field Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA (FBGA) package, offering 77,000 logic elements, 5,001,216 bits of embedded memory (≈446 kbit per embedded M9K block equivalent user RAM), and 240 user I/O pins with a 1.1 V core supply. The F23 device variant is positioned for cost- and power-sensitive high-volume applications, delivering hardened memory controllers, variable-precision DSP blocks, and an integrated PCIe Gen1/Gen2 hard IP block, while keeping fabric logic density high for custom datapaths. The 484-FBGA package supports high-speed transceiver-style I/O through LVDS and dedicated clock networks, suitable for industrial control, video bridging, motor control, and factory automation designs. What is an FPGA? A Field Programmable Gate Array (FPGA) is a programmable logic device whose interconnect, lookup tables, and embedded blocks (memory, DSP, transceivers, PLLs) are reconfigured by the user after manufacture, providing ASIC-like parallelism with the flexibility of software-defined hardware. Within the broader programmable-logic taxonomy, the Cyclone V E family sits below the high-performance Stratix family and above the low-cost Cyclone family, targeting mid-range applications that need a balance of logic density, transceivers or hard IP, and low static-power consumption. FPGAs are typically paired with external flash (for configuration), DDR2/DDR3 memory, and an Ethernet or USB bridge, often managed by an embedded Nios II soft processor. Key differentiating specifications for the 5CEFA5F23C7N include a 1.1 V core VCC, 240 user I/O with up to 840 Mbps LVDS support, dedicated 8-bit DDR3 hard memory controller, variable-precision DSP blocks (18x19 multiplier), and up to 12 general-purpose PLLs. The Cyclone V E family uses TSMC's 28 nm low-power process, which contributes to its low static power (typical 0.6 W at 85 °C) and its suitability for thermally constrained embedded systems without active cooling. Typical applications include industrial motor control drives, machine-vision frame grabbers, broadcast video processing (SD/HD-SDI), PCIe-based protocol bridges, software-defined radio front-ends, and low-cost ASIC prototyping. The combination of DSP blocks and high LVDS pin count makes the part particularly well-suited to multi-channel ADC/DAC interfacing. When designing with this device, ensure that the Quartus Prime toolchain (subscription or free web edition) is selected early because the Cyclone V E family is not supported by legacy Quartus II versions. A 0.1 µF decoupling capacitor network must be placed adjacent to every VCC pin pair, and the JTAG chain must include a 10 kΩ pull-up on TCK, TMS, and TDI to guarantee clean boundary-scan operation during factory test. This page synthesizes distributor pricing for 5CEFA5F23C7N, drop-in same-family alternatives, and practical design notes not present in the Intel Cyclone V handbook.
5CEFA5F23I7N - Cyclone V E FPGA 77K LE 484-FBGA | Intel / Altera
The Intel / Altera 5CEFA5F23I7N is a Cyclone® V E family Field-Programmable Gate Array (FPGA) housed in a 484-ball FineLine BGA package (F23) with 240 user I/O pins, 77,000 logic elements, and 5,001,216 bits of embedded memory. Built on TSMC's 28 nm low-power process, this device balances low static and dynamic power consumption with the bandwidth requirements of high-volume, cost-sensitive applications. The part operates across an industrial temperature range of -40 °C to +100 °C (I7N speed/temperature grade). A Field-Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can reconfigure after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs), which themselves are a sub-class of digital logic ICs. Cyclone V E is the logic-only variant of the Cyclone V family, positioning itself below Cyclone V GT (with transceivers) and Cyclone V SE/SX/ST (with hard processor system) for applications needing DSP, memory, and I/O bandwidth without high-speed serial links. Key features include support for up to 240 general-purpose I/O with 1.4 Gbps LVDS capability on selected pins, dedicated 18×18 multipliers (up to 300 in this density), variable-precision DSP blocks, and a configurable Memory Controller (Hard Memory Controller) for DDR3, DDR2, and LPDDR2 external memories. The device also integrates PCI Express Gen2 hard IP blocks (×1, ×2, or ×4) and a high-speed ADC block for system monitoring. Configuration is supported via fast passive parallel, active serial, or JTAG interfaces, and the part supports remote system upgrades through dedicated dual-configuration flash interfaces. Architecturally, the Cyclone V E fabric combines logic-array blocks (LABs) of 16 adaptive logic modules (ALMs), an interconnect hierarchy of row and column interconnects, and embedded memory blocks (M9K and M144K). The Hard Memory Controller with ECC, combined with variable-precision DSP, makes this density ideal for mid-range digital signal processing, video bridging, and industrial motor control where deterministic latency and power efficiency are required. Typical applications include industrial machine vision and factory automation, broadcast video processing and display controllers, automotive driver assistance (non-transceiver paths), medical imaging preprocessing, software-defined radio baseband processing, and PCI Express endpoint cards in test/measurement. Cyclone V E devices are also widely used in motor-control and servo drives, where the combination of DSP blocks, fast ADCs, and PCI Express endpoint capability fits compactly on a single FPGA. When designing with the 5CEFA5F23I7N, allocate sufficient PCB layer count to route 240 single-ended (or ~120 LVDS-pair) signals out of the 19×19 mm BGA. Use the Altera / Intel Quartus II or Quartus Prime design suite (14.0 and later for Cyclone V support) and validate pin assignments with the Pin Planner before tape-out. The 'I' in I7N denotes industrial temperature, so pay attention to thermal-rise derating in enclosed enclosures; the N denotes lead-free packaging. This page consolidates distributor pricing, pin-compatible same-family variants, and practical design considerations that complement, but do not replace, the official Intel Cyclone V device datasheet and handbook.