2VM3254 - Versal Prime Gen 2 Adaptive SoC | AMD
Référence : 2VM3254 ✓ Actif| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
2VM3254 Présentation
An adaptive SoC (System-on-Chip) combines a hardened application processor (like Arm Cortex-A78AE) with programmable logic (FPGA fabric) and customizable engines on a single device. This architecture allows designers to implement both software-defined and hardware-accelerated functions, bridging the gap between traditional microprocessors and FPGAs. The Versal Prime Series Gen 2 targets embedded systems requiring high compute density, low latency, and flexible I/O.
Key features of the 2VM3254 include a 23x23mm package (27% smaller than the previous minimum), 4-core Cortex-A78AE processor, and support for Pro AV, broadcast, and industrial IoT applications. The device provides high programmable logic density per square millimeter, enabling complex designs in compact form factors. It also supports the Versal Prime Gen 2 ecosystem, including design tools and early access programs.
Technically, the 2VM3254 leverages AMD's adaptive compute acceleration platform (ACAP) architecture, combining scalar engines (Arm cores), adaptable engines (programmable logic), and intelligent engines (AI cores) with a network-on-chip (NoC) interconnect. This heterogeneous architecture allows concurrent execution of software and hardware tasks, optimizing performance per watt for edge applications.
Typical applications include Pro AV video processing, broadcast infrastructure, industrial IoT gateways, and edge AI systems. The compact package makes it ideal for space-constrained designs where board area is critical. The device also serves as an entry point for customers evaluating Versal Prime Gen 2 before migrating to larger devices like the 2VM3654.
When designing with the 2VM3254, consider the power delivery network (PDN) requirements for the multi-rail SoC, including core, I/O, and memory voltages. Use AMD's power estimation tools and reference designs to optimize decoupling and thermal management in the 23x23mm package.
Alternatives de remplacement direct pour 2VM3254 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 2VM3254 (même facteur de forme et même empreinte) — différant par Availability, Early Access, Package Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
2VM3104
⚡ Même boîtier✓ En stock
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Voir la fiche technique →2VM3254 Valeurs maximales et caractéristiques électriques
| Product Family | Versal Prime Series Gen 2 |
| Processor Cores | 4x Arm Cortex-A78AE |
| Scalar Compute | Up to 100K DMIPS |
| Package Size | 23x23 mm |
| Package Type | BGA (Ball Grid Array) |
| Programmable Logic | Adaptive SoC fabric |
| Target Applications | Pro AV, broadcast, industrial IoT |
| Availability | Expected 2027 |
| Compute Performance | Up to 10X vs previous gen |
| Die Size Reduction | 27% smaller than previous minimum |
| Ecosystem | Versal Prime Gen 2 design tools |
| Early Access | Contact AMD sales |
Guide de configuration des broches du 2VM3254 bga (ball grid array)
Configuration des broches du 2VM3254 (boîtier bga (ball grid array)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 2VM3254.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
2VM3254 convient pour 6 applications: Pro AV Video Processing, Broadcast Infrastructure, Industrial IoT Gateways, Edge AI Systems, Compact Embedded Computing, Test and Measurement.
Pro AV Video Processing
The 2VM3254's 4-core Cortex-A78AE and programmable logic enable real-time video processing for Pro AV systems. Its 23x23mm package fits compact video switchers and scalers, while the adaptive SoC architecture supports custom video interfaces and processing pipelines. The device delivers up to 100K DMIPS for control plane tasks, ensuring responsive user interfaces and protocol handling.
Recommandé
Broadcast Infrastructure
In broadcast systems, the 2VM3254 handles video encoding, decoding, and transport stream processing. Its programmable logic allows implementation of custom codecs and protocols, while the Arm cores manage system control and network interfaces. The compact package enables dense channel density in broadcast equipment, and the Versal Prime Gen 2 architecture provides up to 10X scalar compute for efficient processing.
Recommandé
Industrial IoT Gateways
The 2VM3254 serves as an industrial IoT gateway processor, combining real-time control with edge analytics. Its 4-core Cortex-A78AE handles protocol conversion and cloud connectivity, while programmable logic implements custom sensor interfaces and deterministic control loops. The 23x23mm package fits DIN-rail and panel-mounted designs, and the device's compute density supports AI inference at the edge.
Recommandé
Edge AI Systems
The 2VM3254 enables edge AI inference with its adaptive SoC architecture. The Arm cores run AI frameworks, while programmable logic accelerates custom neural network layers. This heterogeneous approach optimizes performance per watt for vision and sensor processing. The compact package is ideal for embedded vision systems, drones, and robotics where space is limited.
Recommandé
Compact Embedded Computing
The 2VM3254's 23x23mm package makes it ideal for compact embedded computers. It integrates a 4-core processor and programmable logic, eliminating the need for separate CPU and FPGA devices. This reduces board area and power consumption while improving reliability. The device supports various I/O standards, enabling flexible system design.
Recommandé
Test and Measurement
In test equipment, the 2VM3254 provides high-speed data acquisition and processing. Its programmable logic implements custom trigger and analysis circuits, while the Arm cores handle user interfaces and data logging. The compact package enables portable instruments, and the Versal Prime Gen 2 architecture delivers the compute needed for real-time signal processing.
Recommandé
Données de référence d'ingénierie pour 2VM3254 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 2VM3454 | 2VM3104 | 2VM3654 |
|---|---|---|---|---|
| Package | BGA (23x23mm) | BGA (larger) | BGA (23x23mm) | BGA (larger) |
| Brand | AMD | AMD | AMD | AMD |
| Availability | 2027 | 2026 | 2027 | Early access |
| Target Applications | Pro AV, broadcast, industrial IoT | Pro AV, broadcast, industrial IoT | Pro AV, broadcast, industrial IoT | High-end embedded |
| Early Access Program | Contact AMD sales | Yes | Contact AMD sales | Yes |
Principaux différenciateurs
- Compact 23x23mm package (vs 2VM3454)
- 4-core Cortex-A78AE (vs 2VM3104)
- Versal Prime Gen 2 architecture (vs 2VM3654)
Notes de conception
The 2VM3254 is a multi-rail SoC requiring careful power delivery network (PDN) design. Use AMD's power estimation tools to calculate current requirements for core, I/O, and memory rails. Implement proper decoupling with low-ESR ceramic capacitors near each power pin, and consider using power modules for high-current rails.
The 23x23mm package has limited surface area for heat dissipation. Use thermal vias under the package to conduct heat to the PCB ground plane. Consider adding a heatsink or forced airflow for high-power designs. AMD provides thermal models for simulation; use them to verify junction temperature stays within limits.
For the 23x23mm BGA package, use a high-layer-count PCB (8+ layers) to route signals and power. Follow AMD's layout guidelines for impedance-controlled traces and differential pairs. Place decoupling capacitors as close to the BGA pads as possible, and use a solid ground plane for return current paths.
Informations de conformité
Compliance data not available in verified web data. Contact AMD for RoHS/REACH certification.
