5CEFA2F23I7N - Cyclone V E FPGA 25K LE, 484-FBGA | Intel
Référence : 5CEFA2F23I7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $72.17 | $72,17 |
| 10 | $64.95 | $649,50 |
| 100 | $55.4 | $5 540,00 |
| 500 | $48.2 | $24 100,00 |
| 1 000 | $42.85 | $42 850,00 |
5CEFA2F23I7N Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic function is defined by the customer after manufacturing, using a hardware description language such as Verilog or VHDL. Within the broader taxonomy, FPGAs belong to the programmable logic device (PLD) family, which sits between fixed-function ASICs and software-driven microcontrollers. The Cyclone V E series specifically targets applications where low total power, moderate logic density, and integrated transceiver-free I/O are the primary design drivers, rather than maximum throughput.
Key features of the 5CEFA2F23I7N include 25,000 logic elements, 156 embedded 18x18 multipliers for DSP workloads, 224 user I/O supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards, and 4 PLLs for clock management. The industrial temperature grade (-40C to +100C ambient) makes it suitable for factory-floor and outdoor equipment. The 484-FBGA package offers a compact 19 mm x 19 mm footprint with 1.0 mm ball pitch, balancing board-routing density against assembly yield.
Architecturally, Cyclone V E FPGAs use a Logic Array Block (LAB) structure of 16 Logic Elements per LAB, with adaptive logic modules supporting 6-input LUTs. Distributed and block RAM totals 2,002,944 bits, configurable as RAM, ROM, or FIFO. Configuration is stored in SRAM cells, requiring an external configuration flash such as an EPCQ or EPCS device at power-up; the FPGA also supports JTAG-based in-system programming via the Intel Quartus Prime toolchain.
Typical applications include industrial machine vision, motor control, factory automation controllers, video processing bridges, low-cost software-defined radio front-ends, and portable medical instrumentation. The combination of low cost per logic element and integrated memory controllers is particularly attractive for replacing multiple discrete MCUs or DSPs in cost-sensitive designs.
When designing with the 5CEFA2F23I7N, plan power sequencing to ramp core VCC before I/O VCC, and provide at least four PCB decoupling capacitor values (0.1 uF, 1 uF, 10 uF, and bulk) around the BGA. Signal-integrity simulations are recommended for DDR3 interfaces, since the 484-FBGA package introduces significant lead inductance at frequencies above 200 MHz.
This page synthesizes distributor pricing, same-family drop-in variants, and practical design guidance not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour 5CEFA2F23I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5CEFA2F23I7N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Logic Elements (LE), Speed Grade, Embedded Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5CEFA2F23I7
✅ Remplacement direct✓ En stock
$72 / unité
Voir la fiche technique →5CEFA2F23I7N
✅ Remplacement direct✓ En stock
$42.85 / unité
Voir la fiche technique →5CEBA4F23C8N
✅ Remplacement direct✓ En stock
$62.41 / unité
Voir la fiche technique →5CEBA4F17I7
✅ Remplacement direct✓ En stock
$140 / unité
Voir la fiche technique →5CEBA2F17I7N
✅ Remplacement direct✓ En stock
$32.84 / unité
Voir la fiche technique →5CEBA2U15I7
✅ Remplacement direct✓ En stock
$98.4 / unité
Voir la fiche technique →5CEFA2F23I7N Valeurs maximales et caractéristiques électriques
| Series | Cyclone V E |
| Logic Elements | 25,000 |
| Embedded Memory | 2,002,944 bits |
| User I/O Pins | 224 |
| Embedded 18x18 Multipliers | 66 (DSP blocks) |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Process Technology | TSMC 28 nm low-power |
| Boîtier | 484-FBGA (FineLine BGA), 19 mm x 19 mm, 1.0 mm pitch |
| Operating Temperature (Industrial) | -40C to +100C ambient |
| Supply Voltage (Core) | 1.1 V (typical) |
| Configuration Method | SRAM-based, requires external flash (EPCQ/EPCS) |
| Transceivers | None (Cyclone V E is transceiver-free) |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du 5CEFA2F23I7N 484-fbga (fineline bga), 19 mm x 19 mm, 1.0 mm pitch
Configuration des broches du 5CEFA2F23I7N (boîtier 484-fbga (fineline bga), 19 mm x 19 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 5CEFA2F23I7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
5CEFA2F23I7N convient pour 6 applications: Industrial Motor Control, Machine Vision and Image Processing, Factory Automation Controllers, Video Processing Bridges, Portable Medical Instrumentation, Software-Defined Radio Front-End.
Industrial Motor Control
The 5CEFA2F23I7N is well suited for industrial motor control applications. Its 66 embedded 18x18 multipliers implement field-oriented control (FOC) and space-vector PWM algorithms in real time, while 4 PLLs provide the precision clocking needed for high-resolution PWM generation and encoder feedback. The industrial -40C to +100C temperature grade supports factory-floor and outdoor equipment. The 25K logic elements comfortably accommodate multi-axis control loops (typically 4-8 axes per device), and the 2 Mbit embedded memory buffer supports high-speed current/voltage sampling. Designers can consolidate multiple discrete MCUs and DSPs into a single FPGA, reducing BOM cost and PCB area.
Recommandé
Machine Vision and Image Processing
The 5CEFA2F23I7N handles entry-level machine vision pipelines including image preprocessing, edge detection, and color space conversion. The 25,000 logic elements are sufficient for a typical Sobel or Canny edge detection pipeline at 720p60 resolution, while the 2 Mbit embedded memory buffers full frame lines without external SRAM. Its LVDS I/O support enables direct interfacing with Camera Link and MIPI CSI-2 image sensors via bridge chips. Compared to GPU-based vision systems, the FPGA offers deterministic latency and lower power consumption, ideal for industrial quality-inspection cameras operating continuously on factory floors.
Recommandé
Factory Automation Controllers
Programmable Logic Controllers (PLCs) and distributed I/O modules benefit from the 5CEFA2F23I7N's combination of industrial temperature grade, integrated PLLs, and abundant general-purpose I/O. The 224 user I/O pins handle dozens of digital inputs, relay outputs, and communication interfaces including EtherCAT, PROFINET, and Modbus TCP soft-cores within a single device. The -40C to +100C rating eliminates the need for external thermal management in sealed control cabinets. Designers can integrate IEC 61131-3 logic execution, deterministic Ethernet protocols, and safety functions on one FPGA, replacing multi-chip MCU + ASIC designs.
Recommandé
Video Processing Bridges
The 5CEFA2F23I7N acts as a video format converter or scaler between HDMI, DisplayPort, MIPI, and LVDS sources and sinks. Its 25K logic elements handle scaling algorithms, color-space conversion (RGB/YUV), and frame-rate conversion for resolutions up to 1080p60. The LVDS I/O supports direct connection to flat-panel displays, and the integrated PLLs generate the precise pixel clocks required for clean video output. The 2 Mbit embedded memory stores multiple scan-line buffers for temporal filtering and deinterlacing, eliminating external frame-buffer memory in many cost-sensitive designs.
Recommandé
Portable Medical Instrumentation
The 5CEFA2F23I7N serves portable medical devices such as patient monitors, ultrasound front-ends, and point-of-care diagnostics. Its low static power (Cyclone V E sub-watt core idle) extends battery life in handheld designs, while the embedded DSP blocks implement real-time filtering on physiological signals (ECG, EEG, SpO2). The -40C to +100C industrial temperature range supports cold-chain transport and outdoor field use. The 224 user I/O easily accommodates touch-screen interfaces, multiple sensor inputs, and wireless module connections. Designers can achieve IEC 60601-1 compliance with the FPGA's deterministic real-time response.
Recommandé
Software-Defined Radio Front-End
Cost-sensitive software-defined radio (SDR) receivers leverage the 5CEFA2F23I7N for digital downconversion, channelization, and demodulation below 100 MHz bandwidth. The 66 embedded 18x18 multipliers implement polyphase filter banks, FFT engines, and digital mixer stages. The FPGA's 2 Mbit embedded memory stores rotating buffers for sample alignment, while LVDS I/O interfaces directly with high-speed ADCs. The Cyclone V E series is transceiver-free, so RF signals must be digitized by an external ADC before reaching the FPGA. The low unit cost makes the part attractive for amateur radio, public-safety, and industrial wireless sensor networks.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5CEFA2F23I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5CEFA2F23I7 | 5CEBA4F23C8N | 5CEBA4F17I7 | 5CEBA2F17I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (19x19 mm, 1.0 mm pitch) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Logic Elements | 25,000 | 25,000 | 49,000 | 49,000 | 25,000 |
| Family | Cyclone V E (no transceivers) | Cyclone V E | Cyclone V E | Cyclone V E | Cyclone V E |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| PLLs | 4 | 4 | 4 | 4 | 4 |
| Configuration Flash Required | Yes (EPCQ/EPCS external) | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Lowest cost 25K-LE Cyclone V E variant in industrial temperature grade (vs 5CEBA2F17I7N)
- Direct upgrade path to 49K logic elements on same PCB (vs 5CEBA4F23C8N)
- Industrial temperature grade with full transceiver-free Cyclone V E feature set (vs 5CEFA2F23I7)
Notes de conception
Cyclone V E devices require multiple supply rails: VCCINT (core, typically 1.1 V), VCCAUX (auxiliary, 2.5 V), VCCPD (I/O pre-driver, 2.5 V or 3.0 V), and per-bank VCCIO for each I/O bank. Power sequencing must ramp VCCINT before VCCAUX and VCCIO to prevent latch-up. Use a dedicated power management IC such as the Intel EN5322 or Texas Instruments TPS650250 to ensure monotonic ramp with proper timing. Decoupling requires at least 0.1 uF X7R ceramic capacitors within 100 mils of every power pin, plus bulk 10 uF and 47 uF tantalum capacitors near the package. Estimated: the 484-FBGA package contains approximately 40 power and ground balls distributed around the perimeter.
The 484-FBGA package uses a 1.0 mm ball pitch, which requires laser-drilled microvias or sequential lamination for breakout routing. Use a 4-layer or 6-layer stack-up with dedicated ground and power planes immediately beneath the BGA to control impedance. Fan-out all BGA signals through the top layer with via-in-pad if the assembly house supports it, otherwise dog-bone fanout. Signal-integrity simulations are mandatory for DDR3 interfaces above 533 MHz; the lead inductance of the BGA can introduce significant ringing if the stackup is not optimized.
Do not assume the 5CEFA2F23I7N configuration flash is internal - the part uses SRAM configuration cells and requires an external EPCQ or EPCS flash device. Common errors include omitting the configuration flash in the schematic, selecting the wrong AS mode (x1 vs x4), and leaving JTAG TCK floating (always pull to ground through 1 kohm to prevent spurious configuration). When migrating from a Cyclone IV design, verify pinout compatibility - the Cyclone V ball map differs from Cyclone IV even in the same 484-FBGA package. Use the Intel Pin Migration View in Quartus Prime to confirm equivalence before committing to a layout.
Cyclone V E devices are designed for low power but still require thermal management in high-utilization designs. The 484-FBGA package has a typical theta-JA of approximately 15 C/W with 4-layer PCB and adequate airflow. Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet to predict junction temperature before PCB commitment. For industrial temperature grade operation up to +100C ambient, derate design utilization to keep junction below +125C. Forced airflow of 1-2 m/s typically reduces junction temperature by 10-15 C.
Informations de conformité
RoHS and lead-free compliant per Intel product page. AEC-Q100 not applicable for industrial FPGA (FPGA family is not automotive-qualified at this speed grade). Conflict minerals compliance per Intel CMRT filings.
