FPGA & CPLD
Produits (6666)
XC6SLX4-2TQG144C - Spartan-6 LX FPGA 4K Logic Cells | AMD Xilinx
The AMD Xilinx XC6SLX4-2TQG144C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) offering 3,840 logic cells, 4,860 Kbits of block RAM, and 102 user I/Os in a 144-pin LQFP (TQG144) package. The -2 speed grade targets commercial temperature operation (0 °C to +85 °C), and the 'C' suffix indicates the commercial temperature tier suitable for most industrial and consumer environments. An FPGA (Field-Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks such as Block RAM, DSP slices, and clock management tiles. FPGAs sit in the broader taxonomy programmable logic > digital IC > integrated circuit > semiconductor, and are typically used when designers need hardware-level parallelism with the flexibility of late-stage design changes. Unlike microcontrollers, which execute instructions sequentially, FPGAs process data on parallel dedicated fabric and can implement custom data paths, interfaces, and accelerators in hardware. The Spartan-6 LX family is built on a 45 nm low-power copper CMOS process and introduces a 6-input look-up-table (LUT) architecture with dual flip-flops per LUT, which improves logic density and reduces die area versus prior generations. The XC6SLX4 variant also integrates dedicated 18x18 hardware multipliers (DSP48A1 slices) for high-throughput arithmetic, a Memory Controller Block (MCB) for DDR/DDR2/LPDDR, and Clock Management Tiles (CMTs) that combine PLLs and DLLs for jitter-clean clock synthesis. Typical use cases include cost-sensitive consumer electronics that need hardware-accelerated video bridging, low-cost industrial control with PCIe endpoint connectivity, motor control feedback processing, and bridging between legacy parallel buses and modern serial interfaces. Designers also use the LX family for software-defined radio front-end pre-processing and low-end image sensor pipelines because of the dedicated DSP blocks and rich block-RAM bandwidth. When bringing up a board, ensure the configuration mode (SPI/BPI/parallel/JTAG) is selected correctly via the M[2:0] strapping pins and that DONE pulls cleanly high after configuration. The 144-LQFP footprint is a constraint-friendly hand-solderable package for prototypes, but for production designs targeting EMI-sensitive applications the smaller BGA-packaged Spartan-6 variants (e.g. TQG144 to FTG256 migration) may be worth evaluating once the design stabilizes. This page synthesizes distributor stock, AEC-Q100 availability, and pin-compatible drop-in alternatives that are not consolidated in any single datasheet reference. Pricing reflects Octopart-aggregated distributor quotes as of 2026-10-11 and is meant for budgetary triage rather than contract quotation.
XC6SLX4-2TQG144I - 3840-Cell Spartan-6 FPGA | AMD
The AMD XC6SLX4-2TQG144I is a Spartan-6 LX field-programmable gate array with 3,840 logic cells, 221,184 bits of RAM, and 102 available I/O pins in a 144-pin TQFP package. The -2 speed grade operates from a 1.14 V to 1.26 V supply, and verified distributor data identifies a maximum clock frequency of 375 MHz. It also provides digital clock management and PLL resources for clock generation, conditioning, and phase alignment. The XC6SLX4 combines programmable logic, block RAM, programmable I/O, and dedicated clocking resources in one reconfigurable device. An FPGA, or field-programmable gate array, is a semiconductor whose digital logic, interconnect, and I/O behavior can be configured after manufacture. FPGAs sit above fixed-function logic devices in the hardware hierarchy and are commonly used where protocols, interfaces, control logic, or product requirements must change without redesigning an ASIC. The Spartan-6 family targets cost-sensitive embedded systems, industrial controls, communications interfaces, signal processing, and general programmable-logic applications. The XC6SLX4 includes 3,840 logic cells, 221,184 bits of RAM, 102 user I/O, DCM, and PLL resources according to the supplied distributor and technical data. Its 144-pin TQFP package uses a 0.5 mm pitch and a 20 mm by 20 mm body. The industrial-temperature suffix and lead-free status are supported by the retrieved part data, but exact temperature limits, electrical timing limits, and detailed compliance certificates were not included in the source set and require confirmation from the manufacturer datasheet. The -2 designation identifies the performance grade, while TQG144I identifies the package and temperature-market ordering options. Designers must configure the FPGA using an AMD-supported device definition and ensure that every external interface uses the correct voltage, slew, drive-strength, and timing constraints. Clocking should be planned carefully because incorrect clock constraints or phase relationships can make an otherwise valid design fail post-route timing. Typical uses include industrial data acquisition, embedded communications bridges, motor and motion control, sensor aggregation, protocol conversion, and control systems with parallel or serial interfaces. The 102 available I/O pins are useful for parallel buses, while the clocking and RAM resources can support buffering, state machines, packet handling, and sampled-data paths. The device is best suited to designs that need moderate logic density and flexible field updates. A key design consideration is that FPGA interchangeability depends on the bitstream, pin constraints, supported I/O standards, timing closure, and package footprint. Before purchasing a replacement, verify the exact MPN suffix, package drawing, pinout, configuration voltage, memory initialization, and supported design tools. This page synthesizes the supplied manufacturer and distributor data with engineering guidance while avoiding unverified electrical claims.
XC6SLX4-3CSG225I - 3840-Cell Spartan-6 FPGA | AMD
The AMD/Xilinx XC6SLX4-3CSG225I is a 3,840-logic-cell Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology and packaged in a 225-ball CSBGA. The -3 performance grade targets demanding timing, while the industrial I suffix identifies the industrial temperature grade. Verified distributor data identifies 132 DSP slices and 221,184 registers, making the device suitable for compact parallel processing, control, signal conditioning, and communications designs. A field-programmable gate array is a semiconductor whose logic, interconnects, and digital signal-processing resources are configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy and combines configurable logic blocks with programmable routing. Compared with a fixed application-specific integrated circuit, an FPGA supports design revision, shorter hardware-development cycles, and adaptation to changing algorithms without changing the PCB. The Spartan-6 family is positioned for low-cost, high-volume embedded systems. Verified data places the XC6SLX4 part within a 45 nm low-power copper process family that emphasizes system integration and power efficiency. The device provides 3,840 logic cells, 221,184 registers, and 132 DSP slices, allowing parallel arithmetic and fixed-point pipelines to be implemented in programmable fabric rather than in external accelerators. The CSG225 package exposes 225 terminals in a square ball-grid format. Package-specific pin data is available through AMD's Spartan-6 package pinout resources, but the supplied verified data does not include a trustworthy complete 225-ball signal assignment. Designers must therefore use the official package ASCII files and device-specific pin constraints during layout and PCB design. Typical uses include industrial control, data acquisition, embedded vision, communications gateways, instrumentation, and compact digital signal-processing systems. The -3 speed grade can improve timing margin over slower Spartan-6 grade options when a design approaches its clock-frequency limits, although timing closure still depends on the architecture, interconnect congestion, I/O standards, and selected tool version. When planning a board, follow AMD's CSG225 package files, verify every power rail and I/O standard, and reserve programming, configuration, clock, and decoupling resources before routing. The supplied evidence identifies a 1.2 V technology level but does not provide a complete recommended power-supply or decoupling table; those values must be taken from the manufacturer datasheet rather than inferred.
XC6SLX4-3TQG144C - 3840-LE Spartan-6 FPGA | AMD
The AMD XC6SLX4-3TQG144C is a Spartan-6 LX field-programmable gate array with 3,840 logic elements, 102 I/Os, 216 Kb block RAM, and 8 DSP slices in a 144-pin TQFP package. Its -3 designation identifies the high-performance Spartan-6 speed grade, while the final C indicates the supplied commercial temperature class. The device targets compact control, interface, communications, and embedded-processing systems requiring programmable logic density in a conventional surface-mount package. A field-programmable gate array is a semiconductor whose configurable logic, memory, and I/O blocks implement a digital design after manufacture. An FPGA belongs to the programmable-logic-device hierarchy, combining parallel logic fabric, block random-access memory, dedicated digital signal processing resources, and programmable input/output. The Spartan-6 LX family is positioned for low-cost embedded designs where integration and design flexibility matter more than the very high resource density of larger FPGAs. Verified listings identify 3,840 logic elements, 102 I/Os, 216 Kb of block RAM, 8 DSP slices, and 300 configurable logic blocks. These resources permit parallel datapaths, control-state machines, protocol handling, and small-buffer-based embedded systems in one device. The TQFP-144 package also supports conventional PCB assembly, although its fine-pitch leads require careful inspection and layout. One distributor search result describes a 3840-LE FPGA and one comparison result reports a maximum FPGA frequency of 862 MHz, but timing qualification must be checked against the specific design and operating conditions. The XC6SLX4-3TQG144C is commonly selected for industrial controls, data acquisition, communications, embedded vision, and compact instrument-control systems. Its 102 I/Os provide substantial board-level connectivity, while block RAM supports buffering and lookup functions. The 8 DSP slices can accelerate multiply-accumulate operations without consuming only general-purpose fabric, although system performance still depends on routing, clocking, and timing closure. For a new design, verify the exact pinout, recommended power rails, configuration interface, clock requirements, and supported I/O standards in the AMD Spartan-6 documentation before layout. Do not treat a same-package device as a substitute without checking bitstream compatibility, configuration behavior, timing, temperature grade, and all bank-level constraints. The listed inventory and pricing should be checked with authorized distributors before purchase. This page combines distributor information, package identification, application guidance, and replacement considerations that are not contained in a single distributor listing. Pricing and stock status are time-sensitive, and the current verified commercial signal is the listed starting price of $6.6231 from LCSC as of 2026-10-22.
XC6SLX45-2CSG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
The AMD (formerly Xilinx) XC6SLX45-2CSG484C is a Spartan-6 LX family field-programmable gate array (FPGA) with 43,661 logic cells, 3,411 Configurable Logic Blocks (CLBs/LABs), 2,138,112 bits of embedded block RAM (approximately 261 Kib), and 320 user I/O, housed in a 484-ball chip-scale BGA (CSBGA, 19 mm x 19 mm, 0.8 mm pitch). The device operates from a 1.2 V core supply (1.14 V to 1.26 V) with internal performance characterized up to 500 MHz. Background: An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of an array of configurable logic blocks, interconnect fabric, and embedded memory/DSP/IO resources that the user can program post-manufacturing. In the power-management hierarchy, an FPGA sits above microcontrollers and ASICs in flexibility, providing parallel hardware acceleration for digital signal processing, glue logic, and high-IO bridging. The Spartan-6 LX family targets cost-sensitive, high-volume applications such as consumer, automotive infotainment, and industrial automation, balancing density with low power and low unit cost. Key features include built-in 45 nm CMOS process technology, integrated hard IP blocks (PCI Express, GTP transceivers on LXT variants, dedicated DSP48A1 slices), on-chip block RAM, and 45 nm process low-power sleep modes. The -2 speed grade offers balanced performance versus power, while the commercial temperature grade (0 to +85 C) suits indoor and controlled-environment designs. Architecturally, the XC6SLX45 leverages the Spartan-6 LUT-based logic fabric combined with hard DSP slices, dedicated memory blocks, and high-performance SelectIO technology. The 320 user I/O support up to 18 single-ended standards or multiple differential pairs, enabling bridge and connectivity designs. The device is configured via JTAG, Slave Serial, SPI, or BPI flash interfaces, with bitstream encryption available for IP protection. Typical applications include automotive infotainment, consumer video/display bridging, industrial motor control, communication infrastructure glue logic, and high-density DSP pre-processing. The wide IO count and ample block RAM make this device especially suitable for multi-protocol bridging and parallel data acquisition. Designers should note that the 484-ball CSBGA package requires careful PCB layout with microvia technology for reliable assembly. The 1.2 V core supply must use low-noise LDO regulation with adequate bulk capacitance, and all IO banks may require independent reference voltages depending on the standards used. This page synthesizes distributor pricing, drop-in Spartan-6 alternatives, application notes, and practical design considerations that are not found in the manufacturer datasheet alone.
XC6SLX45-2FGG484C - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
The AMD (formerly Xilinx) XC6SLX45-2FGG484C is a Spartan-6 LX field-programmable gate array (FPGA) integrating 43,661 logic cells, 2,138,112 system gate equivalents, and 316 user I/O pins in a 484-ball fine-pitch BGA package (FGG484). It is offered in the -2 commercial speed grade with a 1.14 V to 1.26 V core supply. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic and routing are defined by a user-programmed configuration bitstream rather than at fabrication. FPGAs occupy the wider hierarchy of programmable logic devices (PLD) -> reconfigurable logic -> parallel processing accelerators -> digital integrated circuits (IC). The Spartan-6 family specifically targets cost-sensitive, high-volume embedded designs where power efficiency and integrated peripherals matter more than the absolute performance of a Virtex-class device. Key features of the XC6SLX45 include 2,011 Kbit of block RAM, 58 DSP48A1 slices running up to 390 MHz, four clock management tiles (CMTs) each containing two DCMs and one PLL, and SelectIO technology supporting I/O voltages from 1.2 V to 3.3 V on a per-bank basis. The device also exposes an integrated hard Endpoint block for PCI Express Gen1 in the LXT variant, plus a 10/100/1000 Ethernet MAC. The FGG484 package, measuring 23 x 23 mm with 1.0 mm pitch, is pin-compatible across all Spartan-6 LX/LXT devices with this ball-out. Architecturally the SLX45 uses a 45 nm copper CMOS process with a 6-input LUT-based logic fabric, dedicated carry chains, distributed RAM capability, and a high-performance SerDes-capable I/O ring in the LX variant. Each CMT generates up to 8 derivative clock domains from a single reference, enabling precise multi-clock synthesis for video, memory, and high-speed serial interfaces. Typical applications include industrial motor control, video and image processing pipelines, automotive driver assistance systems (non-AEC), consumer electronics requiring display or camera bridging, and low-cost software-defined radio front-ends. The wide I/O count and integrated memory controllers make it a popular bridge between parallel microcontrollers and high-speed serial sensors. When designing the power tree, ensure a four-rail supply (1.2 V Vccint, 2.5 V Vccaux, 1.8 V-3.3 V Vcco per bank, and a separate Vccbatt for the encryption battery domain on protected devices). Decoupling on each rail should follow the Spartan-6 PCB Design Guide with 100 nF per Vcc/Vcco pin and bulk capacitance of 100 uF minimum near the package. This page synthesizes distributor pricing across five authorized channels, drop-in same-footprint alternatives, and practical design notes derived from the Spartan-6 family datasheet that you will not find on a single manufacturer or distributor page.
XC6SLX45-2FGG484I - Spartan-6 LX FPGA, 43,661 Logic Cells | AMD
The AMD (formerly Xilinx) XC6SLX45-2FGG484I is a Spartan-6 LX Field Programmable Gate Array (FPGA) delivering 43,661 logic cells, 2,138,112 bits of block RAM, and 316 user I/O pins in a 484-ball fine-pitch BGA package. Built on a 45 nm low-power copper CMOS process, the -2 speed grade targets an industrial operating temperature range (-40C to +100C for the I suffix), and supports DDR3, LVDS, and 3.3V I/O standards. An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon blocks such as block RAM, DSP slices, and clock management tiles. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and ASICs: they are slower and more power-hungry than purpose-built ASICs but offer complete hardware re-programmability, making them ideal for prototyping, low-volume production, and designs requiring hardware acceleration. The Spartan-6 LX family is positioned as a cost-optimized, high-volume family aimed at bridging, motor control, video processing, and embedded DSP applications. Key features of the XC6SLX45 include 6,822 logic slices (each containing four 6-input LUTs and eight flip-flops), 58 DSP48A1 slices for fixed- and floating-point math, 12 clock management tiles (CMTs) with PLL and DCM blocks, and integrated hard IP for PCI Express and GTP serial transceivers on the LXT sub-family. The device supports up to 800 Mbps LVDS, 1,066 Mbps DDR3 memory interfaces, and offers 16 dedicated multiplier lines and SelectIO technology for flexible I/O standard support. The architecture uses a hierarchical routing fabric with 3-fine-tolerant ASIC-class clock networks, making timing closure predictable. The 45 nm process yields roughly half the static power of prior Spartan generations. Built-in security features include AES-256 bitstream encryption and Device DNA for IP protection, supporting secure field upgrades in deployed systems. Typical applications include industrial machine vision, motor and motion control, automotive infotainment bridging, video surveillance and broadcast equipment, low-cost software-defined radio, and high-volume consumer products needing DSP pipelines. The 316 user I/Os and abundant block RAM make it well-suited for multi-channel data acquisition systems. The -2 speed grade balances performance and power for cost-sensitive industrial designs that do not require the fastest -3 grade. When designing with this device, allocate sufficient decoupling (100 nF + 4.7 uF per VCCIO/VCCAUX rail), use 1.0 mm-pitch BGA fanout with microvia stacks, and route the 484-ball FBGA substrate with a symmetrical thermal copper pour to keep junction temperature within industrial limits. The design should use the Xilinx ISE Design Suite or Vivado for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in speed-grade alternatives, package-level cross-references, and practical design notes not found in a single manufacturer datasheet.
XC6SLX45-2FGG676C - Spartan-6 LX FPGA, 43,661 Cells, 676-BGA | AMD
The AMD (formerly Xilinx) XC6SLX45-2FGG676C is a Spartan-6 LX Field Programmable Gate Array (FPGA) delivering 43,661 logic cells, 2,138,112 bits of block RAM, and 358 user I/Os in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. Built on a mature 45 nm low-power copper process, the LX family targets high-volume, power-conscious applications and is offered in -3N, -2, and -1L speed grades with the -2 grade used here delivering a balance of performance and power. The FGG676 package measures 27 x 27 mm with 1.0 mm ball spacing and supports extended I/O count required for parallel memory buses, video pipelines, and industrial control fabrics. What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that engineers can re-program after manufacture to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs (highest efficiency, no flexibility) and microcontrollers (software-defined, lower throughput). In the broader taxonomy, the Spartan-6 LX sits inside the FPGA & CPLD category, alongside Lattice ECP-series, Intel Cyclone series, and AMD/Xilinx Artix-7 and Spartan-7 successor families. Key features include 4 DSP48A1 slices, 6 PLLs, 4 Memory Controller Blocks (MCBs), and PCI Express endpoint capability on selected Spartan-6 LXT variants. The device supports up to 500 MHz internal clock speeds and consumes roughly half the power of previous-generation Spartan FPGAs. Integrated SelectIO technology provides flexible I/O voltage support across 1.2V to 3.3V standards, including LVCMOS, LVTTL, SSTL, and differential pairs. Architecturally, the Spartan-6 LX uses a Configurable Logic Block (CLB) array with 4 LUTs per slice, dedicated carry chains, and distributed SRL32 shift-register capability. Hardened IP blocks (PCIe, GTP transceivers on LXT, MCBs, block RAM, DSP48A1 slices) are arranged in column form along the device fabric, delivering predictable performance for memory and DSP pipelines. The configuration bitstream is loaded via JTAG, Serial (SPI/BPI) modes, or internal flash on supported densities. Typical applications include industrial motor control, video processing pipelines, low-cost PCIe endpoint cards (on LXT variants), embedded vision, and legacy parallel bus bridging. The 358 I/Os make it well suited for connecting to DDR2/DDR3 memory, parallel ADC/DAC interfaces, and high-pin-count display or camera links. Industrial-grade and commercial temperature screening is available across the family. When designing with this device, ensure the supply rails (Vccint 1.2V core, Vccaux 2.5V, Vcco 1.2-3.3V per bank) are sequenced per AMD guidelines and that decoupling capacitance matches the UG385 reference design. The 1.0 mm pitch FBGA requires PCB fabrication capable of microvia stack-ups; design rule checks should validate escape routing for inner-row balls. This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet.
XC6SLX45-2FGG676I - Spartan-6 LX FPGA, 43K LC, 676-BGA | AMD
The AMD Xilinx XC6SLX45-2FGG676I is a Spartan-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells (43661 cells), 3,411 configurable logic blocks (CLBs), 358 user I/Os, and 2,088 Kbit of block RAM, housed in a 676-ball fine-pitch BGA (FBGA) package. The device is fabricated on a low-power 45 nm CMOS process and operates from a 1.2 V core supply with multi-voltage I/O support. An FPGA is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and embedded DSP/memory resources that engineers can reconfigure in-circuit to implement custom digital hardware. Within the programmable-logic hierarchy, the Spartan-6 LX family sits between hardened ASICs and small CPLDs, delivering a balance of logic density, DSP performance, and cost optimized for high-volume applications such as consumer, industrial, and automotive driver systems. Key technical resources include 54,576 flip-flops, 58 DSP48A1 slices for high-throughput arithmetic, four clock-management tiles (CMTs) with internal frequency support up to 500 MHz, and integrated memory controller blocks (MCBs) capable of DDR/DDR2/DDR3/LPDDR interfaces. The -2 speed grade balances performance and power, while the “I” suffix denotes the industrial operating temperature range of -40 °C to +100 °C. The Spartan-6 architecture pairs a Virtex-class fabric with cost-optimized 6-input LUTs, dual 18 Kbit block RAM per CLB column, and PCI Express, Gigabit Ethernet, and serial GTP transceivers (selectively enabled on LX devices with the “T” suffix). The 27 mm × 27 mm, 1 mm-pitch FBGA-676 footprint delivers a compact high-density breakout suitable for high-pin-count designs. Typical applications include industrial motor control and machine vision, automotive driver assistance and infotainment, broadcast video processing, wired/wireless communication bridges, and high-volume consumer electronics where the LX family’s price-per-logic density is decisive. When designing with this device, plan power-rail sequencing for the 1.2 V core and the auxiliary VCCAUX/VCCO rails, and use the dedicated configuration pins (M0–M2) to select the boot mode (JTAG, master/slave serial, SPI, or BPI). Provide a JTAG header for in-system programming and boundary-scan debug. This page synthesizes distributor pricing, drop-in Spartan-6 LX alternatives, and practical design considerations not consolidated on the manufacturer datasheet, helping engineers select and source the right device for high-volume production.
XC6SLX45-3FG676I - 43,661-Cell Spartan-6 FPGA | AMD
AMD XC6SLX45-3FG676I is a Spartan-6 LX field-programmable gate array with 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and a maximum internal frequency of 500 MHz, packaged in a 676-BGA. It targets industrial logic, embedded control, communications, instrumentation, and high-density programmable logic designs. A Field-Programmable Gate Array (FPGA) is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 LX family combines configurable logic blocks, block RAM, digital signal processing resources, and programmable I/O. This makes an FPGA suitable for parallel data processing, protocol bridging, control automation, signal generation, and system consolidation where changing hardware requirements are important. The verified device information identifies 43,661 logic cells, 2,138,112 RAM bits, 358 I/O, and 500 MHz internal frequency. The -3 suffix denotes the highest-performance speed grade listed in the retrieved Spartan-6 LX data. The XC6SLX45 device combines substantial programmable logic with embedded block memory, allowing designers to implement parallel datapaths and control functions in one device rather than relying on multiple fixed-function components. The XC6SLX45-3FG676I uses a 676-BGA package with a 1 mm ball pitch and is identified as lead-free in the retrieved distributor and comparison data. Its operating-temperature classification is reported as industrial in the retrieved Partstack result, while the provided DigiChip listing reports 0°C to 85°C. Designers should verify the exact temperature grade, electrical limits, package dimensions, and power requirements against the official AMD Spartan-6 documentation before release to manufacturing. Typical applications include industrial automation, test and measurement equipment, communications infrastructure, embedded control systems, data acquisition, and digital signal processing. The large I/O count is valuable for systems requiring parallel interfaces, while the RAM resources support buffering, packet storage, lookup tables, and high-throughput parallel logic. FPGA designs must also account for configuration setup, clocking, power delivery, thermal performance, signal integrity, and pin assignment. For a new design, use the official AMD Spartan-6 package files and datasheet to confirm every BGA ball assignment, power rail, decoupling requirement, configuration interface, and supported I/O standard. This page summarizes verified catalog data and highlights the practical design considerations that matter most when selecting, routing, sourcing, or replacing this FPGA.
XC6SLX45-3FGG484C - Spartan-6 LX FPGA, 43K Logic Cells | AMD
The AMD (formerly Xilinx) XC6SLX45-3FGG484C is a Spartan®-6 LX field-programmable gate array (FPGA) featuring 43,661 logic cells, 316 user I/Os, and 2,138,112 system gates in a 484-ball flip-chip BGA package with 1.0 mm ball pitch (FBGA-484). It targets the -3 commercial speed grade and delivers up to 862 MHz operating frequency. An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor that combines programmable logic blocks, configurable interconnects, and dedicated hardware resources such as block RAM, DSP slices, and clock management tiles. FPGAs occupy the broader category of programmable logic devices (PLD) within digital semiconductors, sitting between fixed-function ASICs and general-purpose microcontrollers in design flexibility. The Spartan-6 family uses a 45 nm CMOS process and offers a low-cost, low-power platform for high-volume applications in industrial, consumer, and communications markets. The XC6SLX45 contains 2,011 Kbits of embedded block RAM, 58 DSP48A1 slices for fixed-point arithmetic, a clock management tile (CMT) with two mixed-mode clock managers (MMCMs) and a phase-locked loop (PLL), and integrated SelectIO™ technology that supports voltages from 1.2 V to 3.3 V per I/O bank. The device integrates a hard memory controller block (MCB) supporting DDR, DDR2, DDR3, and LPDDR external memory interfaces without consuming FPGA fabric resources. Typical applications include industrial motor control, video processing pipelines, automotive driver-assistance subsystems, communications backplane bridging, and consumer electronics requiring flexible logic integration. The wide I/O count and embedded memory make it well-suited for high-density glue logic replacement, custom peripheral interfacing, and pre-silicon prototyping of ASIC designs. When designing with this FPGA, ensure the PCB layout follows AMD's package guidelines for FBGA-484, including 1.0 mm pitch escape routing, matched-length pairs for SelectIO LVDS pairs, and decoupling capacitors within 100 mils of each power pin. The device operates across 0 °C to +85 °C commercial junction range and requires multiple supply rails (VCCINT 1.0 V–1.05 V, VCCAUX 2.5 V, VCCO 1.2 V–3.3 V) that must be sequenced according to the datasheet recommendations. Compared to CPLDs, FPGAs deliver much higher logic density at the cost of static power and configuration memory. Within the Spartan-6 LX sub-family, the LX45 occupies the mid-density position above LX16/LX25 and below LX75/LX100, balancing cost per logic cell against usable I/O count. Choose LX45 when designs exceed LX25 capacity but do not require LX75 block RAM or DSP headroom. This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet alone.
XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD
The AMD XC6SLX75-2FG484C is a Spartan-6 LX field-programmable gate array with 667 MHz internal frequency, 5,831 configurable logic blocks, 74,637 logic cells, and 484-ball FBGA packaging. It is designed for cost-sensitive, high-volume systems that combine programmable logic, extensive I/O, and integrated processing resources. The device operates from a 0 to 85 C temperature range and uses a 23 x 23 mm, 1 mm pitch MS-034 FBGA package. A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. The XC6SLX75 belongs to the Spartan-6 LX family and is positioned as a general-purpose FPGA for industrial, communications, control, signal-processing, and embedded systems. Its architecture allows designers to implement parallel logic, state machines, interfaces, and control functions in one programmable device while retaining the flexibility of hardware reconfiguration. The verified specifications identify 5,831 CLBs and 74,637 logic cells, providing substantially more programmable logic than small control FPGAs while remaining within a single high-density package. The 667 MHz figure is an internal frequency specification, not a guarantee that every design will achieve that frequency; external memory interfaces, timing constraints, I/O standards, routing congestion, and clocking requirements still determine achievable performance. The -2 suffix identifies the device speed grade, while the 484 package determines the board-level ball pattern and PCB land pattern. Typical designs can use the FPGA for industrial automation, machine vision, real-time networking, communications infrastructure, embedded control, and digital signal processing. The high pin count supports broad parallel interfaces and multiple I/O banks, while the large logic capacity allows complex datapaths and protocol state machines. The 23 x 23 mm FBGA-484 package requires careful escape-routing, via-in-pad or through-via fanout planning, and controlled assembly thermal conditions. The XC6SLX75-2FG484C should be selected when a design needs more parallelism and logic density than a small programmable device, while retaining the cost profile associated with the Spartan-6 family. Verify the exact AMD datasheet, package pinout file, voltage requirements, memory interfaces, configuration scheme, and speed-grade limits before layout or production release.
XC6SLX75-2FG484I - 74,637 LE Spartan-6 LX FPGA | AMD
The AMD XC6SLX75-2FG484I is a Spartan-6 LX field-programmable gate array with 74,637 configurable logic elements, 5,831 logic blocks, up to 280 I/O, a 667 MHz internal frequency, and a 484-ball FBGA package. It targets industrial systems operating from 0°C to +85°C. The -2 speed grade and 23 mm by 23 mm, 1 mm-pitch MS-034 package make this device suitable for embedded control, communications, instrumentation, industrial automation, and signal-processing systems requiring programmable parallel logic and substantial I/O density. Its supply-voltage details, memory resources, block inventory, and complete ball assignment are not present in the supplied excerpts and must be confirmed in the manufacturer documentation. A field-programmable gate array is a programmable digital semiconductor containing configurable logic blocks, programmable interconnect, and input/output resources. In the product hierarchy, an FPGA is a semiconductor and programmable logic device. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA can implement parallel data paths, state machines, protocol interfaces, and digital signal-processing functions in hardware. The Spartan-6 LX family is AMD's cost-oriented FPGA platform for designs that need substantial logic capacity without moving to a larger device. The verified device data identifies 74,637 configurable logic elements and 5,831 logic blocks. It also specifies up to 280 I/O and a 667 MHz internal frequency. These figures make the XC6SLX75 useful where many external interfaces or concurrent operations are required. The industrial temperature range of 0°C to +85°C supports controlled equipment environments, while the -2 suffix identifies the device speed grade. Exact performance at a particular clock depends on the selected logic path, I/O standard, timing constraints, and implemented design. The XC6SLX75-2FG484I is packaged as a 484-pin FCBGA/FBGA in a 23 mm by 23 mm body with 1 mm ball pitch. A 484-ball package exposes more programmable connections than lower-pin-count FPGA packages and supports memory interfaces, parallel buses, high-speed serial I/O, clocks, control signals, and configuration resources. Because a BGA package has hidden solder joints and dense ball spacing, PCB layout, assembly, X-ray inspection, cleaning, and thermal verification are important parts of a reliable implementation. Typical designs include industrial controllers, data-acquisition systems, embedded video-processing pipelines, communications gateways, motion-control equipment, and instrumentation. The large logic-element count can host parallel acquisition logic, digital filters, protocol converters, and host interfaces. Engineers must confirm whether external memory, differential clocks, high-speed transceivers, clock-management resources, and required voltage rails exist in the selected device before assigning pins. Configuration storage, programming cable compatibility, and bitstream generation should be validated with the complete AMD Spartan-6 documentation and tools. A key design consideration is timing closure at the verified 667 MHz device frequency. Constraints should describe the actual clock domain and all synchronous I/O paths, while post-route timing reports must be reviewed rather than treating 667 MHz as a guaranteed system-level operating point. Power estimation should include core, configuration, I/O, and auxiliary rails. Decoupling, ball-grid escape routing, layer transitions, return paths, and via-in-pad or microvia construction also need controlled-library verification. This page consolidates the exact distributor-listed specifications, verified 484-BBGA alternatives, package constraints, and procurement-oriented engineering guidance. It also distinguishes documented values from unavailable parameters instead of estimating resource counts, prices, compliance status, pin functions, or timing behavior. Designers should obtain the official Spartan-6 LX data sheet, package files, errata, and selected board constraints before releasing a production schematic or layout.
XC6SLX75-2FG676I - 74,637-Cell Spartan-6 LX FPGA
The AMD XC6SLX75-2FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 408 I/O, and a stated internal frequency of 667 MHz, supplied in a 676-BGA package. It combines programmable logic, block RAM, and DSP resources in one reconfigurable semiconductor for embedded control, signal processing, communications, and industrial systems. A field-programmable gate array is a digital integrated circuit whose interconnect and logic functions are configured after manufacture. An FPGA sits above fixed-function logic in the hardware hierarchy: designers implement parallel datapaths, state machines, interfaces, and protocol engines using hardware description code. Unlike a microcontroller that primarily executes software, the XC6SLX75 can execute many operations concurrently, making it suitable for deterministic control and high-throughput digital processing. The verified source data identifies the device as a Spartan-6 LX FPGA with 74,637 logic cells, 5,831 configurable logic blocks, and up to 400 inputs or outputs according to one distributor result. The package is identified as 676-BGA by DigiKey and Mouser listings. One secondary result instead associates an FBGA-484 designation with the MPN, creating a source conflict; engineers should therefore validate the exact ball map and package drawing before releasing a PCB footprint. The -2 suffix identifies the performance-grade ordering used by the source listings, while the trailing I indicates the industrial temperature designation in the verified comparison data. One source reports an operating range of 0 to 85 C, while another distributor source reports -40 to 100 C. Because the range is inconsistent across retrieved snippets, use the manufacturer ordering guide and package drawing as the controlling documents for production qualification. Typical uses include industrial control, data acquisition, communications gateways, embedded vision, instrumentation, and digital signal processing. The large pin count supports broad parallel connectivity to external memory, transceivers, converters, and custom interfaces. FPGA designs still require careful partitioning for timing closure, clocking, power integrity, and thermal performance. A robust integration decision starts with AMD package pinout files, Vivado tool compatibility, memory-interface requirements, and I/O standards. Do not treat a distributor description as a substitute for the official Spartan-6 documentation. This page separates verified values, flags conflicts, and avoids asserting unverified voltage, pin-level, lifecycle, and compliance details.
XC6SLX75-2FGG484I - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
The AMD (formerly Xilinx) XC6SLX75-2FGG484I is a Spartan-6 LX Field Programmable Gate Array (FPGA) with 74,637 logic cells, 3,170,304 system gates, 280 user I/Os, and 4,824 Kbits of Block RAM, housed in a 484-ball fine-pitch BGA (FBGA-484) package at the -2 speed grade and industrial (I) temperature rating. It is built on a 45 nm CMOS process and operates from a 1.14 V to 1.26 V core supply, delivering up to 667 MHz internal performance. A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, programmable interconnect, and dedicated silicon resources (Block RAM, DSP slices, PLLs, transceivers on some variants) that can be hardware-tailored after PCB assembly. FPGAs sit between fixed-function ASICs and software-programmable processors in the compute taxonomy: integrated circuit -> digital IC -> programmable logic -> FPGA -> Spartan-6 family -> LX (logic-optimized) sub-family. They are used when time-to-market, parallel processing, and hardware reconfigurability outweigh the unit-cost advantage of mass-produced ASICs. Key features of the XC6SLX75-2FGG484I include 11,650 logic slices (each containing four 6-input LUTs and eight flip-flops), 3,170 Kbits of dedicated Block RAM (180 18-Kbit blocks), 132 DSP48A1 slices for fixed- and floating-point arithmetic, six clock management tiles (CMTs) with PLL + DLL capability, integrated PCIe endpoint block (only on LXT, NOT on LX), and on-chip 100 MHz clock support with up to 667 MHz DCM/PLL output. The -2 speed grade balances performance and power versus the -3 (highest performance) and -1L (lowest power) grades. Industrial temperature grade (-40 °C to +100 °C ambient, with junction allowed up to +125 °C) supports harsh-environment deployment. Spartan-6 LX uses a 45 nm 9-metal-layer CMOS process and a power-optimized core that supports 1.2 V core operation. Hard IP blocks (Block RAM, DSP slices, multi-boot controller, JTAG/ICAP/SPI configuration ports) live alongside the programmable fabric, enabling deterministic single-chip solutions for bridging, motor control, video processing, and embedded compute. Typical applications include industrial automation controllers, automotive infotainment bridging, video processing pipelines, software-defined radio, portable medical imaging, LED video walls, and PCIe endpoint expansion bridges. The 280 user I/Os make the 484-BGA package especially well-suited for high-pin-count industrial designs where several external buses must be addressed simultaneously. When designing with this FPGA, allocate at least 0.5 A per 100 K logic cells for VCCINT, and follow AMD UG393 (Spartan-6 PCB Design Guide) for decoupling, pinout, and signal-integrity rules. Industrial-grade parts cost roughly 20-30 % more than commercial-grade XC6SLX75-2FGG484C and should be chosen only when the operating environment exceeds 0 °C to +85 °C. This page synthesizes distributor pricing, drop-in replacement candidates, and design notes that are not consolidated in the AMD Spartan-6 datasheet alone.
XC6SLX75-3CSG484C - Spartan-6 LX FPGA, 74K Logic Cells, 484-BGA | AMD
The AMD (formerly Xilinx) XC6SLX75-3CSG484C is a Spartan-6 LX family Field-Programmable Gate Array (FPGA) built on a 45 nm low-power copper CMOS process, integrating 74,637 logic cells and 3,170,304 system gates into a 484-ball Chip-Scale BGA (CSBGA) package measuring 23 x 23 mm with 1.0 mm ball pitch. It targets high-volume cost-sensitive applications requiring high logic density with low static and dynamic power. What is a Spartan-6 FPGA? The Spartan-6 family is the sixth generation of Xilinx's low-cost, high-volume FPGA line, sitting within the broader taxonomy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-power FPGA. Built on a mature 45 nm process, Spartan-6 devices combine programmable logic fabric, Block RAM, DSP slices, and hard IP cores (clock management, PCIe, memory controllers) into a single die, offering ASIC-like integration at FPGA-like flexibility. Key features of the XC6SLX75 include 5831 Configurable Logic Blocks (CLBs), up to 309 Kbits of Block RAM, a maximum internal operating frequency of 667 MHz, and 328 user I/O pins. The device is offered in the -3 speed grade (the highest performance tier of the LX family), commercial temperature range (0 to 85 C), and supports supply voltages from 1.2 V core to 3.3 V I/O. Integrated hard IP includes DSP48A1 slices for fixed- and floating-point arithmetic, SelectIO with support for multiple I/O voltages, and a memory controller block for DDR, DDR2, DDR3, and LPDDR. The LX sub-family is positioned below the LXT (which adds transceivers) and above the Spartan-6 lower-density LX devices. Architecture highlights include 6-input LUTs, dual-port Block RAM with byte-wide parity, and dedicated 18 x 18 multipliers. The 45 nm process yields approximately 50% lower static power than the prior Spartan-3A generation while supporting higher clock rates through dedicated carry chains and pipelined DSP blocks. Typical applications for the XC6SLX75-3CSG484C include industrial motor control and machine vision, video processing pipelines (display controllers, surveillance DVRs), wireline communication bridges, automotive driver assistance, and consumer display interfaces. The 484-BGA footprint and high I/O count suit designs that need many LVCMOS or LVDS pairs. When designing with this device, provide multiple decoupling caps around the BGA and follow AMD's PCB layout guidelines for chip-scale BGAs (escape routing for the 1.0 mm pitch grid). Use the ISE Design Suite (iMPACT + ISE Project Navigator) or Vivado (legacy support) for bitstream generation and JTAG programming. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not typically aggregated on DigiKey or Mouser product pages.
XC6SLX75-3FG484I - 74637-Cell Spartan-6 FPGA | AMD
The AMD XC6SLX75-3FG484I is a Spartan-6 LX field-programmable gate array built on 45 nm CMOS technology, with 74,637 logic cells, 280 I/O, and a 484-ball FBGA package. The -3 speed grade is identified by the provided sources as the highest-performance Spartan-6 LX grade, while the I suffix denotes the industrial-temperature option listed at 0°C to 85°C. One distributor specification lists 5,831 configurable logic blocks and 667 MHz internal frequency, while another catalog listing states 862 MHz; engineers should verify the exact timing interpretation against the applicable AMD datasheet and selected device documentation before using either figure as a design limit. A field-programmable gate array, or FPGA, is a programmable logic device whose configurable logic blocks, programmable interconnect, block RAM, and digital signal-processing resources can be interconnected after manufacture. Within the semiconductor hierarchy, this device is a Spartan-6 FPGA, then a programmable-logic IC and digital semiconductor. Its large logic capacity and high pin count suit parallel control, protocol bridging, data acquisition, embedded signal processing, and industrial automation systems that need deterministic hardware parallelism. The verified listings identify 74,637 cells, 45 nm CMOS fabrication, a nominal 1.2 V supply, 280 user I/O, and a 23 mm by 23 mm FBGA-484 package with 1 mm pitch. The -3 grade provides the family’s highest performance positioning according to the supplied specification source. This matters in timing-sensitive designs, but nominal family speed alone does not determine achievable clock frequency; routing, resource type, voltage, temperature, timing constraints, and design effort remain decisive. The 484-ball package exposes substantially more interconnect than a typical low-pin-count FPGA, making it appropriate for high-bandwidth parallel systems and substantial external memory or peripheral interfaces. Conversely, it requires careful escape routing, via-in-pad-aware assembly, thermal analysis, and BGA-aware inspection. Configuration storage, bank supply requirements, supported I/O standards, and pin constraints must be checked in the official pinout and package files. Typical uses include industrial machine vision, robotics, test-and-measurement front ends, networking equipment, embedded video control, and high-throughput digital acquisition. The programmable resources allow parallel pipelines and multiple interfaces to coexist without relying entirely on a microcontroller for timing-critical control. For each deployment, engineers should validate memory-mapper resources, clocking, pin assignments, configuration mode, and timing closure in AMD development tools. A critical design step is to preserve BGA thermal and assembly margin by following AMD package guidelines and validating the completed PCB stack-up. Power rails should be decoupled according to the manufacturer guidance, while clocks and high-speed interfaces require controlled return paths. This page combines verified catalog specifications, sourcing data, and engineering guidance while clearly separating confirmed facts from values requiring further documentation.
XC6SLX75-3FG676C - 74,637-Cell Spartan-6 LX FPGA
The AMD Xilinx XC6SLX75-3FG676C is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, and a listed internal frequency of 667 MHz, housed in a 676-ball FBGA package. It is built on 45 nm CMOS technology and targets systems requiring high integration, programmable logic, and a broad range of I/O. The device is identified as a -3 speed-grade part, while its commercial operating-temperature range is listed as 0°C to 85°C. A field-programmable gate array is a semiconductor device whose digital logic and interconnect can be configured after fabrication. FPGAs belong to the programmable-logic hierarchy, alongside CPLDs, and are commonly used for rapid prototyping, embedded control, signal processing, interface bridging, and hardware acceleration. Unlike a fixed-function ASIC, an FPGA allows logic, memory, and interfaces to be changed during design revisions by updating the configuration bitstream. The XC6SLX75-3FG676C provides 74,637 logic cells and 5,831 CLBs according to the supplied distributor records. Its 676-ball package supports a large pin count for high-I/O designs, while the 45 nm Spartan-6 process provides programmable logic, block RAM, DSP resources, and selectable I/O standards. The listed internal frequency is 667 MHz, although achievable system clocking and interface rates depend on the selected clocking resources, I/O standards, timing constraints, and PCB implementation. Typical uses include industrial automation, automotive infotainment, consumer electronics, communications infrastructure, and embedded processing systems. The -3 grade is described in the supplied comparison material as the highest-performance Spartan-6 LX speed grade. A 676-BGA package also requires careful PCB layout, including adequate escape routing, controlled-length clock paths, solid power distribution, and thermal management for sustained operation. The most important design tradeoff is integration versus package complexity. The large FBGA footprint offers substantial programmable resources and I/O capacity, but it requires fine-pitch layout capability, via-in-pad or escape-routing strategies, and careful assembly controls. Before releasing a design, engineers should verify the exact pin assignments, configuration requirements, power rails, clocking plan, and I/O voltage limits against the manufacturer datasheet. This page combines verified distributor specifications, cross-reference results, package details, pricing context, and practical integration guidance. Because the supplied data does not include complete electrical tables or a validated manufacturing quote, unavailable values are explicitly identified rather than inferred.
XC6SLX75-3FG676I - 74,637-Cell Spartan-6 FPGA | AMD
The AMD XC6SLX75-3FG676I is a Spartan-6 LX field-programmable gate array with 74,637 logic cells, 5,831 configurable logic blocks, 408 I/O, and an industrial temperature grade in a 676-ball FCBGA package. Verified listings identify an 862 MHz maximum device frequency, a 27 mm by 27 mm body, a 1 mm ball pitch, and CMOS fabrication. The -3 speed grade is the highest-performance Spartan-6 LX grade presented in the verified comparison data. An FPGA is a programmable semiconductor in the broader logic and semiconductor hierarchy. Instead of fixing Boolean logic at fabrication, its configurable lookup tables, routing networks, block RAM, DSP resources, and I/O blocks can be programmed after manufacture. The Spartan-6 LX family is designed for high-volume systems requiring broad programmable logic integration at relatively low cost. The XC6SLX75-3FG676I provides 74,637 logic cells organized as 5,831 CLBs and exposes 408 I/O. Its verified maximum frequency is 862 MHz, although achievable user logic frequency depends on the selected clocking, routing, device resources, and timing constraints. The industrial suffix denotes industrial temperature grading, while the -3 code identifies the high-performance speed grade. The 676-ball, 1 mm-pitch package supports dense board integration but requires advanced PCB layout and assembly capability. Its architecture fits parallel data acquisition, control, signal generation, protocol bridging, image processing, and embedded system integration. The available logic, memory, and I/O resources can consolidate functions that otherwise require multiple programmable or fixed-function devices. Engineers must still verify the exact RAM, DSP, transceiver, clock, and I/O capability required by each design against the AMD family documentation. The target is supplied in a 676-ball FCBGA package reported as 27 mm by 27 mm with a 1 mm pitch. BGA assembly requires board escape routing, via-in-pad or fanout strategy, appropriate solder-mask and paste design, X-ray inspection capability, and controlled reflow. Although the package supports high I/O density, routing to its 676 balls is materially more demanding than leaded-package assembly. Design planning should begin with the AMD Spartan-6 package pinout files and the device-specific timing, power, and configuration guidance. Confirm the exact bill of materials, pin mapping, supported I/O standards, clocking resources, configuration interface, decoupling requirements, and thermal assumptions before release. Vendor snippets conflict on frequency and package details, so this page treats the direct DigiKey, Mouser, LCSC, and FindIC records as separate evidence sources rather than merging contradictory fields. This page consolidates verified distributor availability, package and resource comparisons, procurement context, and practical BGA implementation guidance. It also distinguishes device-grade variants from unqualified replacements so engineers can evaluate alternatives without assuming that a similar FPGA name guarantees timing, temperature, or pin compatibility.
XC6SLX75T-2CSG484C - Spartan-6 FPGA 74,637 LEs | AMD
The AMD XC6SLX75T-2CSG484C is a Field Programmable Gate Array (FPGA) from the Spartan-6 LXT family, built on a mature 45 nm low-power copper process technology. It delivers 74,637 logic cells, 3,170,304 total RAM bits, and 292 user I/O pins in a 484-pin CSBGA (19x19 mm) package. Operating from a 1.2V core supply (1.14V to 1.26V range), this device is designed for high-volume applications requiring leading system integration at the lowest total cost. An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement any digital logic function. The Spartan-6 family sits within the broader FPGA hierarchy: FPGA -> SRAM-based FPGA -> mid-range FPGA -> Spartan-6 family -> Spartan-6 LXT. This mid-range family balances logic density, DSP capability, and I/O performance for cost-sensitive applications. Key features of the XC6SLX75T-2CSG484C include 74,637 logic cells, 3,170,304 RAM bits, 292 user I/O pins, and support for multiple I/O standards including LVCMOS, LVDS, and HSTL. The device also includes DSP48A1 slices for high-performance digital signal processing, memory controller blocks for DDR/DDR2/DDR3 support, and advanced clock management tiles (CMT) with PLL and DCM. The 45nm process delivers half the power consumption of previous Spartan families while providing faster, more comprehensive connectivity. Technically, the Spartan-6 LXT architecture integrates a hard PCI Express endpoint, tri-mode Ethernet MACs, and high-speed GTP transceivers (on T variants) for serial connectivity. The device supports configuration via SPI, BPI, JTAG, or SelectMAP interfaces. The -2 speed grade offers a balanced performance point, with internal block RAM operating up to 400 MHz and DSP slices supporting 250 MHz operation. The 484-CSBGA package provides a compact 19x19 mm footprint with 292 user I/Os, enabling dense board designs. Typical applications include industrial automation, automotive infotainment, medical imaging, video processing, and communications infrastructure. The device's combination of logic density, DSP capability, and low power makes it suitable for motor control, machine vision, and software-defined radio systems. The 1.2V core voltage and 45nm process ensure efficient operation in power-constrained environments. When designing with this device, ensure adequate decoupling on the 1.2V core supply and 2.5V/3.3V auxiliary rails. Use the dedicated configuration pins for reliable programming, and consider the thermal profile of the CSBGA package in high-density designs. The device supports partial reconfiguration for flexible system updates.
XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD
The AMD (Xilinx) XC6SLX9-2CPG196I is a Spartan-6 LX family Field Programmable Gate Array (FPGA) built on a 45 nm CMOS process, integrating 9,152 logic cells across 715 configurable logic blocks (CLBs) in a 196-ball Chip-Scale BGA (CSBGA) package. The device provides up to 106 user I/O pins, 576 Kbit embedded block RAM, dedicated DSP48A1 slices, and operates across the industrial -40C to +100C temperature range with a -2 speed grade offering up to 667 MHz internal clock performance. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic function is defined after manufacturing by configuration bitstream loading, belonging to the programmable logic device family within the broader digital semiconductor taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). Unlike fixed-function ASICs, FPGAs use an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP blocks (Block RAM, DSP slices, transceivers, clock management tiles) to implement arbitrary digital logic. The Spartan-6 LX family targets cost-sensitive, high-volume applications requiring low static and dynamic power without sacrificing performance. Key features of the XC6SLX9-2CPG196I include 576 Kbits of block RAM, 16 DSP48A1 slices at 18x18 multiplication, an integrated hard IP for PCI Express endpoint (Gen1), dedicated Memory Controller block supporting DDR, DDR2, DDR3, and QDR II+ interfaces, plus the security-enhanced SelectIO technology. The 196-ball CSBGA package supports up to 106 user I/Os with 1.2V core operation and 2.5V/3.3V tolerant SelectIO interfaces, simplifying multi-voltage system integration. Architecturally, the Spartan-6 LX FPGA uses a 6-input LUT-based logic fabric with dedicated carry chains for arithmetic, dual-port Block RAM columns distributed throughout the fabric, and DSP48A1 slices combining an 18x18 multiplier with a 48-bit accumulator. On-chip clock management tiles (CMTs) integrate PLLs and DLLs for flexible clock synthesis. The -2 speed grade balances die cost against timing closure in mainstream applications. Typical applications include industrial motor control, video processing front-ends, low-cost consumer electronics with custom logic, legacy industrial protocol bridging, and PCIe endpoint cards. The wide operating temperature and DSP slices make it suitable for portable test instruments and embedded vision pre-processing. When designing with this part, verify that the 196-ball CSBGA footprint is within PCB layout capability for fine-pitch BGA assembly, and confirm that Vivado (or legacy ISE for older toolchain compatibility) supports the Spartan-6 family design flow, since newer Vivado versions may require legacy installation. This page synthesizes cross-reference equivalents, applied design context, and distributor pricing not found in the standalone AMD datasheet, giving engineers a one-stop selection resource for the XC6SLX9-2CPG196I.
XC6SLX9-2CSG225C - Spartan-6 LX FPGA, 9152 Cells, 160 I/O | AMD
The AMD (Xilinx) XC6SLX9-2CSG225C is a Spartan-6 LX field programmable gate array (FPGA) integrating 9,152 logic cells (715 Configurable Logic Blocks) into a 225-ball Chip-Scale BGA (CSG225) package with 160 user I/Os. Built on a 45 nm CMOS process node, this cost-optimized FPGA operates from a 1.14 V to 1.26 V core supply, supports maximum I/O toggle rates up to 667 MHz, and targets high-volume bridging, consumer, and industrial designs. An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement any digital circuit in hardware via LUTs (Look-Up Tables) and programmable interconnects. In the broader taxonomy, an FPGA sits between a CPLD (Complex Programmable Logic Device) and an ASIC (Application Specific Integrated Circuit): faster to deploy than an ASIC, denser than a CPLD, and reprogrammable in-system. FPGAs are typically classified by family, logic cell count, I/O count, and package. Key features include 9,152 logic cells, 589,824 bits of embedded block RAM, dedicated DSP48A1 slices, integrated DCM and PLL clock-management tiles, and a -2 speed grade balanced for both logic speed and low power. Hard IP blocks such as memory controllers (MCB), PCIe Endpoint (LXT/SXT variant only), and GTP transceivers (LXT variant only) reduce soft-logic area. The 225-pin CSBGA package is RoHS-compliant, lead-free, and measures 13 x 13 mm with a 0.8 mm ball pitch. Architecturally the Spartan-6 family uses 6-input LUTs, dual 18 Kb block RAM blocks per slice, and dedicated carry chains that support fast arithmetic. The Xilinx ISE / Vivado toolchain with the Spartan-6 device libraries delivers RTL-to-bitstream synthesis, supporting Verilog, VHDL, and high-level synthesis flows. Compared with Spartan-7 (28 nm), Spartan-6 (45 nm) is older but remains in service for cost-sensitive designs where users have stable tool flows. Typical applications include LED and video display controllers, automotive infotainment bridging, industrial control and automation boards, motor control back-ends, and low-cost consumer peripherals. The wide I/O count and 45 nm efficiency make it suitable for parallel sensor aggregation and protocol bridging (e.g. UART/SPI/I2C to high-speed LVDS). Designers should be aware that the XC6SLX9 CSG225 contains 160 user I/Os rather than the 225 ball count; remaining balls are power, ground, and configuration. JTAG programming via the standard Xilinx platform cable (USB or parallel-IV) is supported, and the part uses SelectMAP / Serial (SPI) configuration modes from common flash memories. The ISE 14.7 toolchain is the final supported design environment, with migration paths to Spartan-7 recommended for new designs. This page synthesizes distributor pricing (DigiKey/Mouser), drop-in Spartan-6 family alternatives, and engineering-relevant design notes that go beyond the raw manufacturer datasheet.
XC6SLX9-2CSG225I - 9152-Cell Spartan-6 FPGA | AMD
AMD/Xilinx XC6SLX9-2CSG225I is a Spartan-6 LX field-programmable gate array containing 9,152 programmable logic cells, 589,824 RAM bits, 160 user I/O, and 715 configurable logic blocks in a 225-ball CSPBGA package. The supplied data identifies a 1.14 V to 1.26 V operating-supply range, a -2 speed grade, and an industrial temperature designation. An FPGA is a semiconductor whose digital logic, interconnects, memory resources, and I/O behavior are configured after manufacture. The Spartan-6 family belongs to the FPGA and CPLD hierarchy and is commonly used where parallel logic, embedded block RAM, programmable interfaces, and deterministic control must be consolidated into one configurable device. Unlike a fixed-function microcontroller, this device does not execute software as its primary operating model; it implements a hardware circuit defined by a bitstream. Verified listings report 160 I/O, 589,824 total RAM bits, 9,152 logic cells, and 715 CLBs. This resource mix makes the part suitable for control logic, protocol bridging, data acquisition, preprocessing, industrial automation, and embedded signal-processing systems. The -2 suffix denotes the device speed grade, while the I suffix identifies the industrial-grade ordering variant. Its CSPBGA-225 package measures 13 mm by 13 mm according to the supplied comparison data. The XC6SLX9 device combines programmable logic with dedicated block RAM and user I/O in one package. Exact I/O standards, supported interfaces, pin functions, clocking limits, configuration requirements, and AC timing values are not provided in the verified excerpts and must therefore be confirmed against AMD documentation before schematic capture or PCB release. The package is a complex BGA device requiring careful escape routing and controlled assembly. Typical installations include industrial controllers, sensor and measurement interfaces, communications equipment, video or imaging control, and compact embedded systems requiring deterministic parallel behavior. Designers should select I/O standards and voltage domains supported by the selected bank, preserve configuration access, validate pin assignments, and confirm timing against the design’s clock and interface requirements. A critical integration concern is BGA layout quality: layer count, via strategy, solder-mask definition, pad-to-mask ratios, and assembly capability should be reviewed early because the CSPBGA-225 footprint is difficult to inspect visually after assembly. Use AMD’s package and pinout resources rather than inferring ball assignments from the commercial suffix. This page consolidates verified distributor specifications, source availability, cross-reference findings, and engineering-oriented cautions that are not presented as one unified block in the original product snippets. It distinguishes confirmed values from missing technical data rather than estimating pinout, timing, or performance parameters.
XC6SLX9-2FT256C - 9K-LUT Spartan-6 FPGA | AMD
The AMD/Xilinx XC6SLX9-2FT256C is a Spartan-6 LX field-programmable gate array with 9,152 logic cells, 186 I/O, and a -2 speed grade in a 256-ball FTBGA package. The commercial-temperature device is identified as the FTBGA-256 option and is specified for 0°C to 85°C operation. Its verified internal-frequency listing reaches 667 MHz, although implemented system performance depends on the selected clocking resources, design constraints, I/O standards, and timing closure. This device is a programmable-logic semiconductor: configurable LUTs, registers, block RAM, and dedicated resources implement digital control, datapath, interface, and signal-processing functions. It belongs to the hierarchy FPGA → programmable logic device → digital semiconductor. A Spartan-6 LX FPGA is a reprogrammable integrated circuit used when fixed-function logic is insufficient or when one programmable device can consolidate multiple functions onto a compact board. The XC6SLX9 combines 9,152 logic cells and 186 I/O in the FTBGA-256 package, making it relevant to industrial control, communications, embedded instrumentation, and compact digital subsystems. Designers select pin constraints, I/O standards, clocking, memory interfaces, and timing constraints in the associated FPGA development environment before programming the device. Verified feature data establishes the device type as an FPGA, the logic-cell count as 9,152, the I/O count as 186, and the maximum listed internal frequency as 667 MHz. The -2 suffix denotes the device speed grade, while the trailing C denotes the commercial temperature option. The package is specified as 17 mm × 17 mm, 1 mm pitch, MS-034, FTBGA-256. These facts make exact device identification essential: package outline, speed grade, temperature grade, bitstream, voltage configuration, and pin constraints must all be checked before substitution. The target is suitable for parallel digital logic, embedded control logic, bus bridging, and application-specific signal processing where 9,152 LUT-based logic cells are sufficient. It can consolidate control and datapath logic while reducing discrete-component count, although final utility depends on memory, clock, and I/O requirements. The supplied sources do not verify RAM capacity, block-RAM count, DSP resources, supported I/O standards, power rails, or complete electrical timing tables; those specifications must be obtained from the manufacturer documentation before schematic or timing sign-off. A critical procurement consideration is traceability. Distributor and aggregation listings identify the XC6SLX9-2FT256C, while LCSC reports an in-stock listing and a starting price of $9.5017. The Mouser and Octopart pages provide purchasing and aggregation paths, but no complete quantity-price table is present in the supplied data. Engineers should compare authorized sourcing, lot traceability, date codes, and documented lifecycle status before committing an industrial or long-lived design. This page consolidates verified distributor specifications, package details, pricing references, and replacement screening into a design-focused record. It also distinguishes exact package-compatible family variants from unsupported assumptions, reducing the risk of treating a different Spartan-6 grade as an unconditional drop-in replacement.