XC6SLX75-2FG484C - 667 MHz Spartan-6 LX FPGA | AMD
Référence : XC6SLX75-2FG484C ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.1703 | $42,17 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
XC6SLX75-2FG484C Présentation
A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. The XC6SLX75 belongs to the Spartan-6 LX family and is positioned as a general-purpose FPGA for industrial, communications, control, signal-processing, and embedded systems. Its architecture allows designers to implement parallel logic, state machines, interfaces, and control functions in one programmable device while retaining the flexibility of hardware reconfiguration.
The verified specifications identify 5,831 CLBs and 74,637 logic cells, providing substantially more programmable logic than small control FPGAs while remaining within a single high-density package. The 667 MHz figure is an internal frequency specification, not a guarantee that every design will achieve that frequency; external memory interfaces, timing constraints, I/O standards, routing congestion, and clocking requirements still determine achievable performance. The -2 suffix identifies the device speed grade, while the 484 package determines the board-level ball pattern and PCB land pattern.
Typical designs can use the FPGA for industrial automation, machine vision, real-time networking, communications infrastructure, embedded control, and digital signal processing. The high pin count supports broad parallel interfaces and multiple I/O banks, while the large logic capacity allows complex datapaths and protocol state machines. The 23 x 23 mm FBGA-484 package requires careful escape-routing, via-in-pad or through-via fanout planning, and controlled assembly thermal conditions.
The XC6SLX75-2FG484C should be selected when a design needs more parallelism and logic density than a small programmable device, while retaining the cost profile associated with the Spartan-6 family. Verify the exact AMD datasheet, package pinout file, voltage requirements, memory interfaces, configuration scheme, and speed-grade limits before layout or production release.
Alternatives de remplacement direct pour XC6SLX75-2FG484C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX75-2FG484C (même facteur de forme et même empreinte) — différant par Mounting Type, Speed Grade, Logic Cells, Process Technology, Device Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC6SLX75-2FGG484I
✅ Remplacement direct✓ En stock
$82.1 / unité
Voir la fiche technique →XC6SLX75-3FG484I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →XC6SLX75T-2FG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75-2FG484C Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Internal Frequency | 667 MHz |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| Package Type | 484-BBGA, MS-034 FBGA |
| Package Dimensions | 23 x 23 mm |
| Package Pitch | 1 mm |
| Number of Balls | 484 balls |
| Température de fonctionnement | 0 to 85 C |
| Speed Grade | -2 |
| Temperature Grade | Commercial |
| Process Technology | CMOS |
| Type de montage | Surface mount ball grid array |
Guide de configuration des broches du XC6SLX75-2FG484C 1 mm
Configuration des broches du XC6SLX75-2FG484C (boîtier 1 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX75-2FG484C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX75-2FG484C convient pour 6 applications: Industrial Automation and PLC Control, Machine Vision and Image Processing, Real-Time Communications and Protocol Handling, Motor Control and Power Systems, Test and Measurement Instrumentation, Embedded Signal Processing.
Industrial Automation and PLC Control
The XC6SLX75-2FG484C fits industrial automation systems that require parallel control logic, machine interfaces, and deterministic sequencing in one programmable device. Its 74,637 logic cells and 5,831 CLBs provide room for state machines, interlocks, counters, protocol engines, and diagnostic logic without splitting a control design across several smaller devices. The 484-ball package supports a high pin count, while the 0 to 85 C commercial range suits many factory environments when enclosure temperature is controlled. A production design should still validate power rails, clocking, I/O standards, EMC, long-term sourcing, and environmental requirements.
Recommandé
Machine Vision and Image Processing
The XC6SLX75-2FG484C is suitable for machine-vision front ends where sensor timing, pixel-stream formatting, thresholding, and control logic require high parallelism. The device’s 5,831 CLBs and 74,637 logic cells can accommodate multiple pipeline stages and real-time decision paths, while the 484-ball package offers extensive I/O connectivity for cameras, transceivers, and memory interfaces. The 667 MHz internal-frequency specification is a device identifier, not a guaranteed end-to-end image throughput. Designers must constrain external memory timing, I/O standards, clock jitter, sensor latency, and thermal performance in the FPGA timing analysis.
Recommandé
Real-Time Communications and Protocol Handling
The XC6SLX75-2FG484C can implement parallel protocol engines, packet classifiers, Ethernet or serial-interface bridging, and test-and-measurement logic in a programmable FPGA. Its large CLB count supports simultaneous transmit, receive, buffering, and error-handling paths, while the 484-ball package provides room for external transceivers and memory. Designers should use the exact Spartan-6 LX device documentation to confirm supported interfaces, I/O standards, block RAM, and clock resources. System performance depends on transceiver selection, reference clocks, protocol timing, signal integrity, and timing closure rather than the internal-frequency label alone.
Recommandé
Motor Control and Power Systems
The XC6SLX75-2FG484C is useful for digital motor-control, inverter-control, and embedded power-system logic where PWM generation, current sampling, fault handling, and supervisory sequencing must run concurrently. Its programmable architecture allows control loops and protection logic to be combined with communication interfaces, while the large package can expose multiple control and measurement signals. The device is not a power semiconductor, so external gate drivers, isolation, current sensors, and protection hardware remain necessary. Validate timing margins, ADC synchronization, fault response, thermal conditions, and safety requirements in the complete system.
Recommandé
Test and Measurement Instrumentation
The XC6SLX75-2FG484C supports programmable timing, data capture, trigger logic, and parallel interface handling for test and measurement equipment. The 74,637-cell Spartan-6 LX device can implement acquisition pipelines, pattern generation, calibration logic, and control functions in parallel, while its 484-ball package supports substantial external connectivity. The 667 MHz figure should be treated as a device specification rather than a guaranteed acquisition rate. Designers must account for converter latency, clock jitter, memory bandwidth, I/O voltage, calibration, thermal drift, and the need for repeatable timing across operating conditions.
Recommandé
Embedded Signal Processing
The XC6SLX75-2FG484C can implement fixed-function signal-processing pipelines, filters, correlation, modulation, and digital control blocks when a programmable FPGA is preferred over dedicated hardware. Its 5,831 CLBs and 74,637 logic cells allow parallel datapaths and buffering, while the 484-ball package supports external converters and memory. The available verified data does not quantify block RAM, DSP slices, or user I/O, so resource-fit analysis must be performed in the selected AMD design environment. System engineers should also budget logic for interfaces, clocking, diagnostics, and timing constraints.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX75-2FG484C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX75-2FGG484I | XC6SLX75-3FG484I | XC6SLX75T-2FG484C |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 484-BBGA, 23 x 23 mm, 1 mm pitch | 484-BBGA | 484-BBGA | 484-BBGA |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX T variant |
| Speed Grade | -2 | -2 | -3 | -2 |
| Number of Balls | 484 | 484 | 484 | 484 |
Principaux différenciateurs
- Identified 667 MHz -2 device specification (vs XC6SLX75-3FG484I)
- Commercial-temperature target is explicitly identified (vs XC6SLX75-2FGG484I)
- Large logic capacity in a single 484-ball package (vs XC6SLX75-3FG484I)
- Commercial sourcing visibility (vs XC6SLX75-3FG484I)
Notes de conception
Treat the XC6SLX75-2FG484C as a 484-ball, 1 mm-pitch BGA and design the PCB escape network before placing the FPGA. Use the AMD Spartan-6 package pinout files to assign power, ground, configuration, clock, and user I/O balls. Confirm the stack-up and assembly process, then provide controlled fanout vias, low-impedance power distribution, local decoupling, and a ground strategy that supports both signal return paths and thermal dissipation. Validate escape-routing manufacturability with the board fabricator before release.
The FPGA’s 23 x 23 mm FBGA package can concentrate heat around the device, especially when the design uses high I/O activity, external memory, or sustained parallel processing. Place thermal vias and copper planes under and around the BGA where the package and assembly process permit, while preserving electrical isolation from sensitive signals. Calculate worst-case junction temperature from actual FPGA activity, ambient temperature, airflow, copper area, and package thermal data; do not assume that the commercial 0 to 85 C ambient rating alone guarantees safe internal operation.
The 667 MHz internal-frequency figure is not a substitute for interface timing analysis. Constrain clock, memory, serial, and parallel I/O paths using the actual board topology, transceiver characteristics, reference planes, and termination strategy. For high-speed external interfaces, verify package escape loss, via transitions, return-path continuity, skew, crosstalk, and connector or transceiver limits. Use the AMD timing constraints and signal-integrity workflow appropriate to the Spartan-6 LX device before release.
A same-package alternative is not automatically a drop-in replacement. Compare the exact MPN suffix, speed grade, temperature grade, configuration pins, electrical limits, package ballout, software device support, and lifecycle or sourcing status. In particular, XC6SLX75-2FGG484I and XC6SLX75-3FG484I may differ in suffix-related operating or timing requirements. Perform schematic, pinout, timing, and system-level regression review even when the package name appears identical.
Informations de conformité
The supplied verified data does not explicitly state RoHS, REACH, lead-free, halogen-free, conflict-minerals, or automotive qualification status for XC6SLX75-2FG484C. These fields remain unknown rather than being inferred from the FPGA category or manufacturer.
