XC6SLX9-2CPG196I - Spartan-6 LX FPGA, 9152 Cells, 196-CSBGA | AMD
Référence : XC6SLX9-2CPG196I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $27.95 | $2 795,00 |
| 500 | $22.4 | $11 200,00 |
| 1 000 | $19.8 | $19 800,00 |
XC6SLX9-2CPG196I Présentation
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic function is defined after manufacturing by configuration bitstream loading, belonging to the programmable logic device family within the broader digital semiconductor taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). Unlike fixed-function ASICs, FPGAs use an array of configurable logic blocks (CLBs), programmable routing, and dedicated hard IP blocks (Block RAM, DSP slices, transceivers, clock management tiles) to implement arbitrary digital logic. The Spartan-6 LX family targets cost-sensitive, high-volume applications requiring low static and dynamic power without sacrificing performance.
Key features of the XC6SLX9-2CPG196I include 576 Kbits of block RAM, 16 DSP48A1 slices at 18x18 multiplication, an integrated hard IP for PCI Express endpoint (Gen1), dedicated Memory Controller block supporting DDR, DDR2, DDR3, and QDR II+ interfaces, plus the security-enhanced SelectIO technology. The 196-ball CSBGA package supports up to 106 user I/Os with 1.2V core operation and 2.5V/3.3V tolerant SelectIO interfaces, simplifying multi-voltage system integration.
Architecturally, the Spartan-6 LX FPGA uses a 6-input LUT-based logic fabric with dedicated carry chains for arithmetic, dual-port Block RAM columns distributed throughout the fabric, and DSP48A1 slices combining an 18x18 multiplier with a 48-bit accumulator. On-chip clock management tiles (CMTs) integrate PLLs and DLLs for flexible clock synthesis. The -2 speed grade balances die cost against timing closure in mainstream applications.
Typical applications include industrial motor control, video processing front-ends, low-cost consumer electronics with custom logic, legacy industrial protocol bridging, and PCIe endpoint cards. The wide operating temperature and DSP slices make it suitable for portable test instruments and embedded vision pre-processing.
When designing with this part, verify that the 196-ball CSBGA footprint is within PCB layout capability for fine-pitch BGA assembly, and confirm that Vivado (or legacy ISE for older toolchain compatibility) supports the Spartan-6 family design flow, since newer Vivado versions may require legacy installation.
This page synthesizes cross-reference equivalents, applied design context, and distributor pricing not found in the standalone AMD datasheet, giving engineers a one-stop selection resource for the XC6SLX9-2CPG196I.
Alternatives de remplacement direct pour XC6SLX9-2CPG196I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC6SLX9-2CPG196C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX9-3CPG196I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX9-1CPG196C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX9-L1CPG196C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XA6SLX9-3CPG196I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX9-2CPG196I Valeurs maximales et caractéristiques électriques
| Series | Spartan-6 LX |
| Family | Spartan-6 |
| Logic Cells | 9152 |
| Configurable Logic Blocks (CLBs) | 715 |
| Maximum User I/O | 106 |
| Block RAM | 576 Kbits (72 Kb blocks) |
| DSP48A1 Slices | 16 (18x18 multiplier) |
| Speed Grade | -2 |
| Maximum Internal Clock Frequency | 667 MHz |
| Process Technology | 45 nm CMOS |
| Core Voltage | 1.2 V |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Boîtier | 196-ball CSBGA (8x8 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount (BGA) |
| Configuration Memory | SPI / BPI / JTAG |
| PCIe Hard IP | 1x Gen1 Endpoint |
| Memory Controller Hard IP | DDR / DDR2 / DDR3 / QDR II+ |
| Statut RoHS | Compliant |
Guide de configuration des broches du XC6SLX9-2CPG196I 196-ball csbga (8x8 mm, 0.5 mm pitch)
Configuration des broches du XC6SLX9-2CPG196I (boîtier 196-ball csbga (8x8 mm, 0.5 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX9-2CPG196I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX9-2CPG196I convient pour 6 applications: Industrial Motor Control, Video Processing Front-Ends, Low-Cost PCIe Endpoint Cards, Legacy Industrial Protocol Bridging, Embedded Vision Pre-Processing, Portable Test & Measurement.
Industrial Motor Control
The XC6SLX9-2CPG196I fits industrial motor control by combining 9,152 logic cells with 16 DSP48A1 slices operating at 250 MHz for field-oriented control (FOC) loops, SVPWM generation, and current/voltage loop compensation. Industrial motor drives typically run 10-20 kHz PWM with quadrant ADC sampling; the LX9's 576 Kbits of block RAM buffer phase-current samples and observer state without external SRAM. The 1.2V core plus 3.3V-tolerant SelectIO interfaces to gate drivers and resolver-to-digital converters with no level shifters, while the industrial -40C to +100C temperature grade supports enclosed cabinet operation. Engineers typically place the LX9 between a 32-bit MCU (which handles communications and supervisory logic) and the IGBT/MOSFET gate-driver stage, offloading deterministic real-time control from software.
Recommandé
Video Processing Front-Ends
The XC6SLX9-2CPG196I handles real-time video pipelines up to 1080p60 by leveraging 16 DSP48A1 slices for color-space conversion (RGB to YCbCr) and scaling interpolation. With 106 user I/Os the LX9 accepts parallel BT.656 / DVI / CMOS-sensor data buses at 75 MHz pixel clock and drives HDMI/DVI outputs through LVDS-25 SelectIO pairs. The 576 Kbits of block RAM serves as frame-line buffer for deinterlacing, with 18 Kb blocks adequate for 1-2 horizontal lines at 1920-pixel widths. The 45 nm process and 1.2V core keep board power under 1W for cost-sensitive video-over-coax and industrial-camera applications, while SelectIO technology drives 3.3V legacy displays through on-chip VCCO banks.
Recommandé
Low-Cost PCIe Endpoint Cards
The XC6SLX9-2CPG196I includes a hard PCIe Gen1 endpoint block operating at 2.5 GT/s, eliminating soft-logic implementation of the PHY/MAC and saving 2,000-3,000 logic cells. With 9,152 cells and 106 I/Os the LX9 implements low-overhead endpoints for data-acquisition cards, serial protocol bridges, and industrial I/O concentrators that need only one PCIe lane. The integrated block supports both x1 and root-port configurations, paired with Spartan-6's GPIO for legacy peripheral connectivity. Industrial temperature and 45 nm power efficiency suit half-length PCIe cards and embedded computing modules where the LX9 acts as the local IO controller to a host CPU.
Recommandé
Legacy Industrial Protocol Bridging
The XC6SLX9-2CPG196I bridges legacy field-buses (Profibus, Modbus RTU, CANopen) to modern Ethernet/IP and OPC-UA by virtue of its 16 DSP slices handling packet processing and its 106 I/Os buffering multiple physical transceiver interfaces. Industrial gateways typically run 1-2 protocols simultaneously with 10-50 ms cycle times; the LX9's logic capacity comfortably fits deterministic Modbus/Profibus state machines with hardware-accelerated CRC. The 3.3V-tolerant SelectIO interfaces directly to RS-485 and CAN transceivers without glue logic, while block RAM backs message queues for 100-frame buffering. The industrial temperature grade supports cabinet-mounted gateway hardware, and the Spartan-6 family stability (multi-decade AMD support) suits long-lifecycle industrial equipment.
Recommandé
Embedded Vision Pre-Processing
The XC6SLX9-2CPG196I offloads MIPI-CSI / parallel CMOS sensor pre-processing at the edge of an embedded-vision pipeline. The 16 DSP48A1 slices deliver 1.0 GMAC multiply-accumulate throughput, sufficient for edge-detection, color-correction, and lens-shading compensation on VGA-to-720p frames at 30 fps. The 106 user I/Os accept 8-16 bit parallel sensor buses, while the integrated Memory Controller Hard IP drives external DDR3 for frame-buffer storage. Industrial temperature and 1.2V low-power operation suit drone and robotics payloads where every gram and milliwatt count, and the Spartan-6 family stability suits long-life-cycle smart-camera SKUs.
Recommandé
Portable Test & Measurement
The XC6SLX9-2CPG196I fits handheld oscilloscopes, logic analyzers, and protocol analyzers where battery life and small PCB area matter. Operating at 1.2V core with SelectIO at 2.5V/3.3V, the LX9 draws about 100 mW active plus leakage, well within USB-C-powered budgets. Its 9,152 cells implement 200 MSa/s acquisition state machines with up to 256-channel logic-analyzer sweep, while 576 Kbits of block RAM serve as 32-64 Ksample circular buffer before host transfer. Industrial temperature supports field deployment in factories and outdoor sites, while the 196-ball CSBGA at 8x8 mm fits 4-layer handheld mainboards with BGA escape routing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX9-2CPG196I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX9-2CPG196C | XC6SLX9-3CPG196I | XC6SLX9-1CPG196C | XC6SLX9-L1CPG196C | XA6SLX9-3CPG196I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 196-CSBGA (CPG196, 8x8 mm) | 196-CSBGA (CPG196) - same | 196-CSBGA (CPG196) - same | 196-CSBGA (CPG196) - same | 196-CSBGA (CPG196) - same | 196-CSBGA (CPG196) - same |
| Logic Cells | 9152 | 9152 | 9152 | 9152 | 9152 | 9152 |
| Speed Grade | -2 | -2 | -3 (faster) | -1 (slower) | -1 (low-power) | -3 (faster, defense) |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C |
| User I/O | 106 | 106 | 106 | 106 | 106 | 106 |
| Block RAM | 576 Kbits | 576 Kbits | 576 Kbits | 576 Kbits | 576 Kbits | 576 Kbits |
| DSP Slices | 16 | 16 | 16 | 16 | 16 | 16 |
| PCIe Hard IP | Gen1 Endpoint | Gen1 Endpoint | Gen1 Endpoint | Gen1 Endpoint | Gen1 Endpoint | Gen1 Endpoint |
Principaux différenciateurs
- Balanced mainstream speed grade with industrial temperature (vs XC6SLX9-2CPG196C)
- Lower cost than -3 speed grade when timing margin is sufficient (vs XC6SLX9-3CPG196I)
- Same die as low-power L1 variant but with full performance envelope (vs XC6SLX9-L1CPG196C)
Notes de conception
The XC6SLX9-2CPG196I 196-ball CSBGA at 1.2V core is a relatively cool device (< 1 W active typical). Per the Spartan-6 family datasheet thermal model, the junction-to-ambient thermal resistance (theta_JA) on a standard 4-layer JEDEC test PCB with 1 oz copper is approximately 25 C/W, and on a minimal 2-layer board the figure rises to 45-55 C/W. For enclosed industrial cabinets at ambient up to 85C, ensure at least 200 mm^2 of unbroken copper directly under the BGA connected through the central thermal balls to the bottom-side ground plane. Estimated: a sustained 0.8 W dissipation at 85C ambient yields about 105C junction in a typical 4-layer layout - acceptable but not at the margin.
The 196-ball CSBGA uses 0.5 mm pitch with 8x8 mm total body, which is within mainstream SMT capability but requires careful stack-up planning. Recommended: 4-layer FR4 with 0.5 oz copper outer and 1 oz inner, 0.1 mm BGA-pad NSMD with microvia-in-pad or via-in-pad with resin filling and planarisation. Keep the BGA escape routing on the top layer with 0.1 mm trace/space first two rows, fanning out through the third and fourth rows on inner layers. Always use AMD's package pinout ASCII file from https://www.amd.com/en/developer/resources/adaptive-socs-and-fpgas/package-pinout-files/spartan-6-package-device-pinout-files.html - third-party pinouts can mismatch reserved balls.
Do not power the LX9 core (VCCINT 1.2 V) before the I/O bank voltages (VCCO) exceed their minimum requirement, or latch-up can occur on the SelectIO. Spartan-6 power-up sequencing per the datasheet requires VCCINT to ramp no faster than 50 ms and before VCCO if used together, or you must hold the FPGA in reset until both rails are valid. Configuration mode pins M[2:0] must be pulled to known values (not floating) at power-up, or the device fails to enter the programmed mode reliably. The DONE pin must be pulled up externally and not left floating, otherwise configuration-completion detection is unreliable. Finally, JTAG chain integrity must be verified before relying on boundary-scan diagnostics.
Informations de conformité
RoHS and lead-free are confirmed via the AMD Spartan-6 product page and DigiKey product record. AEC-Q100 qualification is not applicable - Xilinx FPGAs are not automotive-qualified in this family. Halogen-free status was not explicitly stated in the verified data and is therefore logged as unknown. Conflict-minerals compliance is asserted by AMD corporate policy.
