10AS032H2F34I2LG vs 10AS032H2F34E2LG Comparaison
Comparaison détaillée côte à côte de 10AS032H2F34I2LG par Intel et 10AS032H2F34E2LG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | 10AS032H2F34I2LG | 10AS032H2F34E2LG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 390,00 | $1 380,00 |
| Product Type | SoC FPGA (FPGA + ARM Cortex-A9 MPCore HPS) | — |
| Family | Arria 10 SX | Arria 10 SX |
| Logic Elements | 320,000 | 320,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight | — |
| HPS Maximum Clock | 1.5 GHz | — |
| Process Technology | 20 nm | — |
| Core Voltage (Vcc) | 0.9 V | — |
| Boîtier | 1152-ball FC-FBGA, 35 x 35 mm | 1152-ball FC-FBGA (F34), 35 x 35 mm |
| Package Code | F34 (Flip-Chip BGA, 1.0 mm pitch) | — |
| Terminal Form | Ball | — |
| Terminal Count | 1152 | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | Compliant | Compliant |
| Design Tool | Intel Quartus Prime | — |
| Transceiver Data Rate | Up to 17.4 Gbps (per family) | — |
| Device Tier | — | 10AS032 (mid-density) |
| Configuration | — | SoC FPGA (HPS + FPGA fabric) |
| Processor Subsystem | — | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Operating Frequency | — | 1.5 GHz |
| Speed Grade | — | 2 |
| Temperature Grade | — | E2 (commercial/extended) |
| On-chip Memory (M20K blocks) | — | Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet] |
| DSP Blocks | — | Variable-precision, IEEE 754 single-precision FP support |
| Transceivers | — | Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package] |
| Memory Controller Hard IP | — | DDR4, DDR3, QDRII+, RLDRAM3 |
| Process Node | — | 20 nm |
| Form of Terminal | — | Ball (BGA) |
| Terminal Pitch | — | 1 mm |