10AS032H2F34I2LG vs 10AS032H2F34E2LG Comparison

Detailed side-by-side comparison of 10AS032H2F34I2LG by Intel and 10AS032H2F34E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter 10AS032H2F34I2LG 10AS032H2F34E2LG
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,390.00 $1,380.00
Product Type SoC FPGA (FPGA + ARM Cortex-A9 MPCore HPS) —
Family Arria 10 SX Arria 10 SX
Logic Elements 320,000 320,000
Hard Processor System Dual ARM Cortex-A9 MPCore with CoreSight —
HPS Maximum Clock 1.5 GHz —
Process Technology 20 nm —
Core Voltage (Vcc) 0.9 V —
Package 1152-ball FC-FBGA, 35 x 35 mm 1152-ball FC-FBGA (F34), 35 x 35 mm
Package Code F34 (Flip-Chip BGA, 1.0 mm pitch) —
Terminal Form Ball —
Terminal Count 1152 —
Operating Temperature Grade Industrial (-40C to +100C) —
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status Compliant Compliant
Design Tool Intel Quartus Prime —
Transceiver Data Rate Up to 17.4 Gbps (per family) —
Device Tier — 10AS032 (mid-density)
Configuration — SoC FPGA (HPS + FPGA fabric)
Processor Subsystem — Dual ARM Cortex-A9 MPCore with CoreSight
Maximum Operating Frequency — 1.5 GHz
Speed Grade — 2
Temperature Grade — E2 (commercial/extended)
On-chip Memory (M20K blocks) — Approx. 21 Mb [DATA_NEEDED: exact Mb from datasheet]
DSP Blocks — Variable-precision, IEEE 754 single-precision FP support
Transceivers — Up to 14.1 Gbps [DATA_NEEDED: exact count for F34 package]
Memory Controller Hard IP — DDR4, DDR3, QDRII+, RLDRAM3
Process Node — 20 nm
Form of Terminal — Ball (BGA)
Terminal Pitch — 1 mm

Datasheets & Resources

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