10AX115R3F40E2LG vs 10AX115R3F40E2SG Comparaison
Comparaison détaillée côte à côte de 10AX115R3F40E2LG par Intel et 10AX115R3F40E2SG par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Intel
10AX115R3F40E2LG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel / Altera
10AX115R3F40E2LG ✓ Actif
Comparaison des spécifications
| Paramètre | 10AX115R3F40E2LG | 10AX115R3F40E2SG |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 425,00 | $4 925,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Product Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements (LE) | 1,150,000 | 1,150,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | 427,200 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits (8,557 Kbit) |
| DSP Blocks | 1,518 (with integrated hard floating-point) | 1,518 (variable-precision, hard FP) |
| Maximum User I/O | 342 | 342 |
| Number of Pins / Balls | 1517 | — |
| Package Type | FC-FBGA (flip-chip fine-pitch BGA) | — |
| Process Node | 20 nm | — |
| Core Voltage | 0.9 V | — |
| Maximum Transceiver Data Rate | 28.05 Gbps | — |
| Number of Transceiver Channels | [DATA_NEEDED: transceiver channel count] | — |
| Hard Memory Controller | Yes (DDR4/DDR3/QDR IV) | — |
| Hard PCIe Controller | Yes (PCIe Gen3 x8 hard IP) | — |
| Température de fonctionnement | -40 C to +100 C (extended) | — |
| Temperature Grade | Extended (E) | E2 (0C to +100C) |
| Type de montage | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Statut RoHS | Compliant | Compliant |
| Programming Tool | Intel Quartus Prime Pro / Standard | — |
| M20K Memory Blocks | — | 2,738 |
| Transceiver Channels | — | 24 (up to 14.1 Gbps) |
| Hard Memory Controllers | — | DDR4/DDR3/QDR IV |
| Hard PCIe Gen3 IP Cores | — | 2 |
| Process Technology | — | TSMC 20 nm |
| Speed Grade | — | -2 |
| Boîtier | — | 1517-ball FCBGA (F40), 1.0 mm pitch |
| Configuration Memory | — | Embedded (no external flash required for typical use) |