10AX115R3F40E2LG vs 10AX115R3F40E2SG Vergleich

Detaillierter Direktvergleich von 10AX115R3F40E2LG von Intel und 10AX115R3F40E2SG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter 10AX115R3F40E2LG 10AX115R3F40E2SG
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.425,00 $4.925,00
Family Arria 10 GX Arria 10 GX
Product Type FPGA (Field Programmable Gate Array) —
Logic Elements (LE) 1,150,000 1,150,000
Adaptive Logic Modules (ALM) [DATA_NEEDED: ALM count] 427,200
Embedded Memory 68,857,856 bits 68,857,856 bits (8,557 Kbit)
DSP Blocks 1,518 (with integrated hard floating-point) 1,518 (variable-precision, hard FP)
Maximum User I/O 342 342
Number of Pins / Balls 1517 —
Package Type FC-FBGA (flip-chip fine-pitch BGA) —
Process Node 20 nm —
Core Voltage 0.9 V —
Maximum Transceiver Data Rate 28.05 Gbps —
Number of Transceiver Channels [DATA_NEEDED: transceiver channel count] —
Hard Memory Controller Yes (DDR4/DDR3/QDR IV) —
Hard PCIe Controller Yes (PCIe Gen3 x8 hard IP) —
Betriebstemperatur -40 C to +100 C (extended) —
Temperature Grade Extended (E) E2 (0C to +100C)
Montageart Surface Mount (BGA) Surface Mount (Flip-Chip BGA)
RoHS-Status Compliant Compliant
Programming Tool Intel Quartus Prime Pro / Standard —
M20K Memory Blocks — 2,738
Transceiver Channels — 24 (up to 14.1 Gbps)
Hard Memory Controllers — DDR4/DDR3/QDR IV
Hard PCIe Gen3 IP Cores — 2
Process Technology — TSMC 20 nm
Speed Grade — -2
Gehäuse — 1517-ball FCBGA (F40), 1.0 mm pitch
Configuration Memory — Embedded (no external flash required for typical use)

Datenblätter & Ressourcen

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