A3P600-FGG484I vs A3P600-FGG484 Comparaison
Comparaison détaillée côte à côte de A3P600-FGG484I par Microchip Technology et A3P600-FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3P600-FGG484I - 600K Gate Flash FPGA, 231MHz | Microchip
A3P600-FGG484I ✓ Actif
Comparaison des spécifications
| Paramètre | A3P600-FGG484I | A3P600-FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $55,30 | $44,75 |
| FPGA Family | ProASIC3 | — |
| System Gates | 600000 | 600K |
| Number of User I/O | 235 | — |
| Embedded SRAM | 13.5 kB | — |
| System Performance | 231 MHz | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Package Type | 484-FBGA | — |
| Type de montage | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial (I suffix) | — |
| Lead-Free Finish | Yes (LEAD FREE per Mouser listing) | — |
| Configuration | Flash-based, non-volatile, instant on | — |
| Programming Interface | JTAG | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance statement] | Lead Free |
| REACH Status | [DATA_NEEDED: REACH compliance statement] | — |
| AEC-Q100 | Not applicable (FPGA) | — |
| Tray Packaging | Yes (per datasheets.com listing) | — |
| Family | — | ProASIC3 |
| Maximum System Frequency | — | 231 MHz |
| User I/O Count | — | 235 |
| Boîtier | — | 484-Pin FBGA (FGG484) |
| Configuration Memory | — | Flash-based (non-volatile, single chip) |
| Terminal Form | — | Ball |
| Package Shape | — | Square BGA |
| Temperature Grade | — | Commercial |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |
| Operating Temperature Minimum | — | 0 C |
| Operating Temperature Maximum | — | [DATA_NEEDED: maximum operating temperature] |
| Number of Logic Elements (LEs) | — | [DATA_NEEDED: logic element count] |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM capacity] |