A3P600-FGG484I vs A3P600-FGG484 对比

详细并排对比 A3P600-FGG484I 出自 Microchip Technology 和 A3P600-FGG484 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3P600-FGG484I A3P600-FGG484I - 600K Gate Flash FPGA, 231MHz | Microchip

A3P600-FGG484I - 600K Gate Flash FPGA, 231MHz | Microchip

A3P600-FGG484I ✓ 量产中
Microchip Technology
A3P600-FGG484 A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 - 600K Gate ProASIC3 FPGA | Microchip

A3P600-FGG484 ✓ 量产中

规格对比

参数 A3P600-FGG484I A3P600-FGG484
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $55.30 $44.75
FPGA Family ProASIC3 —
System Gates 600000 600K
Number of User I/O 235 —
Embedded SRAM 13.5 kB —
System Performance 231 MHz —
Process Technology 130 nm 130 nm CMOS
Core Supply Voltage 1.5 V 1.5 V
Package Type 484-FBGA —
安装类型 Surface Mount Surface Mount
Operating Temperature Grade Industrial (I suffix) —
Lead-Free Finish Yes (LEAD FREE per Mouser listing) —
Configuration Flash-based, non-volatile, instant on —
Programming Interface JTAG —
RoHS 状态 [DATA_NEEDED: RoHS compliance statement] Lead Free
REACH Status [DATA_NEEDED: REACH compliance statement] —
AEC-Q100 Not applicable (FPGA) —
Tray Packaging Yes (per datasheets.com listing) —
Family — ProASIC3
Maximum System Frequency — 231 MHz
User I/O Count — 235
封装 — 484-Pin FBGA (FGG484)
Configuration Memory — Flash-based (non-volatile, single chip)
Terminal Form — Ball
Package Shape — Square BGA
Temperature Grade — Commercial
Moisture Sensitivity Level — [DATA_NEEDED: MSL level]
Operating Temperature Minimum — 0 C
Operating Temperature Maximum — [DATA_NEEDED: maximum operating temperature]
Number of Logic Elements (LEs) — [DATA_NEEDED: logic element count]
Embedded Memory — [DATA_NEEDED: embedded SRAM capacity]

数据手册与资源

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