A3PE3000-1FGG484I vs A3PE3000L-1FGG484 Comparaison
Comparaison détaillée côte à côte de A3PE3000-1FGG484I par Microchip Technology et A3PE3000L-1FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology
A3PE3000-1FGG484I ✓ ActifMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-1FGG484I | A3PE3000L-1FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 336,60 | $134,00 |
| Product Family | ProASIC3E | — |
| System Gates | 3,000,000 (3M) | 3,000,000 |
| Logic Elements | 35,000 | — |
| Embedded SRAM | 504 Kbits (516,096 bits) | Up to 504 kbits true dual-port |
| User I/O (FGG484) | 341 | — |
| Total Balls | 484 | — |
| Boîtier | 484-ball FBGA, 1.0 mm pitch (FGG484) | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Logic Family | CMOS | — |
| Tension d'alimentation | 1.5 V | — |
| System Performance | 231 MHz | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Température de fonctionnement | 0 to 70 C (per Digchip listing; confirm I-grade limits) | 0C to +70C |
| Type de montage | Surface Mount | — |
| Statut RoHS | Compliant (FGG green package) | [DATA_NEEDED: RoHS status] |
| Speed Grade | -1 | -1 |
| Max User I/O (Family) | 616 | — |
| Family | — | ProASIC3L |
| Logic Cells | — | 75,264 |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Style de montage | — | SMD/SMT |
| Packaging | — | Tray |
| Power-Up Mode | — | Live at power-up (Level 0 support) |