A3PE3000-1FGG484I vs A3PE3000L-1FGG484 Сравнение
Подробное сравнение бок о бок A3PE3000-1FGG484I от Microchip Technology и A3PE3000L-1FGG484 от Microchip Technology. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Microchip Technology
A3PE3000-1FGG484I - Flash FPGA, 3M Gates | Microchip Technology
A3PE3000-1FGG484I ✓ АктивенMicrochip Technology
A3PE3000L-1FGG484 - ProASIC3L FPGA 3M Gates 484-BGA | Microchip
A3PE3000L-1FGG484 ✓ АктивенСравнение характеристик
| Параметр | A3PE3000-1FGG484I | A3PE3000L-1FGG484 |
|---|---|---|
| Бренд | Microchip Technology | Microchip Technology |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1.336,60 | $134,00 |
| Product Family | ProASIC3E | — |
| System Gates | 3,000,000 (3M) | 3,000,000 |
| Logic Elements | 35,000 | — |
| Embedded SRAM | 504 Kbits (516,096 bits) | Up to 504 kbits true dual-port |
| User I/O (FGG484) | 341 | — |
| Total Balls | 484 | — |
| Корпус | 484-ball FBGA, 1.0 mm pitch (FGG484) | 484-ball FBGA (FG484), 23 x 23 mm, 1 mm pitch |
| Logic Family | CMOS | — |
| Напряжение питания | 1.5 V | — |
| System Performance | 231 MHz | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based CMOS | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Рабочая температура | 0 to 70 C (per Digchip listing; confirm I-grade limits) | 0C to +70C |
| Тип монтажа | Surface Mount | — |
| Статус RoHS | Compliant (FGG green package) | [DATA_NEEDED: RoHS status] |
| Speed Grade | -1 | -1 |
| Max User I/O (Family) | 616 | — |
| Family | — | ProASIC3L |
| Logic Cells | — | 75,264 |
| User I/Os (this package) | — | 341 |
| Maximum User I/Os (family) | — | 616 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Supply Voltage (I/O) | — | 1.5 V (bank-dependent [DATA_NEEDED: exact I/O bank voltage range]) |
| Configuration | — | Nonvolatile flash, Instant On, single chip |
| Low Power Feature | — | Flash*Freeze technology |
| Способ монтажа | — | SMD/SMT |
| Packaging | — | Tray |
| Power-Up Mode | — | Live at power-up (Level 0 support) |