A3PE3000-2FG324 vs A3PE3000-FG324 Comparaison
Comparaison détaillée côte à côte de A3PE3000-2FG324 par Microchip Technology et A3PE3000-FG324 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-2FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FG324 ✓ ActifMicrochip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-2FG324 | A3PE3000-FG324 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $59,00 | $112,30 |
| Family | ProASIC3E | ProASIC3E Flash Family |
| Number of Gates | 3000000 | — |
| Logic Elements | 35000 | — |
| Number of I/Os | 221 | — |
| System Frequency (Max) | 310 MHz | — |
| Process Technology | 130 nm flash | 130 nm CMOS |
| Supply Voltage - Core | 1.5 V (1.425 V to 1.575 V) | — |
| Boîtier / Format | 324-BGA (324-FBGA, 19x19 mm) | — |
| Style de montage | SMD/SMT | — |
| Température de fonctionnement | 0 C to +85 C (TJ) | [DATA_NEEDED: operating temperature range] |
| Packaging | Tray | Tray |
| Programmability Type | In-System Reprogrammable Flash | — |
| Manufacturer Lead Time | 8 weeks | — |
| Statut RoHS | Non-compliant | RoHS Non-Compliant (contains lead, per digichip listing) |
| Product Status | Active | — |
| Series | A3PE3000 (ProASIC3E) | — |
| System Gates | — | 3,000,000 |
| Logic Elements / CLBs | — | 75,264 |
| Maximum System Frequency | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| User I/Os | — | 221 |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| In-System Programming | — | Yes (JTAG, IEEE 1532-compliant) |
| Security | — | 128-bit AES decryption via JTAG; FlashLock |
| Boîtier | — | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Type de montage | — | Surface Mount |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM bits] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| I/O Standards Supported | — | [DATA_NEEDED: supported I/O standards] |
| Lead Free Status | — | Contains Lead (per digichip listing) |
| Device ESD/HBM Rating | — | [DATA_NEEDED: ESD rating] |