A3PE3000-2FG324 vs A3PE3000-FG324 Comparação
Comparação detalhada lado a lado de A3PE3000-2FG324 por Microchip Technology e A3PE3000-FG324 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000-2FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-2FG324 ✓ AtivoMicrochip Technology
A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FG324 ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000-2FG324 | A3PE3000-FG324 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $59,00 | $112,30 |
| Family | ProASIC3E | ProASIC3E Flash Family |
| Number of Gates | 3000000 | — |
| Logic Elements | 35000 | — |
| Number of I/Os | 221 | — |
| System Frequency (Max) | 310 MHz | — |
| Process Technology | 130 nm flash | 130 nm CMOS |
| Supply Voltage - Core | 1.5 V (1.425 V to 1.575 V) | — |
| Encapsulamento / Caixa | 324-BGA (324-FBGA, 19x19 mm) | — |
| Estilo de montagem | SMD/SMT | — |
| Temperatura de operação | 0 C to +85 C (TJ) | [DATA_NEEDED: operating temperature range] |
| Packaging | Tray | Tray |
| Programmability Type | In-System Reprogrammable Flash | — |
| Manufacturer Lead Time | 8 weeks | — |
| Status RoHS | Non-compliant | RoHS Non-Compliant (contains lead, per digichip listing) |
| Product Status | Active | — |
| Series | A3PE3000 (ProASIC3E) | — |
| System Gates | — | 3,000,000 |
| Logic Elements / CLBs | — | 75,264 |
| Maximum System Frequency | — | 231 MHz |
| Core Supply Voltage | — | 1.5 V |
| User I/Os | — | 221 |
| Configuration Technology | — | Flash (non-volatile, single-chip) |
| In-System Programming | — | Yes (JTAG, IEEE 1532-compliant) |
| Security | — | 128-bit AES decryption via JTAG; FlashLock |
| Encapsulamento | — | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Tipo de montagem | — | Surface Mount |
| Embedded Memory | — | [DATA_NEEDED: embedded SRAM bits] |
| PLLs | — | [DATA_NEEDED: number of PLLs] |
| I/O Standards Supported | — | [DATA_NEEDED: supported I/O standards] |
| Lead Free Status | — | Contains Lead (per digichip listing) |
| Device ESD/HBM Rating | — | [DATA_NEEDED: ESD rating] |