A3PE3000-FGG324I vs A3PE3000L-1FG324I Comparaison
Comparaison détaillée côte à côte de A3PE3000-FGG324I par Microchip Technology et A3PE3000L-1FG324I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000-FGG324I - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
A3PE3000-FGG324I ✓ ActifMicrochip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000-FGG324I | A3PE3000L-1FG324I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $198,00 | $135,00 |
| Family | ProASIC3E (ProASIC3E Flash Family) | ProASIC3L Low Power Flash FPGA |
| System Gates | 3000000 gates | 3000000 |
| Logic Elements (CLBs) | 75264 | — |
| Total User I/O | 221 | — |
| Embedded Memory | 516096 bits | — |
| Maximum Frequency | 350 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Technology | 130 nm CMOS, nonvolatile flash | — |
| Boîtier | 324-BGA (FBGA/PBGA324), 19 x 19 mm | 324-ball FBGA (FG324) |
| Ball Pitch | 1 mm | — |
| Package Height | 1.63 mm | — |
| Température de fonctionnement | -40 C to +125 C (Industrial, I grade) | -40C to +100C (industrial, I suffix) |
| Configuration Memory | Nonvolatile flash, reprogrammable, Instant-On | Non-volatile on-chip flash (single chip, secure) |
| Type de montage | Surface Mount | Surface Mount |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL Level] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Logic Elements | — | 35K LEs (75264 D-flip-flops equivalent family density) |
| User I/O | — | 221 |
| Total RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V to 1.5 V |
| I/O Voltage | — | 1.2 V to 1.5 V (family range) |
| Speed Grade | — | -1 |
| Process Technology | — | 130 nm CMOS flash |
| Low Power Feature | — | Flash*Freeze technology |
| Dynamic Power Reduction | — | Up to 40% vs ProASIC3 |
| Static Power Reduction | — | Up to 50% vs ProASIC3 |
| Max Family Performance | — | 892.86 MHz class (130 nm ProASIC3EL family) |