A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
Référence : A3PE3000L-1FG324I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $172.5 | $1 725,00 |
| 100 | $158 | $15 800,00 |
| 500 | $146 | $73 000,00 |
| 1 000 | $135 | $135 000,00 |
A3PE3000L-1FG324I Présentation
A field-programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and interconnects that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: logic cell / look-up table (LUT) -> fabric -> FPGA -> programmable SoC. Unlike SRAM-based FPGAs, flash-based FPGAs such as the ProASIC3L family store their configuration in non-volatile on-chip flash, delivering a true single-chip solution with instant-on operation and no external configuration PROM.
Key features include Flash*Freeze technology, which cuts static power dramatically by entering an ultra-low-power sleep mode while retaining state; core and I/O operation from 1.2V to 1.5V for dynamic power optimization; and 35K logic elements (LEs) equivalent density per the ProASIC3 low-power line. Compared with the standard ProASIC3 family, ProASIC3L devices reduce dynamic power by up to 40% and static power by up to 50%, according to the Microchip ProASIC3L datasheet (DS50003268).
The device is fabricated on a 130nm CMOS flash process and supports 892.86MHz-class internal performance for the family. Reprogrammability, abundant embedded memory, and single-chip operation lower total cost of ownership (TOC) versus antifuse or SRAM alternatives.
Typical applications include portable and battery-powered instrumentation, industrial automation control, medical monitoring equipment, communications line cards, and aerospace/defense systems requiring secure, non-volatile, low-power programmable logic.
Design considerations: the 'I' suffix denotes the industrial temperature range, and the '-1' suffix denotes the speed grade; both must match system requirements. Power budgeting should exploit Flash*Freeze entry/exit timing in the datasheet.
This page adds value beyond the datasheet by synthesizing distributor stock signals, drop-in speed-grade and packaging alternatives from the XAIPART catalog, and practical design notes in one AI-citable reference.
Alternatives de remplacement direct pour A3PE3000L-1FG324I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000L-1FG324I (même facteur de forme et même empreinte) — différant par Package, Family, Operating Temperature, System Gates, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000L-1FGG324I
✅ Remplacement direct✓ En stock
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Voir la fiche technique →A3PE3000L-FGG324I
✅ Remplacement direct✓ En stock
$62.65 / unité
Voir la fiche technique →A3PE3000L-FG324I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-FGG324
✅ Remplacement direct✓ En stock
$86.15 / unité
Voir la fiche technique →A3PE3000L-1FG324
✅ Remplacement direct✓ En stock
$135.9 / unité
Voir la fiche technique →A3PE3000-2FG324
✅ Remplacement direct✓ En stock
$59 / unité
Voir la fiche technique →A3PE3000-FGG324I
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →A3PE3000L-1FG324I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3L Low Power Flash FPGA |
| System Gates | 3000000 |
| Logic Elements | 35K LEs (75264 D-flip-flops equivalent family density) |
| User I/O | 221 |
| Total RAM Bits | 516096 |
| Core Voltage | 1.2 V to 1.5 V |
| I/O Voltage | 1.2 V to 1.5 V (family range) |
| Speed Grade | -1 |
| Process Technology | 130 nm CMOS flash |
| Configuration Memory | Non-volatile on-chip flash (single chip, secure) |
| Low Power Feature | Flash*Freeze technology |
| Température de fonctionnement | -40C to +100C (industrial, I suffix) |
| Boîtier | 324-ball FBGA (FG324) |
| Type de montage | Surface Mount |
| Dynamic Power Reduction | Up to 40% vs ProASIC3 |
| Static Power Reduction | Up to 50% vs ProASIC3 |
| Max Family Performance | 892.86 MHz class (130 nm ProASIC3EL family) |
Guide de configuration des broches du A3PE3000L-1FG324I 324-ball fbga (fg324)
Configuration des broches du A3PE3000L-1FG324I (boîtier 324-ball fbga (fg324)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000L-1FG324I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000L-1FG324I convient pour 6 applications: Portable Battery-Powered Instrumentation, Industrial Automation Control, Medical Monitoring Equipment, Communications Line Cards, Aerospace and Defense Systems, Smart IoT Edge and Sensor Aggregation.
Portable Battery-Powered Instrumentation
The A3PE3000L-1FG324I fits portable instrumentation because its 1.2V core operation and Flash*Freeze mode directly attack the two dominant battery drains: dynamic switching power and static leakage. According to the ProASIC3L datasheet, the L silicon cuts dynamic power by up to 40% and static power by up to 50% versus standard ProASIC3, and Flash*Freeze retains register and RAM state in an ultra-low-power sleep state so the instrument resumes instantly without reconfiguration. In a handheld data logger, the FPGA runs acquisition logic at 1.2V, then enters Flash*Freeze between measurement windows, stretching battery life substantially. The 324-ball FBGA at roughly 1.0mm pitch suits compact handheld PCBs, while the 221 user I/Os interface ADCs, displays, and sensors without external glue logic.
Recommandé
Industrial Automation Control
Factory automation controllers benefit from the A3PE3000L-1FG324I's industrial -40C to +100C rating, non-volatile flash configuration, and deterministic instant-on behavior. Unlike SRAM FPGAs that need a boot device and milliseconds of configuration time, the ProASIC3L fabric is active as soon as power is applied - critical for machine safety interlocks and I/O modules that must be operational at power-up. With 3 million gates and 516096 RAM bits, the device integrates motor sequencing logic, encoder decoding, and fieldbus interfaces such as CAN or RS-485 in glueless form. The 221 user I/Os support 1.2V to 1.5V banks matching modern sensor levels, and flash-based configuration resists corruption in electrically noisy cabinets, lowering field-service costs in PLC and remote I/O designs.
Recommandé
Medical Monitoring Equipment
Patient monitors and portable diagnostic devices demand low noise, low heat, and high reliability - all strengths of the A3PE3000L-1FG324I. Its 1.2V to 1.5V core operation minimizes junction power dissipation, keeping the 324-ball FBGA cool inside enclosed bedside housings with passive cooling only. Flash*Freeze mode lets the monitor drop front-end acquisition logic into a state-retaining sleep between sampling events, extending uptime during ambulatory monitoring sessions. The non-volatile single-chip architecture removes external configuration memory, reducing BOM count and eliminating a failure point in devices subject to regulatory scrutiny. With 35K logic-element-class density, the FPGA handles ECG/SpO2 digital filtering, display refresh, and communication interfaces simultaneously, while the industrial temperature rating provides margin against hospital equipment bays that exceed commercial limits.
Recommandé
Communications Line Cards
Access-network and transport line cards use the A3PE3000L-1FG324I for framing, scrambling, and backplane glue logic where low static power matters across hundreds of deployed cards. The ProASIC3L's up to 50% static power reduction versus standard ProASIC3 compounds into significant opex savings in equipment drawing power continuously. The -1 speed grade supports the family's internal performance class for 892.86MHz-rated fabric paths in the 130nm ProASIC3EL generation, sufficient for parallel framing at line rates handled by companion PHYs. The 221 I/Os, bankable at 1.2V to 1.5V, bridgeprocessors, PHYs, and connectors. Non-volatile configuration enables cards to enumerate immediately on hot-swap insertion, and the industrial rating accommodates outside-plant cabinets and uncooled central-office shelves alike, with 516096 RAM bits available for elasticity buffers.
Recommandé
Aerospace and Defense Systems
Defense electronics values the A3PE3000L-1FG324I for its flash-based, single-chip, secure configuration architecture - there is no external bitstream to intercept on an SRAM configuration bus, a recognized supply-chain and security advantage of the Actel/Microsemi/Microchip ProASIC3 lineage. The industrial -40C to +100C rating covers ruggedized ground and avionic-shelf environments, and the low static power suits conduction-cooled enclosures with limited thermal budget. Three million gates integrate telemetry encoding, bus bridging (MIL-STD-1553 companions, CAN, UART meshes), and sensor aggregation in one 324-ball device, while 516096 bits of block RAM buffer mission data. Flash*Freeze allows duty-cycled sensors to idle at minimal power between events. Microchip supports RTL integration in Libero SoC, and the family is a proven migration point from discontinued antifuse designs.
Recommandé
Smart IoT Edge and Sensor Aggregation
IoT edge nodes aggregating many sensors onto one uplink exploit the A3PE3000L-1FG324I's combination of instant-on fabric, Flash*Freeze duty cycling, and 221 GPIOs. The flash-based FPGA boots in microseconds, captures sensor events immediately at power application, then either processes locally - 35K logic elements handle filtering, thresholding, and protocol conversion - or streams to a host microcontroller. Because configuration is non-volatile, no microcontroller boot-time gating is needed, simplifying power-sequencing design in energy-harvesting nodes. At a 1.2V core the device sips power while idle banks clock-gate, and Flash*Freeze suspends the whole fabric at minimal static draw between wake events. The 324-ball FBGA footprint gives enough I/O to fan-in dozens of I2C, SPI, and discrete sensor lines into a single aggregation point for gateways and industrial retrofit kits.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000L-1FG324I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000L-1FGG324I | A3PE3000L-FG324I | A3PE3000L-1FG324 | A3PE3000-2FG324 | A3PE3000-FGG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball FBGA (FG324) | 324-ball FBGA (FGG324) - same footprint | 324-ball FBGA (FG324) - same | 324-ball FBGA (FG324) - same | 324-ball FBGA (FG324) - same | 324-ball FBGA (FGG324) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3L (low power, Flash*Freeze) | ProASIC3L | ProASIC3L | ProASIC3L | ProASIC3E (standard power) | ProASIC3E (standard power) |
| System Gates | 3M | 3M | 3M | 3M | 3M | 3M |
| User I/O | 221 | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | -1 | -1 | standard (slower than -1) | -1 | -2 (faster) | standard |
| Operating Temperature | -40C to +100C (I) | -40C to +100C (I) | -40C to +100C (I) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (I) |
| Flash*Freeze Low Power | Yes (up to 40%/50% dynamic/static reduction) | Yes | Yes | Yes | No | No |
Principaux différenciateurs
- Flash*Freeze ultra-low-power mode (vs A3PE3000-2FG324)
- Industrial temperature with fastest -1 grade (vs A3PE3000L-FG324I)
- Lead-free fine-pitch ball option available (vs A3PE3000L-1FGG324I)
- Non-volatile single-chip secure configuration (vs A3PE3000-FGG324I)
Notes de conception
Budget power using Microchip's ProASIC3L power calculator in Libero SoC rather than static datasheet numbers, since dynamic power scales with toggle rates. Exploit Flash*Freeze aggressively: the FLASH_FREEZE pin latches I/O state and gates the fabric, and the datasheet DS50003268 defines entry/exit timing that must be respected by the host controller. Core and I/O rails both accept 1.2V to 1.5V - running banks at the lowest voltage your interfaces tolerate yields the largest dynamic savings in battery designs.
The FG324 FBGA uses approximately 1.0mm ball pitch; plan fanout early, favoring via-in-pad or dog-bone escape on outer two ball rows. Provide solid power/ground ball rings per the Microchip packaging and pinout document and decouple each VCC/VCCA domain with an array of 0.1uF ceramics plus bulk capacitance near the bank supplies. Because this is a non-volatile device, no configuration PROM routing is needed, freeing board area - but still reserve programming-access routing for JTAG boundary scan and Libero-based device programming.
Do not substitute commercial-temperature parts (A3PE3000L-1FG324) into industrial designs - the 'I' suffix exists for the -40C to +100C range and qualification documents will fail audit. Do not assume non-L ProASIC3E parts (A3PE3000-2FG324) are power-equivalent despite the identical footprint; they lack Flash*Freeze and consume up to 50% more static power. Finally, timing closure at the standard speed grade may not meet -1 constraints - rerun static timing in Libero after any speed-grade substitution.
Informations de conformité
Compliance status for the exact I-suffixed MPN was not stated in the provided verified data; consult the Microchip product page A3PE3000L for current RoHS/REACH declarations. Note the FGG variants are Microchip's lead-free fine-pitch package line.
