A3PE3000L-1FG484M vs A3PE3000L-FG484I Comparaison
Comparaison détaillée côte à côte de A3PE3000L-1FG484M par Microchip Technology et A3PE3000L-FG484I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip
A3PE3000L-1FG484M ✓ ActifMicrochip Technology
A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
A3PE3000L-FG484I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-1FG484M | A3PE3000L-FG484I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $0,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (ProASIC3 Low Power) |
| System Gates | 3000000 | 3000000 (3.00E6) |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Number of I/O | 341 | — |
| Maximum Frequency | 250 MHz | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Technology | 130 nm flash process | — |
| Configuration Memory | On-chip Flash (instant-on, reprogrammable) | — |
| Low Power Feature | Flash*Freeze technology | — |
| Boîtier | 484-ball FBGA (FG484) | 484-ball FBGA (23x23 mm, 1 mm pitch) |
| Type de montage | Surface Mount | Surface Mount |
| Speed Grade | -1 (standard) | — |
| Temperature Grade / Operating Temp | M (per ordering code); [DATA_NEEDED: exact operating temperature range] | — |
| JTAG Boundary Scan | IEEE 1149.1 supported | — |
| Input Options | Schmitt trigger option on single-ended inputs (A3PE3000L) | — |
| Pull Options | Weak pull-up / pull-down | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | ROHS3 Compliant |
| Logic Cells (DFFs) | — | 75264 |
| User I/O (this package) | — | 341 |
| Max User I/O (family) | — | 616 |
| Embedded SRAM | — | 504 kbit true dual-port |
| Process Technology | — | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | — | 1.14 V to 1.575 V (1.2 V typical) |
| Configuration | — | Nonvolatile flash, Live-at-Power-Up Level 0 |
| Single-Chip Solution | — | Yes (no external configuration PROM) |
| Température de fonctionnement | — | -40C to +100C (TJ, industrial) |
| Speed | — | [DATA_NEEDED: speed grade / max frequency] |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 8 weeks |
| Logic Family | — | CMOS |