A3PE3000L-FG484I - 3M-Gate Flash FPGA, 341 I/O | Microchip
Référence : A3PE3000L-FG484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
A3PE3000L-FG484I Présentation
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration PROM. Within the programmable logic hierarchy, it sits at the device level of the power management and digital logic system, alongside SRAM-based and antifuse FPGAs. Flash-based devices such as the ProASIC3L family power up instantly (Live-at-Power-Up Level 0 support) and provide a true single-chip solution without a boot sequence.
Key features include the 130-nm, 7-layer-metal (6 copper) flash-based CMOS process, 1.2 V core operation for low static and dynamic power, and nonvolatile security via flash lock, which protects intellectual property without battery backfill or bitstream streaming. The L variant of the family adds low-power features versus the standard ProASIC3E A3PE3000.
Technically, the device provides 504 kbits of true dual-port SRAM distributed in variable-aspect-ratio blocks, supporting FIFOs, buffers and embedded datapaths. VersaTiles form the fine-grained fabric, while I/O banks support multiple single-ended and differential standards with configurable drive and slew.
Typical applications include industrial automation control, secure communications and military/aerospace systems requiring instant-on operation, single-chip integration and low static power.
Design consideration: budget the 1.2 V core rail and 2.5 V/3.3 V I/O rails separately and follow Microchip's power-decoupling guidance; flash FPGAs tolerate hot-socketing but sequencing rules still apply.
This page synthesizes distributor pricing, drop-in alternatives within the ProASIC3 family, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE3000L-FG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000L-FG484I (même facteur de forme et même empreinte) — différant par Family, Package, Process Technology, System Gates, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000L-1FGG484I
✅ Remplacement direct✓ En stock
$104.5 / unité
Voir la fiche technique →A3PE3000L-FGG484I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-FG484
✅ Remplacement direct✓ En stock
$112 / unité
Voir la fiche technique →A3PE3000L-1FG484I
✅ Remplacement direct✓ En stock
$89.9 / unité
Voir la fiche technique →A3PE3000-FGG484
✅ Remplacement direct✓ En stock
$152.6 / unité
Voir la fiche technique →A3PE3000-FG484
✅ Remplacement direct✓ En stock
$139.75 / unité
Voir la fiche technique →A3PE3000L-FG484I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3L (ProASIC3 Low Power) |
| System Gates | 3000000 (3.00E6) |
| Logic Cells (DFFs) | 75264 |
| User I/O (this package) | 341 |
| Max User I/O (family) | 616 |
| Embedded SRAM | 504 kbit true dual-port |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V typical) |
| Configuration | Nonvolatile flash, Live-at-Power-Up Level 0 |
| Single-Chip Solution | Yes (no external configuration PROM) |
| Température de fonctionnement | -40C to +100C (TJ, industrial) |
| Boîtier | 484-ball FBGA (23x23 mm, 1 mm pitch) |
| Type de montage | Surface Mount |
| Statut RoHS | ROHS3 Compliant |
| Packaging | Tray |
| Manufacturer Lead Time | 8 weeks |
| Logic Family | CMOS |
Guide de configuration des broches du A3PE3000L-FG484I 484-ball fbga (23x23 mm, 1 mm pitch)
Configuration des broches du A3PE3000L-FG484I (boîtier 484-ball fbga (23x23 mm, 1 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000L-FG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000L-FG484I convient pour 6 applications: Industrial Automation Control, Secure Communications Equipment, Aerospace and Defense Systems, Test and Measurement Instrumentation, Medical Device Control Logic, Battery-Powered Embedded Systems.
Industrial Automation Control
The A3PE3000L-FG484I fits industrial automation controllers where deterministic, instant-on logic must run the moment power is applied, with no configuration load time. Its 3 million gates and 75264 DFFs absorb motor sequencing, safety interlock and protocol-bridge logic, while 504 kbit of true dual-port SRAM buffers fieldbus frames. The industrial -40C to +100C (TJ) rating survives cabinet temperature swings, and the 1.2 V core keeps convection-cooled enclosures within thermal budget. Unlike SRAM FPGAs, the flash configuration needs no external PROM, improving reliability in single-chip PLC and I/O-module designs.
Recommandé
Secure Communications Equipment
Flash-based FPGAs are the default choice for secure radios and encrypted links because the bitstream never leaves the chip: the A3PE3000L-FG484I stores configuration in on-chip flash with flash-lock security, eliminating the configuration-stream snooping risk of SRAM FPGAs. The 3M-gate fabric implements AES/DES cores and bus encryption, while 341 user I/O supports multiple parallel and serial interface banks in the 484-ball FBGA. Live-at-Power-Up Level 0 operation means links re-establish instantly after power interruptions, and the -40C to +100C industrial grade covers outdoor and vehicular communication cabinets.
Recommandé
Aerospace and Defense Systems
The A3PE3000L-FG484I suits avionics and defense subsystems that need single-event-mitigated, low-power programmable logic with guaranteed instant-on behavior. Flash cells are inherently more SEU-tolerant for configuration storage than SRAM, reducing scrubbing overhead. With a 1.14 V to 1.575 V core range and low static power, the part fits power-constrained platforms, while the industrial -40C to +100C rating supports unheated compartments. The 484-ball FBGA with 1 mm pitch provides 341 I/O for sensor buses, ARINC-style parallel interfaces and redundant control channels within a 23x23 mm footprint.
Recommandé
Test and Measurement Instrumentation
Bench and modular instruments use the A3PE3000L-FG484I as trigger engines, timing generators and bus bridges, where 75264 flip-flops provide deep counter and state-machine resources and 504 kbit dual-port SRAM implements capture FIFOs. The flash fabric powers up with the instrument, removing boot delay at power-on self-test. Multiple I/O standards on the 341 user pins let one device interface to both legacy 5 V-tolerant style front ends and modern low-voltage digital buses. Low 1.2 V core operation keeps the internal supply rail simple alongside 3.3 V I/O rails in a mixed-signal instrument chassis.
Recommandé
Medical Device Control Logic
Portable and benchtop medical devices benefit from the A3PE3000L-FG484I's low static power and instant-on flash configuration: patient-interface logic, sensor timing and safety monitors are active immediately when the device is switched on. The single-chip solution removes the external configuration PROM, a failure point and board area cost in compact medical hardware. 3 million gates consolidate glue logic, motor control sequencing and display interface functions, and the -40C to +100C TJ range covers autoclave-adjacent and cold-storage environments. Nonvolatile flash lock also supports design IP protection required by device manufacturers.
Recommandé
Battery-Powered Embedded Systems
The ProASIC3L family exists specifically for low-power battery and energy-harvesting designs: the A3PE3000L-FG484I runs a 1.2 V core (1.14 V to 1.575 V range) with reduced static and dynamic power versus the 1.5 V ProASIC3E, extending battery life in duty-cycled systems. Because configuration is nonvolatile, the FPGA can enter deep sleep and resume instantly without reconfiguration energy - a key advantage over SRAM FPGAs that must reload their bitstream at every wake-up. The 341 available I/O in the 484-ball FBGA consolidates sensor, display and radio interfaces into one always-ready programmable device.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000L-FG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000L-1FGG484I | A3PE3000L-FGG484I | A3PE3000-FGG484 | A3PE3000-FG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (23x23 mm, 1 mm pitch) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Brand | Microchip Technology (formerly Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Core Voltage | 1.2 V (1.14 V - 1.575 V) | 1.2 V (1.14 V - 1.575 V) | 1.2 V (1.14 V - 1.575 V) | 1.5 V | 1.5 V |
| Speed Rating | Standard grade | -1 (relaxed) | Standard grade | 231 MHz class (ProASIC3E) | 231 MHz class (ProASIC3E) |
| Configuration / Security | On-chip flash, Live-at-Power-Up Level 0, flash lock | Same flash-based, single-chip | Same flash-based, single-chip | Same flash-based, single-chip | Same flash-based, single-chip |
Principaux différenciateurs
- Lower core power than the ProASIC3E equivalent (vs A3PE3000-FG484)
- Cost-optimized speed grade option (vs A3PE3000L-FGG484I)
- Industrial temperature qualification (vs A3PE3000L-FG484)
Notes de conception
Estimated: power-budget the three rails separately - VMON/core at 1.2 V (permitted 1.14 V to 1.575 V), VDDI/auxiliary, and VDDI/O banks at 2.5 V or 3.3 V. At 3M gates, dynamic power scales with toggle rate, so run Microchip Libero SmartPower on the compiled netlist before fixing the core regulator rating; static power at 1.2 V is far lower than the 1.5 V A3PE3000E equivalent. Use SmartPower-reported worst-case current, not gate-count estimates, when sizing the 1.2 V DC-DC converter.
The 484-ball FBGA is a 1 mm pitch, 23x23 mm BGA: design an expandable fanout (via-in-pad or dog-bone) on at least 6 layers, and dedicate the central ball region to power/ground per Microchip's package pinout tables. Place 100 nF ceramic decoupling on every VDD/VDDI ball group plus bulk capacitance at the board entry. Because this is a flash FPGA, no configuration PROM routing is needed - but route JTAG and flash-lock programming access for in-system updates.
Do not mix the commercial (no I suffix) and industrial (I suffix) grades across a BOM without re-qualifying: A3PE3000L-FG484 (commercial) drops in on the same footprint but is not rated -40C to +100C. Also remember that although the family supports up to 616 user I/O, this 484-ball package exposes only 341 - over-allocating I/O in HDL will fail place-and-route. Re-run timing closure in Libero after any speed-grade migration (e.g., to -1 parts).
Informations de conformité
ROHS3 Compliant per Microchip USA product listing for the A3PE3000L-FGG484I family. REACH, halogen-free and conflict-minerals statuses not stated in the provided data.
