A3PE3000L-1FGG896 vs A3PE3000L-FGG896I Comparaison
Comparaison détaillée côte à côte de A3PE3000L-1FGG896 par Microchip Technology et A3PE3000L-FGG896I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ ActifMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-1FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $255,00 | $139,90 |
| Family | ProASIC3L | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Logic Cells | 75264 | — |
| User I/O | 620 | — |
| Total Bits of RAM | [DATA_NEEDED: Total embedded RAM bits] | — |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) | — |
| I/O Voltage | As low as 1.2 V | — |
| Speed Grade | -1 | Standard (no speed suffix) |
| Process Technology | 130 nm flash | — |
| Configuration Memory | Nonvolatile flash (single-chip) | — |
| Special Features | Flash*Freeze technology | Flash*Freeze technology, single-chip solution |
| Boîtier | 896-ball FBGA (FGG896), 1.00 mm pitch | — |
| Type de montage | Surface Mount | Surface Mount (SMD/SMT) |
| Packaging | Tray | Tray, standard quantity 27 |
| Terminal Pitch | 1.00 mm | — |
| Technology Base | CMOS flash | — |
| Dynamic Power Reduction vs ProASIC3 | Approx. 40% | — |
| Static Power Reduction vs ProASIC3 | Approx. 50% | — |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Tension d'alimentation | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Boîtier / Format | — | 896-BGA (FBGA, 1 mm pitch) |
| Température de fonctionnement | — | Industrial grade (I suffix) |
| Statut RoHS | — | [DATA_NEEDED: RoHS status] |