A3PE3000L-1FGG896 vs A3PE3000L-FGG896I Comparación
Comparación detallada lado a lado de A3PE3000L-1FGG896 por Microchip Technology y A3PE3000L-FGG896I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ ActivoMicrochip Technology
A3PE3000L-FGG896I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-FGG896I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-1FGG896 | A3PE3000L-FGG896I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $255,00 | $139,90 |
| Family | ProASIC3L | ProASIC3L |
| System Gates | 3000000 | 3000000 |
| Logic Cells | 75264 | — |
| User I/O | 620 | — |
| Total Bits of RAM | [DATA_NEEDED: Total embedded RAM bits] | — |
| Core Voltage | 1.2 V (supports 1.2 V to 1.5 V) | — |
| I/O Voltage | As low as 1.2 V | — |
| Speed Grade | -1 | Standard (no speed suffix) |
| Process Technology | 130 nm flash | — |
| Configuration Memory | Nonvolatile flash (single-chip) | — |
| Special Features | Flash*Freeze technology | Flash*Freeze technology, single-chip solution |
| Encapsulado | 896-ball FBGA (FGG896), 1.00 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount (SMD/SMT) |
| Packaging | Tray | Tray, standard quantity 27 |
| Terminal Pitch | 1.00 mm | — |
| Technology Base | CMOS flash | — |
| Dynamic Power Reduction vs ProASIC3 | Approx. 40% | — |
| Static Power Reduction vs ProASIC3 | Approx. 50% | — |
| Total RAM Bits | — | 516096 bits |
| Embedded Memory Type | — | True Dual-Port SRAM (504 kbits) |
| Number of I/O | — | 620 |
| Tensión de alimentación | — | 1.14 V to 1.575 V |
| Core Voltage Support | — | 1.2 V to 1.5 V |
| Logic Family / Process | — | CMOS, 130-nm, 7-layer metal (6 copper), flash-based |
| Configuration Technology | — | Nonvolatile Flash, Live-at-Power-Up Level 0 |
| Encapsulado / Carcasa | — | 896-BGA (FBGA, 1 mm pitch) |
| Temperatura de funcionamiento | — | Industrial grade (I suffix) |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |