A3PE3000L-FG484 vs A3PE3000L-FGG484 Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FG484 par Microchip Technology et A3PE3000L-FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ ActifMicrochip Technology
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
A3PE3000L-FGG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FG484 | A3PE3000L-FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $112,00 | $0,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells / CLBs | 75264 | — |
| User I/Os | 341 | — |
| Maximum System Frequency | 250 MHz | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Technology | 130 nm CMOS flash, nonvolatile | — |
| Configuration | Flash-based, Instant On, single-chip | — |
| Low Power Feature | Flash*Freeze technology | Flash*Freeze technology |
| Package Type | 484-ball FBGA (PBGA484) | — |
| Package Dimensions | 23 x 23 mm, 1 mm ball pitch | — |
| Package Height | 2.23 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Process | CMOS | — |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Supply Voltage I/O | [DATA_NEEDED: I/O supply voltage range] | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM block capacity] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | Compliant (per Newark: RoHS Compliant: Yes) |
| Logic Cells | — | 75,264 |
| User I/O | — | 341 |
| Embedded RAM | — | 516,096 bits |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130 nm flash |
| Configuration Technology | — | Nonvolatile flash, Instant On |
| Boîtier | — | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Packaging | — | Tray |
| Security | — | Single-chip, flash-based, secure nonvolatile configuration |