A3PE3000L-FG484 vs A3PE3000L-FGG484 Comparação
Comparação detalhada lado a lado de A3PE3000L-FG484 por Microchip Technology e A3PE3000L-FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000L-FG484 - ProASIC3L 3M-Gate Low Power FPGA | Microchip
A3PE3000L-FG484 ✓ AtivoMicrochip Technology
A3PE3000L-FGG484 - ProASIC3L Low Power FPGA 3M Gates | Microchip
A3PE3000L-FGG484 ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000L-FG484 | A3PE3000L-FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $112,00 | $0,00 |
| Family | ProASIC3L (Low Power Flash FPGA) | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Cells / CLBs | 75264 | — |
| User I/Os | 341 | — |
| Maximum System Frequency | 250 MHz | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Technology | 130 nm CMOS flash, nonvolatile | — |
| Configuration | Flash-based, Instant On, single-chip | — |
| Low Power Feature | Flash*Freeze technology | Flash*Freeze technology |
| Package Type | 484-ball FBGA (PBGA484) | — |
| Package Dimensions | 23 x 23 mm, 1 mm ball pitch | — |
| Package Height | 2.23 mm | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Process | CMOS | — |
| Temperatura de operação | [DATA_NEEDED: Operating Temperature] | [DATA_NEEDED: operating temperature range] |
| Supply Voltage I/O | [DATA_NEEDED: I/O supply voltage range] | — |
| Embedded Memory | [DATA_NEEDED: Embedded RAM block capacity] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance] | Compliant (per Newark: RoHS Compliant: Yes) |
| Logic Cells | — | 75,264 |
| User I/O | — | 341 |
| Embedded RAM | — | 516,096 bits |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130 nm flash |
| Configuration Technology | — | Nonvolatile flash, Instant On |
| Encapsulamento | — | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm, 1.0 mm pitch |
| Supply Voltage - I/O | — | [DATA_NEEDED: I/O bank voltage range] |
| Packaging | — | Tray |
| Security | — | Single-chip, flash-based, secure nonvolatile configuration |