A3PE3000L-FG896 vs A3PE3000L-1FGG896 Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FG896 par Microchip Technology et A3PE3000L-1FGG896 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip
A3PE3000L-FG896 ✓ ActifMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FG896 | A3PE3000L-1FGG896 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $255,00 |
| Family | ProASIC3L | ProASIC3L |
| System Gates | 3,000,000 | 3000000 |
| User I/O | 620 | 620 |
| Logic Cells | 75,264 | 75264 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V (supports 1.2 V to 1.5 V) |
| Technology | 130 nm nonvolatile flash | — |
| Configuration Memory | Nonvolatile flash (single-chip, Instant On) | Nonvolatile flash (single-chip) |
| Boîtier | 896-ball FBGA | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Type de montage | Surface Mount | Surface Mount |
| Low Power Feature | Flash*Freeze technology | — |
| Max Operating Frequency | [DATA_NEEDED: max operating frequency] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory size] | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Operating Temperature Suffix | Commercial (unmarked suffix; -I grade is industrial) | — |
| Statut RoHS | unknown | — |
| Niveau MSL | [DATA_NEEDED: MSL level] | — |
| Programmability | In-system reprogrammable | — |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| I/O Voltage | — | As low as 1.2 V |
| Speed Grade | — | -1 |
| Process Technology | — | 130 nm flash |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |