A3PE3000L-FG896 - ProASIC3L Low Power FPGA 620 I/O | Microchip
Référence : A3PE3000L-FG896 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
A3PE3000L-FG896 Présentation
A field-programmable gate array (FPGA) is a semiconductor device that can be configured by the designer after manufacturing, sitting within the broader hierarchy of programmable logic devices that ranges from SPLDs and CPLDs up to high-density FPGAs. Unlike SRAM-based FPGAs, the ProASIC3L family uses nonvolatile flash technology, meaning the configuration is stored on-chip and no external boot flash is required, making it a secure, single-chip, Instant On solution.
Key features of the A3PE3000L-FG896 include its low total cost of ownership, single-chip operation, reprogrammability, and the ProASIC3L family's Flash*Freeze technology, which dramatically reduces static and dynamic power consumption without losing SRAM state or I/O activity. The 1.2 V to 1.5 V core voltage range supports low-power system design.
Technically, the device is fabricated on a 130 nm flash process and built around ProASIC3L VersaTile logic architecture, where each tile can act as a lookup table, flip-flop, or embedded memory. The 896-BGA package provides a large 620 I/O budget for wide bus interfaces, memory controllers, and glue logic consolidation in board designs that previously needed multiple ASICs or ASSPs.
Typical applications include industrial control, portable and battery-powered instrumentation, secure single-chip logic, and power-sensitive embedded systems where FPGA reprogrammability and instant-on startup are essential.
A key design consideration is power: while Flash*Freeze mode can substantially cut dynamic and static power, designers should budget I/O bank loading and configure unused I/Os appropriately to maximize savings.
This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, with pricing and stock data verified as of 2026-09-02.
Alternatives de remplacement direct pour A3PE3000L-FG896 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000L-FG896 (même facteur de forme et même empreinte) — différant par Family, Package, Configuration Memory, System Gates, Core Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000L-FG896I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-FG896M
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000L-1FGG896
✅ Remplacement direct✓ En stock
$255 / unité
Voir la fiche technique →A3PE3000L-1FG896
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE3000L-FG896 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3L |
| System Gates | 3,000,000 |
| User I/O | 620 |
| Logic Cells | 75,264 |
| Core Voltage | 1.2 V to 1.5 V |
| Technology | 130 nm nonvolatile flash |
| Configuration Memory | Nonvolatile flash (single-chip, Instant On) |
| Boîtier | 896-ball FBGA |
| Type de montage | Surface Mount |
| Low Power Feature | Flash*Freeze technology |
| Operating Temperature Suffix | Commercial (unmarked suffix; -I grade is industrial) |
| Statut RoHS | unknown |
| Programmability | In-system reprogrammable |
Guide de configuration des broches du A3PE3000L-FG896 896-ball fbga
Configuration des broches du A3PE3000L-FG896 (boîtier 896-ball fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000L-FG896.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000L-FG896 convient pour 6 applications: Industrial Control and Automation, Portable and Battery-Powered Instrumentation, Secure Single-Chip Logic, Board-Level Glue Logic Consolidation, Medical and Test Equipment, Communications and Networking Line Cards.
Industrial Control and Automation
The A3PE3000L-FG896 suits industrial controllers that need large I/O counts and deterministic, instant-on logic. Its 620 user I/Os in an 896-ball FBGA can absorb PLC I/O expansion, motor-control sequencing, and sensor interfacing that would otherwise require several smaller devices, reducing BOM and board area. Because configuration resides in nonvolatile on-chip flash, the FPGA is active immediately at power-up - important for factory equipment with strict startup sequences. The 1.2 V to 1.5 V core and low static flash power help in sealed enclosures with limited airflow. Designers typically pair the FPGA with an MCU handling communications while the FPGA manages timing-critical I/O.
Recommandé
Portable and Battery-Powered Instrumentation
Battery-powered instruments benefit directly from the ProASIC3L family's low static and dynamic power plus Flash*Freeze technology, which drops power dramatically while retaining SRAM state and I/O context. The A3PE3000L-FG896's 3M gates and 75,264 logic cells provide enough capacity for data acquisition sequencers, display driving, and signal pre-processing in handheld testers and field analyzers. The nonvolatile flash configuration removes the boot-time and board-area cost of external configuration flash. With a 1.2 V to 1.5 V core, the device fits multi-rail battery systems; designers should place the FPGA in Flash*Freeze during idle intervals to extend battery runtime.
Recommandé
Secure Single-Chip Logic
ProASIC3L's nonvolatile flash technology makes the A3PE3000L-FG896 a strong fit for secure, single-chip logic where the bitstream must never appear on a board-level configuration bus, as happens with SRAM FPGAs at every power-up. Applications include secure communications equipment, licensing enforcement logic, and anti-tamper designs. The device is Instant On - active within microseconds of supply ramp - so security functions need not wait for configuration. With 3M gates and 620 I/Os, designers can consolidate security logic, bus bridging, and custom peripherals into one 896-BGA device, shrinking the attack surface relative to multi-chip solutions.
Recommandé
Board-Level Glue Logic Consolidation
The A3PE3000L-FG896 excels at replacing collections of ASSPs, CPLDs, and discrete glue logic across a PCB. Its 620 user I/Os and 896-ball FBGA footprint provide the connectivity to interface memory buses, backplanes, and mixed-voltage peripherals in one reprogrammable device. Reprogrammability allows board spins to be absorbed in firmware rather than PCB rework, cutting total cost of ownership - a headline feature on Microchip's product page. Because configuration is nonvolatile and Instant On, the consolidated logic meets power-up timing without external boot memory. Verify I/O banking and voltage standards in the datasheet when migrating legacy discrete interfaces.
Recommandé
Medical and Test Equipment
Medical diagnostic devices and bench instrumentation need predictable power-up behavior, flexible I/O, and long field life - all ProASIC3L strengths. The A3PE3000L-FG896's 3M gates implement acquisition front-end control, filter engines, and display/communication interfaces, while Flash*Freeze mode keeps standby power low between measurements. Nonvolatile configuration means the instrument is operational the instant power is applied, simplifying self-test sequences. The large FBGA package suits rack and cart-based equipment where board space is less constrained than in wearables. Field upgrades are performed by reprogramming flash in-system, enabling feature updates over service life.
Recommandé
Communications and Networking Line Cards
Line cards and control planes in networking gear use the A3PE3000L-FG896 for bus bridging, LED/status control, hot-swap supervision, and board management. The 620 I/O budget covers wide parallel interfaces to PHYs and switch fabric devices, and the 896-BGA delivers the ball count those interfaces demand. Instant On nonvolatile configuration lets the card signal ready states to the chassis manager before software loads, and reprogrammability supports in-field feature updates. Designers should budget core and I/O rail sequencing with the chassis power-good scheme and use Flash*Freeze during card standby to cut slot power, an increasingly important metric in dense chassis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000L-FG896 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000L-FG896I | A3PE3000L-FG896M | A3PE3000L-1FGG896 | A3PE3000L-1FG896 |
|---|---|---|---|---|---|
| Package | 896-ball FBGA | 896-ball FBGA - same | 896-ball FBGA - same | 896-ball FBGA (FGG) - same footprint | 896-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip (Microsemi legacy) | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V (per FindIC listing) | 1.2 V to 1.5 V |
| Low Power Feature | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash | Flash*Freeze, nonvolatile flash |
Principaux différenciateurs
- Lowest-risk drop-in replacement option (vs A3PE3000L-FG896I)
- Faster timing headroom (vs A3PE3000L-1FGG896)
- Single-chip nonvolatile configuration (vs SRAM-based FPGAs of similar density)
Notes de conception
Budget two power domains: the 1.2 V to 1.5 V core rail and the I/O bank rails. Per the Microchip product page, the ProASIC3L family emphasizes low dynamic and static power, but actual consumption depends heavily on I/O loading and toggle rates. Enter the design into Microchip Libero and run the power calculator early with realistic switching activity, then apply Flash*Freeze mode in idle states to capture the family's headline power savings.
The 896-ball FBGA requires careful fan-out planning. Use a microvia or sequential build-up stackup to escape the ball field, and define via-in-pad with fill for power/ground balls. Follow the Microchip ProASIC3L datasheet (DS50003268) PCB land-pattern and reflow guidance; the datasheet's ball map sections define VCC, GND, and NC ball assignments that govern your power-plane segmentation. Simulate or follow datasheet derating for signal integrity on high-speed I/O banks.
Do not confuse the -FG896 and -FGG896 package suffixes, or commercial vs -I industrial temperature grades, when ordering or cross-referencing: they share the same die and footprint but differ in ordering data and, for speed-grade dashes (-1), timing. Verify the exact suffix against your environmental and timing requirements before substitution, even though these variants are pin-to-pin compatible within the same 896-ball package.
Informations de conformité
Compliance status not stated in the provided verified web data. Consult the Microchip product page or distributor environmental data for current RoHS/REACH declarations.
