A3PE3000L-FGG324 vs A3PE3000L-FG324I Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FGG324 par Microchip Technology et A3PE3000L-FG324I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ ActifMicrochip Technology
A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip
A3PE3000L-FG324I ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FGG324 | A3PE3000L-FG324I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $86,15 | $0,00 |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L (Flash-based FPGA) |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells (CLBs) | 75264 | 75264 |
| User I/O | 221 | 221 |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Tension d'alimentation de fonctionnement | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Boîtier | 324-BGA / FBGA (FGG324) | 324-ball FBGA (FG324), 19x19 mm |
| Style de montage | SMD/SMT | — |
| Température de fonctionnement | 0 C to +70 C (commercial) | -40C to +100C (Industrial, I suffix) |
| Packaging | Tray | — |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (FG package contains lead) |
| Embedded SRAM | — | 516096 bits (up to 144 kbits true dual-port blocks per family) |
| Core Voltage | — | 1.2 V (1.2 V to 1.5 V supported) |
| Process Technology | — | 130 nm CMOS, 7-layer metal (6 copper), flash-based |
| Configuration | — | Nonvolatile flash, Instant On (Level 0 support) |
| Low Power Feature | — | Flash*Freeze technology |
| Max Frequency | — | [DATA_NEEDED: maximum system frequency] |
| JTAG Boundary Scan | — | IEEE 1149.1 |
| Input Option | — | Schmitt Trigger on single-ended inputs |
| Type de montage | — | Surface Mount |
| Lead Free Status | — | Contains Lead |