A3PE3000L-FGG324 vs A3PE3000L-FG324I Comparação
Comparação detalhada lado a lado de A3PE3000L-FGG324 por Microchip Technology e A3PE3000L-FG324I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ AtivoMicrochip Technology
A3PE3000L-FG324I - 3M-Gate Flash FPGA, 221 I/O | Microchip
A3PE3000L-FG324I ✓ AtivoComparação de especificações
| Parâmetro | A3PE3000L-FGG324 | A3PE3000L-FG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $86,15 | $0,00 |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L (Flash-based FPGA) |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells (CLBs) | 75264 | 75264 |
| User I/O | 221 | 221 |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Tensão de alimentação de operação | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Encapsulamento | 324-BGA / FBGA (FGG324) | 324-ball FBGA (FG324), 19x19 mm |
| Estilo de montagem | SMD/SMT | — |
| Temperatura de operação | 0 C to +70 C (commercial) | -40C to +100C (Industrial, I suffix) |
| Packaging | Tray | — |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Non-Compliant (FG package contains lead) |
| Embedded SRAM | — | 516096 bits (up to 144 kbits true dual-port blocks per family) |
| Core Voltage | — | 1.2 V (1.2 V to 1.5 V supported) |
| Process Technology | — | 130 nm CMOS, 7-layer metal (6 copper), flash-based |
| Configuration | — | Nonvolatile flash, Instant On (Level 0 support) |
| Low Power Feature | — | Flash*Freeze technology |
| Max Frequency | — | [DATA_NEEDED: maximum system frequency] |
| JTAG Boundary Scan | — | IEEE 1149.1 |
| Input Option | — | Schmitt Trigger on single-ended inputs |
| Tipo de montagem | — | Surface Mount |
| Lead Free Status | — | Contains Lead |