A3PE3000L-FGG896 vs A3PE3000L-1FGG896 Comparaison
Comparaison détaillée côte à côte de A3PE3000L-FGG896 par Microchip Technology et A3PE3000L-1FGG896 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology
A3PE3000L-FGG896 ✓ ActifMicrochip Technology
A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip
A3PE3000L-1FGG896 ✓ ActifComparaison des spécifications
| Paramètre | A3PE3000L-FGG896 | A3PE3000L-1FGG896 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $55,00 | $255,00 |
| System Gates | 3,000,000 | 3000000 |
| Logic Cells | 75,264 | 75264 |
| Total SRAM | 504 kbits | — |
| User I/Os (FGG896) | 620 | — |
| Boîtier | 896-ball FBGA (FGG896), 1.0 mm pitch | 896-ball FBGA (FGG896), 1.00 mm pitch |
| Type de montage | Surface Mount | Surface Mount |
| Core Supply Voltage | 1.2 V to 1.5 V | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage range] | — |
| Température de fonctionnement | 0 C to +70 C | — |
| Logic Family | CMOS | — |
| Process Technology | 130-nm, 7-layer metal (6 copper), flash-based | 130 nm flash |
| Flash*Freeze Support | Yes | — |
| Live-At-Power-Up | Level 0 support | — |
| Reconfiguration | Reprogrammable (in-system programmable) | — |
| Lead-Free Finish | Yes | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Clock Inputs | [DATA_NEEDED: number of clock conditioning circuits/PLLs] | — |
| Speed Grade | [DATA_NEEDED: speed grade for -FGG896 base part] | -1 |
| Power Consumption | [DATA_NEEDED: typical static/dynamic power] | — |
| Ball Count | 896 | — |
| Family | — | ProASIC3L |
| User I/O | — | 620 |
| Total Bits of RAM | — | [DATA_NEEDED: Total embedded RAM bits] |
| Core Voltage | — | 1.2 V (supports 1.2 V to 1.5 V) |
| I/O Voltage | — | As low as 1.2 V |
| Configuration Memory | — | Nonvolatile flash (single-chip) |
| Special Features | — | Flash*Freeze technology |
| Packaging | — | Tray |
| Terminal Pitch | — | 1.00 mm |
| Technology Base | — | CMOS flash |
| Dynamic Power Reduction vs ProASIC3 | — | Approx. 40% |
| Static Power Reduction vs ProASIC3 | — | Approx. 50% |