A3PE3000L-FGG896 vs A3PE3000L-1FGG896 Comparison

Detailed side-by-side comparison of A3PE3000L-FGG896 by Microchip Technology and A3PE3000L-1FGG896 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
A3PE3000L-FGG896 A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology

A3PE3000L-FGG896 - 3M Gate Flash FPGA | Microchip Technology

A3PE3000L-FGG896 ✓ Active
Microchip Technology
A3PE3000L-1FGG896 A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip

A3PE3000L-1FGG896 - 3M-Gate ProASIC3L Flash FPGA | Microchip

A3PE3000L-1FGG896 ✓ Active

Specification Comparison

Parameter A3PE3000L-FGG896 A3PE3000L-1FGG896
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $55.00 $255.00
System Gates 3,000,000 3000000
Logic Cells 75,264 75264
Total SRAM 504 kbits —
User I/Os (FGG896) 620 —
Package 896-ball FBGA (FGG896), 1.0 mm pitch 896-ball FBGA (FGG896), 1.00 mm pitch
Mounting Type Surface Mount Surface Mount
Core Supply Voltage 1.2 V to 1.5 V —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage range] —
Operating Temperature 0 C to +70 C —
Logic Family CMOS —
Process Technology 130-nm, 7-layer metal (6 copper), flash-based 130 nm flash
Flash*Freeze Support Yes —
Live-At-Power-Up Level 0 support —
Reconfiguration Reprogrammable (in-system programmable) —
Lead-Free Finish Yes —
RoHS Status [DATA_NEEDED: RoHS compliance status] —
Clock Inputs [DATA_NEEDED: number of clock conditioning circuits/PLLs] —
Speed Grade [DATA_NEEDED: speed grade for -FGG896 base part] -1
Power Consumption [DATA_NEEDED: typical static/dynamic power] —
Ball Count 896 —
Family — ProASIC3L
User I/O — 620
Total Bits of RAM — [DATA_NEEDED: Total embedded RAM bits]
Core Voltage — 1.2 V (supports 1.2 V to 1.5 V)
I/O Voltage — As low as 1.2 V
Configuration Memory — Nonvolatile flash (single-chip)
Special Features — Flash*Freeze technology
Packaging — Tray
Terminal Pitch — 1.00 mm
Technology Base — CMOS flash
Dynamic Power Reduction vs ProASIC3 — Approx. 40%
Static Power Reduction vs ProASIC3 — Approx. 50%

Datasheets & Resources

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