A3PE600-FG484M vs A3PE600-FGG484 Comparaison
Comparaison détaillée côte à côte de A3PE600-FG484M par Microchip Technology et A3PE600-FGG484 par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-FG484M ✓ ActifMicrochip Technology
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG484 ✓ ActifComparaison des spécifications
| Paramètre | A3PE600-FG484M | A3PE600-FGG484 |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $68,90 | $53,70 |
| Family | ProASIC3E (Flash-Based FPGA) | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Elements / Cells | 13824 | — |
| CLBs | 13824 | — |
| Maximum User I/O | 270 | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| Maximum System Frequency | 231 MHz | 350 MHz |
| Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage Range | 1.14 V to 1.575 V (nominal 1.5 V) | — |
| Configuration | Live-at-power-up flash fabric, single-chip (no external boot device) | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Boîtier | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm ball pitch | FBGA-484 (PBGA484) |
| Type de montage | Surface Mount | — |
| Packaging | Tray (M suffix) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Green / [DATA_NEEDED: RoHS compliance detail] |
| Distributor Stock Reference | 4480 pieces (Heisener listing) | — |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Logic Cells | — | 13824 |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 270 |
| Supply Voltage (Core) | — | 1.425 V to 1.575 V |
| Process Technology | — | 130 nm CMOS flash |
| Configuration Memory | — | On-chip flash (non-volatile, live at power-up) |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1 mm pitch |
| Terminal Type | — | Ball (BGA) |
| Style de montage | — | Surface Mount |
| Temperature Grading | — | Commercial |
| Number of Pins / Balls | — | 484 |