A3PE600-FG484M vs A3PE600-FGG484 Comparação
Comparação detalhada lado a lado de A3PE600-FG484M por Microchip Technology e A3PE600-FGG484 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Microchip Technology
A3PE600-FG484M - 600K-Gate ProASIC3E Flash FPGA | Microchip
A3PE600-FG484M ✓ AtivoMicrochip Technology
A3PE600-FGG484 - ProASIC3E 600K-Gate Flash FPGA | Microchip
A3PE600-FGG484 ✓ AtivoComparação de especificações
| Parâmetro | A3PE600-FG484M | A3PE600-FGG484 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $68,90 | $53,70 |
| Family | ProASIC3E (Flash-Based FPGA) | ProASIC3E |
| System Gates | 600000 | 600000 |
| Logic Elements / Cells | 13824 | — |
| CLBs | 13824 | — |
| Maximum User I/O | 270 | — |
| Embedded SRAM | 110592 bits (True Dual-Port) | — |
| Maximum System Frequency | 231 MHz | 350 MHz |
| Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Supply Voltage Range | 1.14 V to 1.575 V (nominal 1.5 V) | — |
| Configuration | Live-at-power-up flash fabric, single-chip (no external boot device) | — |
| Temperatura de operação | [DATA_NEEDED: operating temperature range] | — |
| Encapsulamento | 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm ball pitch | FBGA-484 (PBGA484) |
| Tipo de montagem | Surface Mount | — |
| Packaging | Tray (M suffix) | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Green / [DATA_NEEDED: RoHS compliance detail] |
| Distributor Stock Reference | 4480 pieces (Heisener listing) | — |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Logic Cells | — | 13824 |
| Embedded RAM | — | 110592 bits |
| User I/O | — | 270 |
| Supply Voltage (Core) | — | 1.425 V to 1.575 V |
| Process Technology | — | 130 nm CMOS flash |
| Configuration Memory | — | On-chip flash (non-volatile, live at power-up) |
| Package Dimensions | — | 23 x 23 mm, 2.23 mm height, 1 mm pitch |
| Terminal Type | — | Ball (BGA) |
| Estilo de montagem | — | Surface Mount |
| Temperature Grading | — | Commercial |
| Number of Pins / Balls | — | 484 |