ADTF3175 vs ADTF3175D-NXZ Comparaison
Comparaison détaillée côte à côte de ADTF3175 par Analog Devices et ADTF3175D-NXZ par Analog Devices. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Analog Devices
ADTF3175D-NXZ - 1MP ToF Eval Kit w/ ADSD3500 ISP | Analog Devices
ADTF3175D-NXZ ✓ ActifComparaison des spécifications
| Paramètre | ADTF3175 | ADTF3175D-NXZ |
|---|---|---|
| Marque | Analog Devices | Analog Devices |
| Catégorie | Image Sensors | Image Sensors |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $230,00 | $495,00 |
| Product Type | Time-of-Flight (ToF) module | Time-of-Flight (ToF) Evaluation Kit |
| Imager | ADSD3100 CMOS indirect ToF (iToF) | ADSD3100 (CMOS indirect ToF) |
| Résolution | 1024 H x 1024 V (1 megapixel) | 1 megapixel (1024 x 1024) |
| Pixel Size | 3.5 µm x 3.5 µm | — |
| Output Interface | MIPI CSI-2 Tx (4-lane) | — |
| Integrated Components | Lens, optical band-pass filter, IR illuminator, power regulators | — |
| Module Form Factor | 75 mm x 75 mm open frame | — |
| Calibration | Factory calibrated, multi-range + multi-resolution modes | — |
| Packaging Type | Open-frame module (Distance Sensor Module) | — |
| Type de montage | Board mount (open frame) | Bench / lab evaluation board |
| Orderable Part Number | ADTF3175BMLZ | — |
| Statut du cycle de vie | Recommended for new designs | — |
| Matching Evaluation Kit | EVAL-ADTF3175D-NXZ (with ADSD3500 depth ISP) | — |
| Statut RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Manufacturer | Analog Devices Inc. | — |
| Main Module | — | ADTF3175 |
| Depth ISP | — | ADSD3500 |
| ToF Technique | — | Indirect ToF (iToF), continuous-wave modulation |
| Integrated Optics | — | Lens, optical band-pass filter, IR illumination optics |
| Illumination Source | — | Laser diode with integrated driver and photodetector |
| Host Interface | — | Ethernet over USB |
| Host Software | — | Windows host GUI + open-source multi-platform SDK |
| Operating System Support | — | Windows host; ROS / ROS 2 via adi_3dtof_image_stitching package |
| Fonction | — | 3D depth sensing and vision system evaluation |
| Form Factor | — | Complete EVK (PCB + module + cabling) |