ADTF3175 vs ADTF3175D-NXZ Vergleich
Detaillierter Direktvergleich von ADTF3175 von Analog Devices und ADTF3175D-NXZ von Analog Devices. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Analog Devices
ADTF3175D-NXZ - 1MP ToF Eval Kit w/ ADSD3500 ISP | Analog Devices
ADTF3175D-NXZ ✓ AktivSpezifikationsvergleich
| Parameter | ADTF3175 | ADTF3175D-NXZ |
|---|---|---|
| Marke | Analog Devices | Analog Devices |
| Kategorie | Image Sensors | Image Sensors |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $230,00 | $495,00 |
| Product Type | Time-of-Flight (ToF) module | Time-of-Flight (ToF) Evaluation Kit |
| Imager | ADSD3100 CMOS indirect ToF (iToF) | ADSD3100 (CMOS indirect ToF) |
| Auflösung | 1024 H x 1024 V (1 megapixel) | 1 megapixel (1024 x 1024) |
| Pixel Size | 3.5 µm x 3.5 µm | — |
| Output Interface | MIPI CSI-2 Tx (4-lane) | — |
| Integrated Components | Lens, optical band-pass filter, IR illuminator, power regulators | — |
| Module Form Factor | 75 mm x 75 mm open frame | — |
| Calibration | Factory calibrated, multi-range + multi-resolution modes | — |
| Packaging Type | Open-frame module (Distance Sensor Module) | — |
| Montageart | Board mount (open frame) | Bench / lab evaluation board |
| Orderable Part Number | ADTF3175BMLZ | — |
| Lebenszyklusstatus | Recommended for new designs | — |
| Matching Evaluation Kit | EVAL-ADTF3175D-NXZ (with ADSD3500 depth ISP) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: rohs status] |
| Manufacturer | Analog Devices Inc. | — |
| Main Module | — | ADTF3175 |
| Depth ISP | — | ADSD3500 |
| ToF Technique | — | Indirect ToF (iToF), continuous-wave modulation |
| Integrated Optics | — | Lens, optical band-pass filter, IR illumination optics |
| Illumination Source | — | Laser diode with integrated driver and photodetector |
| Host Interface | — | Ethernet over USB |
| Host Software | — | Windows host GUI + open-source multi-platform SDK |
| Operating System Support | — | Windows host; ROS / ROS 2 via adi_3dtof_image_stitching package |
| Funktion | — | 3D depth sensing and vision system evaluation |
| Form Factor | — | Complete EVK (PCB + module + cabling) |