ATSAMB11-XR2100A vs ATSAMB11-XR210PA Comparaison

Comparaison détaillée côte à côte de ATSAMB11-XR2100A par Microchip Technology et ATSAMB11-XR210PA par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

Microchip Technology
ATSAMB11-XR2100A ATSAMB11-XR2100A - BLE 4.1 SiP Module with Cortex-M0 | Microchip

ATSAMB11-XR2100A - BLE 4.1 SiP Module with Cortex-M0 | Microchip

ATSAMB11-XR2100A ✓ Actif
Microchip Technology
ATSAMB11-XR210PA ATSAMB11-XR210PA - Bluetooth SiP Module w/ Antenna | Microchip

ATSAMB11-XR210PA - Bluetooth SiP Module w/ Antenna | Microchip

ATSAMB11-XR210PA ✓ Actif

Comparaison des spécifications

Paramètre ATSAMB11-XR2100A ATSAMB11-XR210PA
Marque Microchip Technology Microchip Technology
Catégorie RF Modules RF Modules
Statut du cycle de vie Actif Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $6,48 $5,85
Module Type Bluetooth Low Energy SiP Module SmartConnect ATSAMB11 SiP Module
Bluetooth Version BLE 4.1 (Bluetooth Smart) —
Frequency Band 2.4 GHz ISM —
Integrated MCU Core Arm Cortex-M0 —
Embedded Flash 256 KB —
Embedded RAM 128 KB —
Integrated Crystal 26 MHz —
Antenna External antenna (chip antenna required) —
Output Power Programmable, up to +4 dBm typical —
Receiver Sensitivity -94 dBm typical (BLE 1 Mbps, per datasheet) —
TX/RX Switch Integrated —
Power Amplifier Integrated —
Power Management Integrated PMU with multiple low-power modes —
Operating Voltage [DATA_NEEDED: VBAT range] [DATA_NEEDED: VDD range]
Température de fonctionnement -40 C to +85 C (industrial) [DATA_NEEDED: temperature range]
Type de montage Surface Mount Surface Mount
Bluetooth Certification Bluetooth SIG qualified stack —
Statut RoHS Compliant ROHS3 Compliant
Product Type — RF System on a Chip / Module (SoC)
Bluetooth Specification — Bluetooth 4.1 Low Energy (BLE)
Operating Frequency — 2.402 GHz to 2.480 GHz (ISM band)
Antenna Configuration — Integrated chip antenna (mounted on top of SiP)
Core Processor — ARM Cortex-M0
Package Type — SiP Module, surface mount
RF Modulation — GFSK
TX Power — [DATA_NEEDED: TX power dBm]
RX Sensitivity — [DATA_NEEDED: RX sensitivity dBm]
Stock Quantity (Full-Electronic) — 4187 units

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