ATSAMB11-XR2100A vs ATSAMB11-XR210PA Vergleich

Detaillierter Direktvergleich von ATSAMB11-XR2100A von Microchip Technology und ATSAMB11-XR210PA von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
ATSAMB11-XR2100A ATSAMB11-XR2100A - BLE 4.1 SiP Module with Cortex-M0 | Microchip

ATSAMB11-XR2100A - BLE 4.1 SiP Module with Cortex-M0 | Microchip

ATSAMB11-XR2100A ✓ Aktiv
Microchip Technology
ATSAMB11-XR210PA ATSAMB11-XR210PA - Bluetooth SiP Module w/ Antenna | Microchip

ATSAMB11-XR210PA - Bluetooth SiP Module w/ Antenna | Microchip

ATSAMB11-XR210PA ✓ Aktiv

Spezifikationsvergleich

Parameter ATSAMB11-XR2100A ATSAMB11-XR210PA
Marke Microchip Technology Microchip Technology
Kategorie RF Modules RF Modules
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $6,48 $5,85
Module Type Bluetooth Low Energy SiP Module SmartConnect ATSAMB11 SiP Module
Bluetooth Version BLE 4.1 (Bluetooth Smart) —
Frequency Band 2.4 GHz ISM —
Integrated MCU Core Arm Cortex-M0 —
Embedded Flash 256 KB —
Embedded RAM 128 KB —
Integrated Crystal 26 MHz —
Antenna External antenna (chip antenna required) —
Output Power Programmable, up to +4 dBm typical —
Receiver Sensitivity -94 dBm typical (BLE 1 Mbps, per datasheet) —
TX/RX Switch Integrated —
Power Amplifier Integrated —
Power Management Integrated PMU with multiple low-power modes —
Operating Voltage [DATA_NEEDED: VBAT range] [DATA_NEEDED: VDD range]
Betriebstemperatur -40 C to +85 C (industrial) [DATA_NEEDED: temperature range]
Montageart Surface Mount Surface Mount
Bluetooth Certification Bluetooth SIG qualified stack —
RoHS-Status Compliant ROHS3 Compliant
Product Type — RF System on a Chip / Module (SoC)
Bluetooth Specification — Bluetooth 4.1 Low Energy (BLE)
Operating Frequency — 2.402 GHz to 2.480 GHz (ISM band)
Antenna Configuration — Integrated chip antenna (mounted on top of SiP)
Core Processor — ARM Cortex-M0
Package Type — SiP Module, surface mount
RF Modulation — GFSK
TX Power — [DATA_NEEDED: TX power dBm]
RX Sensitivity — [DATA_NEEDED: RX sensitivity dBm]
Stock Quantity (Full-Electronic) — 4187 units

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