ATSAME70N21B-CN vs ATSAME70Q19A-CN Comparaison
Comparaison détaillée côte à côte de ATSAME70N21B-CN par Microchip Technology et ATSAME70Q19A-CN par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
ATSAME70N21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
ATSAME70N21B-CN ✓ ActifMicrochip Technology
ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip
ATSAME70Q19A-CN ✓ ActifComparaison des spécifications
| Paramètre | ATSAME70N21B-CN | ATSAME70Q19A-CN |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $12,10 | $6,68 |
| Core Architecture | ARM Cortex-M7 with single/double-precision FPU | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz | 300 MHz |
| CoreMark Performance | 1500 CoreMark | — |
| DMIPS | 600 DMIPS | — |
| Flash Memory | 2 MB (2M x 8), dual-bank | 512 KB |
| SRAM | 384 KB (256 KB SRAM0 with ECC + 128 KB SRAM1) | 256 KB |
| Supply Voltage (VDDIN) | 1.2 V (typ) | — |
| Température de fonctionnement | -40C to +85C (industrial) | -40C to +105C (industrial) |
| Boîtier | 100-ball TFBGA (9x9 mm) | 144-LFBGA (10x10 mm, 0.8 mm pitch) |
| ADC | 1x 12-bit, up to 1.2 Msps | 12-bit, up to 2 Msps |
| DAC | 2x 12-bit, 1 Msps (dual 2-channel) | 12-bit |
| USB | USB 2.0 High-Speed Host/Device with integrated HS PHY | USB 2.0 High-Speed Host + Device with on-chip PHY |
| CAN | 2x CAN-FD controllers | 2x CAN-FD controllers |
| Ethernet | 10/100 Mbps MAC + GMAC (Gigabit) | 10/100 Mbps MAC (GMAC) with 1588 PTP |
| External Bus | 16-bit HSIF (High-Speed Interface) | — |
| Crypto Accelerator | AES, SHA, TRNG | AES, SHA, TRNG hardware blocks |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | Compliant | Compliant |
| Operating Voltage (VDDCORE) | — | 1.2 V (typical) |
| I/O Voltage (VDDIO) | — | 3.3 V (typical) |
| Serial Interfaces | — | 3x FLEXCOM (USART/SPI/TWI), 2x I2S, 2x SPI high-speed |
| DMA Channels | — | 24 (XDMAC) |
| External Bus Interface (EBI) | — | Yes (SDRAM, SRAM, NAND support) |
| Niveau MSL | — | 3 |