ATSAME70N21B-CN vs ATSAME70Q19A-CN Comparación
Comparación detallada lado a lado de ATSAME70N21B-CN por Microchip Technology y ATSAME70Q19A-CN por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
ATSAME70N21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
ATSAME70N21B-CN ✓ ActivoMicrochip Technology
ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip
ATSAME70Q19A-CN ✓ ActivoComparación de especificaciones
| Parámetro | ATSAME70N21B-CN | ATSAME70Q19A-CN |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $12,10 | $6,68 |
| Core Architecture | ARM Cortex-M7 with single/double-precision FPU | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz | 300 MHz |
| CoreMark Performance | 1500 CoreMark | — |
| DMIPS | 600 DMIPS | — |
| Flash Memory | 2 MB (2M x 8), dual-bank | 512 KB |
| SRAM | 384 KB (256 KB SRAM0 with ECC + 128 KB SRAM1) | 256 KB |
| Supply Voltage (VDDIN) | 1.2 V (typ) | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | -40C to +105C (industrial) |
| Encapsulado | 100-ball TFBGA (9x9 mm) | 144-LFBGA (10x10 mm, 0.8 mm pitch) |
| ADC | 1x 12-bit, up to 1.2 Msps | 12-bit, up to 2 Msps |
| DAC | 2x 12-bit, 1 Msps (dual 2-channel) | 12-bit |
| USB | USB 2.0 High-Speed Host/Device with integrated HS PHY | USB 2.0 High-Speed Host + Device with on-chip PHY |
| CAN | 2x CAN-FD controllers | 2x CAN-FD controllers |
| Ethernet | 10/100 Mbps MAC + GMAC (Gigabit) | 10/100 Mbps MAC (GMAC) with 1588 PTP |
| External Bus | 16-bit HSIF (High-Speed Interface) | — |
| Crypto Accelerator | AES, SHA, TRNG | AES, SHA, TRNG hardware blocks |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Operating Voltage (VDDCORE) | — | 1.2 V (typical) |
| I/O Voltage (VDDIO) | — | 3.3 V (typical) |
| Serial Interfaces | — | 3x FLEXCOM (USART/SPI/TWI), 2x I2S, 2x SPI high-speed |
| DMA Channels | — | 24 (XDMAC) |
| External Bus Interface (EBI) | — | Yes (SDRAM, SRAM, NAND support) |
| Nivel MSL | — | 3 |