ATSAME70Q19A-CN vs ATSAME70N21B-CN Comparaison
Comparaison détaillée côte à côte de ATSAME70Q19A-CN par Microchip Technology et ATSAME70N21B-CN par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip
ATSAME70Q19A-CN ✓ ActifMicrochip Technology
ATSAME70N21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
ATSAME70N21B-CN ✓ ActifComparaison des spécifications
| Paramètre | ATSAME70Q19A-CN | ATSAME70N21B-CN |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $6,68 | $12,10 |
| Core Architecture | ARM Cortex-M7 with FPU (single + double precision) | ARM Cortex-M7 with single/double-precision FPU |
| Maximum CPU Clock | 300 MHz | 300 MHz |
| Flash Memory | 512 KB | 2 MB (2M x 8), dual-bank |
| SRAM | 256 KB | 384 KB (256 KB SRAM0 with ECC + 128 KB SRAM1) |
| Operating Voltage (VDDCORE) | 1.2 V (typical) | — |
| I/O Voltage (VDDIO) | 3.3 V (typical) | — |
| Boîtier | 144-LFBGA (10x10 mm, 0.8 mm pitch) | 100-ball TFBGA (9x9 mm) |
| Température de fonctionnement | -40C to +105C (industrial) | -40C to +85C (industrial) |
| ADC | 12-bit, up to 2 Msps | 1x 12-bit, up to 1.2 Msps |
| DAC | 12-bit | 2x 12-bit, 1 Msps (dual 2-channel) |
| USB | USB 2.0 High-Speed Host + Device with on-chip PHY | USB 2.0 High-Speed Host/Device with integrated HS PHY |
| Ethernet | 10/100 Mbps MAC (GMAC) with 1588 PTP | 10/100 Mbps MAC + GMAC (Gigabit) |
| CAN | 2x CAN-FD controllers | 2x CAN-FD controllers |
| Serial Interfaces | 3x FLEXCOM (USART/SPI/TWI), 2x I2S, 2x SPI high-speed | — |
| DMA Channels | 24 (XDMAC) | — |
| Crypto Accelerator | AES, SHA, TRNG hardware blocks | AES, SHA, TRNG |
| External Bus Interface (EBI) | Yes (SDRAM, SRAM, NAND support) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | 3 | — |
| Statut RoHS | Compliant | Compliant |
| CoreMark Performance | — | 1500 CoreMark |
| DMIPS | — | 600 DMIPS |
| Supply Voltage (VDDIN) | — | 1.2 V (typ) |
| External Bus | — | 16-bit HSIF (High-Speed Interface) |