DSP56321VF220 vs DSP56321VL220557 Comparaison
Comparaison détaillée côte à côte de DSP56321VF220 par NXP Semiconductors et DSP56321VL220557 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
DSP56321VF220 - 24-bit DSP, 220MHz/440MMACS | NXP | MAP-BGA-196
DSP56321VF220 ⚠ Dernier achatComparaison des spécifications
| Paramètre | DSP56321VF220 | DSP56321VL220557 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | DSP | DSP |
| Statut du cycle de vie | Dernier achat | Actif |
| Product Type | Fixed-Point Digital Signal Processor (DSP) | Digital Signal Processor (DSP) |
| DSP Core | DSP56300 family | — |
| Data Word Width | 24-bit | 24-bit |
| Core Frequency | 220 MHz | — |
| Peak Throughput | 440 MMACS (Million Multiply-Accumulates per Second) | — |
| On-Chip RAM | 576 kB | — |
| On-Chip ROM | 576 B | — |
| Instruction Cache | 24-bit × 24-bit | — |
| Program RAM | 24-bit × 24-bit | — |
| DMA Channels | 6 (Six Channel DMA Unit) | 4 independent channels |
| Integrated Coprocessor | Enhanced Filter Coprocessor (EFCOP) | — |
| I/O Voltage | 3.30 V | — |
| Interfaces | Host Interface, SSI, SCI | — |
| Boîtier | 196-MAPBGA (15 mm × 15 mm × 1.18 mm, 1 mm pitch) | MAPBGA-196 (15x15 mm) |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Architecture | — | 24-bit fixed-point DSP56300 family |
| Core Clock Frequency | — | 220 MHz |
| Instruction Cycle Time | — | 15 ns |
| Accumulator Width | — | 56-bit |
| On-chip Memory | — | Program ROM/RAM and Data RAM (see datasheet) |
| DMA Controller | — | Yes |
| External Memory Interface | — | Yes (SRAM / DRAM expansion) |
| Enhanced Filter Co-Processor | — | EFCOP for sample-rate conversion |
| Host Interface | — | Asynchronous serial / parallel ports |
| Serial Audio Interface | — | Yes (ESSI / SCI) |
| Timers | — | Triple timer module |
| Plage de température de fonctionnement | — | -40C to +85C (industrial) |
| I/O Logic Level | — | TTL-compatible |
| Process Technology | — | High-density CMOS |
| Statut RoHS | — | Compliant |