EP1SGX40DF1020I6N vs EP1SGX40DF1020C6N Comparaison
Comparaison détaillée côte à côte de EP1SGX40DF1020I6N par Intel et EP1SGX40DF1020C6N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP1SGX40DF1020I6N | EP1SGX40DF1020C6N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1 450,00 | $142,00 |
| Series | Stratix GX | — |
| Family | Stratix (First Generation) | Stratix GX |
| Manufacturer | Intel (formerly Altera) | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Number of Logic Elements (LEs) | 41,250 | — |
| Number of LABs (Logic Array Blocks) | 4,125 | — |
| Total RAM Bits | 3,423,744 | 3,423,744 |
| Maximum User I/O Pins | 624 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| High-Speed Transceivers | Integrated GX SerDes (channels, data rate: [DATA_NEEDED: per Stratix GX handbook]) | — |
| Embedded DSP Blocks | Yes (DSP block count: [DATA_NEEDED: per device datasheet]) | — |
| Boîtier / Format | 1020-BBGA / 1020-FBGA | — |
| Package Size | 33 x 33 mm, 1.0 mm pitch | — |
| Supplier Device Package | 1020-FBGA (33 x 33) | — |
| Température de fonctionnement | 0 C to 85 C (industrial grade 'I') | 0 C to 85 C |
| Speed Grade | 6 (I6) | C6 |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Statut RoHS | [DATA_NEEDED: confirm RoHS on datasheet] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based configuration) | CMOS |
| Packaging | Tray / Bulk | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) | — |
| Logic Elements | — | 41,250 |
| Number of LABs/CLBs | — | 4125 LABs / 4697 CLBs |
| Number of I/O | — | 624 |
| Process Technology | — | 130 nm CMOS |
| Maximum Internal Frequency | — | 5000 MHz |
| Package Type | — | 1020-FBGA (33 x 33 mm, 1 mm pitch) |