EP1SGX40DF1020I6N vs EP1SGX40DF1020C6N Comparação
Comparação detalhada lado a lado de EP1SGX40DF1020I6N por Intel e EP1SGX40DF1020C6N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | EP1SGX40DF1020I6N | EP1SGX40DF1020C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoria | FPGA & CPLD | FPGA & CPLD |
| Status do ciclo de vida | Ativo | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1.450,00 | $142,00 |
| Series | Stratix GX | — |
| Family | Stratix (First Generation) | Stratix GX |
| Manufacturer | Intel (formerly Altera) | — |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.5 V |
| Number of Logic Elements (LEs) | 41,250 | — |
| Number of LABs (Logic Array Blocks) | 4,125 | — |
| Total RAM Bits | 3,423,744 | 3,423,744 |
| Maximum User I/O Pins | 624 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| High-Speed Transceivers | Integrated GX SerDes (channels, data rate: [DATA_NEEDED: per Stratix GX handbook]) | — |
| Embedded DSP Blocks | Yes (DSP block count: [DATA_NEEDED: per device datasheet]) | — |
| Encapsulamento / Caixa | 1020-BBGA / 1020-FBGA | — |
| Package Size | 33 x 33 mm, 1.0 mm pitch | — |
| Supplier Device Package | 1020-FBGA (33 x 33) | — |
| Temperatura de operação | 0 C to 85 C (industrial grade 'I') | 0 C to 85 C |
| Speed Grade | 6 (I6) | C6 |
| Tipo de montagem | Surface Mount (BGA) | Surface Mount |
| Nível MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Status RoHS | [DATA_NEEDED: confirm RoHS on datasheet] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based configuration) | CMOS |
| Packaging | Tray / Bulk | — |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG (per Stratix GX handbook) | — |
| Logic Elements | — | 41,250 |
| Number of LABs/CLBs | — | 4125 LABs / 4697 CLBs |
| Number of I/O | — | 624 |
| Process Technology | — | 130 nm CMOS |
| Maximum Internal Frequency | — | 5000 MHz |
| Package Type | — | 1020-FBGA (33 x 33 mm, 1 mm pitch) |