EP20K200EQC208-3 vs EP20K200EBC652-3N Comparaison
Comparaison détaillée côte à côte de EP20K200EQC208-3 par Intel et EP20K200EBC652-3N par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K200EQC208-3 | EP20K200EBC652-3N |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $65,00 | $220,00 |
| Family | APEX 20KE | — |
| Series | APEX 20K (enhanced "E" variant) | APEX 20KE (APEX-20KE®) |
| Product Type | FPGA (Field Programmable Gate Array), SRAM-based, in-system programmable | — |
| System Gates (typical) | 200,000 | — |
| Logic Elements (LEs) | 8,320 | — |
| Embedded RAM Bits | 106,496 | — |
| Maximum User I/O | 136 | — |
| Speed Grade | -3 | -3 (slowest in APEX 20KE family) |
| Core Supply Voltage (VCCINT) | 2.5 V (typical, APEX 20KE generation) | — |
| I/O Supply Voltage (VCCIO) | MultiVolt, 1.8 V / 2.5 V / 3.3 V / 5 V compatible | — |
| Boîtier | 208-BFQFP / PQFP208 (Plastic Quad Flat Pack, gull-wing) | 652-ball BGA |
| Terminal Pitch | 0.5 mm | — |
| Type de montage | Surface Mount | Surface Mount |
| Technology | CMOS, SRAM configuration cell | — |
| Configuration Mode | Fast Passive Parallel (FPP), Passive Serial (PS), JTAG (IEEE 1149.1) | — |
| Embedded Array Blocks (EABs) | Yes (dual-port RAM/ROM, up to 16-bit wide) | — |
| MultiVolt I/O Support | Yes | — |
| LVDS Support | True-LVDS (enhanced "E" variant feature) | — |
| Niveau de sensibilité à l'humidité (MSL) | 3 (168 Hours) | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Operating Temperature (Commercial) | 0 °C to 85 °C | — |
| Device Family | — | EP20K200 |
| System Gates | — | 200,000 |
| Logic Elements / Cells | — | 8,320 |
| Logic Array Blocks (LABs) | — | 832 |
| Macrocells | — | 832 |
| Embedded RAM | — | 106,496 bits |
| User I/Os (DigiKey listing) | — | 376 |
| User I/Os (digchip listing) | — | 277 |
| Propagation Delay | — | 2.33 ns |
| Internal Frequency (max) | — | 189 MHz |
| Process Technology | — | 0.22 µm CMOS |
| Core Supply Voltage | — | 1.71 V to 1.89 V (nominal 1.8 V) |
| I/O Supply (LVDS-capable) | — | LVDS, 2.5 V referenced (per source variant) |
| Operating Temperature (TJ) | — | 0 °C to 85 °C (commercial) |
| Configuration | — | JTAG (IEEE 1149.1), Passive Serial |