EP20K400FI672-3V vs EP20K400FI672-3 Comparaison
Comparaison détaillée côte à côte de EP20K400FI672-3V par Intel et EP20K400FI672-3 par Altera. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP20K400FI672-3V | EP20K400FI672-3 |
|---|---|---|
| Marque | Intel | Altera |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $285,00 | $195,00 |
| Family | APEX 20K (EP20K400) | APEX 20K |
| Logic Elements | 16,640 | 16640 |
| Maximum Gates | 400,000 | — |
| Typical Gates | [DATA_NEEDED: typical gates value] | — |
| Embedded Memory (bits) | 212,992 | — |
| Maximum User I/O | 502 | 502 |
| Dedicated Inputs | 6 | 6 |
| Total User I/O + Dedicated Inputs | 496 + 6 (variant dependent) | — |
| Fréquence d'horloge maximale | 714.2 MHz | 833 MHz |
| Speed Grade | -3 (faster) | — |
| Core Voltage (VCCINT) | 2.5 V nominal (2.375 V to 2.625 V) | — |
| Process Technology | 0.18 µm CMOS, 4 metal layers | CMOS |
| Boîtier | 672-ball FineLine BGA (BBGA), 1.0 mm pitch | — |
| Type de montage | Surface Mount | Surface Mount |
| Programmable via JTAG | Yes (IEEE 1149.1) | — |
| Supported I/O Standards | LVCMOS, LVTTL, SSTL, GTL+, HSTL | — |
| Configuration Modes | JTAG, passive serial, passive parallel | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| Température de fonctionnement | -40 °C to +85 °C (industrial) | [DATA_NEEDED: operating temperature range] |
| Niveau MSL | [DATA_NEEDED: MSL rating] | 3 |
| Series | — | EP20K400 |
| Total Gates | — | up to 400000 |
| Embedded RAM | — | 212992 bits |
| Propagation Delay | — | 3.6 ns |
| Supply Voltage (Nominal) | — | 2.5 V |
| Supply Voltage Range | — | 2.375 V to 2.625 V |
| Package Type | — | PBGA (Plastic BGA) |
| Package Code | — | S-PBGA-B672 |
| Terminal Count | — | 672 |
| Terminal Pitch | — | 1.000 mm |
| Package Shape | — | Square BGA |
| Configuration Interface | — | JTAG (IEEE 1149.1) |
| Peak Reflow Temperature | — | 220 C |